Fundamentals of Heat and Mass Transfer
7th Edition
ISBN: 9780470917855
Author: Bergman, Theodore L./
Publisher: John Wiley & Sons Inc
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Textbook Question
Chapter 9, Problem 9.24P
Consider the conveyor system described in Problem 7.24, but under conditions for which the conveyor is not moving and the air is quiescent. Radiation effects and interactions between boundary layers on adjoining surfaces may be neglected.
(a) For the prescribed plate dimensions and initial temperature, as well as the prescribed air temperature, what is the initial rate of heat transfer from one of the plates?
(b) How long does it take for a plate to cool from 300°C to 100°C? Comment on the assumption of negligible radiation.
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Chips of width L _ 15 mm on a side are mounted to a substrate that is installed in an enclosurewhose walls and air are maintained at a temperature of Tsur=T∞=25oC. The chips have an emissivity ofε=0.60 and a maximum allowable temperature of Ts=85oC.(a) If heat is rejected from the chips by radiation and natural convection, what is the maximum operatingpower of each chip? The convection coefficient may be approximated as h=11.7 W/m2K.(b) If a fan is used to maintain airflow through the enclosure and heat transfer is by only forcedconvection, with h=250 W/m2K, what is the maximum operating power?
At the end of its manufacturing
process, a silicon wafer of diameter d=
258 mm , thickness & =1 mm is at an
initial temperature of 325 C and is
allowed to cool in quiescent, ambient
air and large surroundings for which
T =T= 25 C, What is the initial rate
of cooling by convection (kJ/s) from
the Lower surface ONLY (Watts)?
3
Silicon :p= 2330 kg/m , c̟
= 813
J/kg K, k = 87.8 W/m · K.
-6
Air: v
= 32.15×10 m /s, k = 0.0372
W/m· K, a = 46.8 ×10
0.686,
m /s, Pr =
Quiescent air
T
Tsur
Silicon wafer
D, 8, e, T
Select one:
Calculate the Nusselt numbers for the following:
Chapter 9 Solutions
Fundamentals of Heat and Mass Transfer
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