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Introduction to Heat Transfer
6th Edition
ISBN: 9780470501962
Author: Frank P. Incropera, David P. DeWitt, Theodore L. Bergman, Adrienne S. Lavine
Publisher: Wiley, John & Sons, Incorporated
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Chapter 3, Problem 3.50P
(a)
To determine
Heat gain per unit tube length
(b)
To determine
Heat gain per unit tube length after applying
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Heat transfer
The rate at which energy must be dissipated away from single integrated circuits (computer chips) continues to increase as transitors
continue to shrink in size and more and more computations are being completed in smaller and smaller volumes. The maximum chip
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energy away from a new chip, it is proposed to add a 5 x 5 array of copper pin fins to the chip. Each fin will be individually joined to the
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length is Lf = 15 mm. The chip is square, with a side length of W= 15 mm. It is so thin that it can be treated as having a single
temperature. A dielectric liquid flows over the outer surface of the chip and around the fins, with a temperature of T»,f= 20 °C and a
convection coefficient of hf = 1150 W/m²-K. The chip is joined to…
Chapter 3 Solutions
Introduction to Heat Transfer
Ch. 3 - Consider the plane wall of Figure 3.1, separating...Ch. 3 - A new building to be located in a cold climate is...Ch. 3 - The rear window of an automobile is defogged by...Ch. 3 - The rear window of an automobile is defogged by...Ch. 3 - A dormitory at a large university, built 50 years...Ch. 3 - In a manufacturing process, a transparent film is...Ch. 3 - Prob. 3.7PCh. 3 - A t=10-mm-thick horizontal layer of water has a...Ch. 3 - Prob. 3.9PCh. 3 - The wind chill, which is experienced on a cold,...
Ch. 3 - Prob. 3.11PCh. 3 - A thermopane window consists of two pieces of...Ch. 3 - A house has a composite wall of wood, fiberglass...Ch. 3 - Prob. 3.14PCh. 3 - Prob. 3.15PCh. 3 - Work Problem 3.15 assuming surfaces parallel to...Ch. 3 - Consider the oven of Problem 1.54. 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