Fundamentals of Heat and Mass Transfer
Fundamentals of Heat and Mass Transfer
7th Edition
ISBN: 9780470917855
Author: Bergman, Theodore L./
Publisher: John Wiley & Sons Inc
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Chapter 4, Problem 4.80P

A simplified representation for cooling in very large-scale integration (VLSI) of microelectronics is shown in the sketch. A silicon chip is mounted in a dielectric substrate, and one surface of the system is convectively cooled, while the remaining surfaces are well insulated from the surroundings. The problem is rendered two-dimensional by the system to be very long in the direction perpendicular to the paper. Under steady-state operation, electric power dissipation in the chip provides for uniform volumetric heating at a rate of q . . However, the heating rate is limited by restrictions on the maximum temperature that the chip is allowed to achieve.
Chapter 4, Problem 4.80P, A simplified representation for cooling in very large-scale integration (VLSI) of microelectronics
For the conditions shown on the sketch, will the maximum temperature in the chip exceed 85°C, the maximum allowable operating temperature set by industry standards? A grid spacing of 3 mm is suggested.

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Consider the square channel shown in the sketch operating under steady state condition. The inner surface of the channel is at a uniform temperature of 600 K and the outer surface is at a uniform temperature of 300 K. From a symmetrical elemental of the channel, a two-dimensional grid has been constructed as in the right figure below. The points are spaced by equal distance. Tout = 300 K k = 1 W/m-K T = 600 K (a) The heat transfer from inside to outside is only by conduction across the channel wall. Beginning with properly defined control volumes, derive the finite difference equations for locations 123. You can also use (n, m) to represent row and column. For example, location Dis (3, 3), location is (3,1), and location 3 is (3,5). (hint: I have already put a control volume around this locations with dashed boarder.) (b) Please use excel to construct the tables of temperatures and finite difference. Solve for the temperatures of each locations. Print out the tables in the spread…
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Chapter 4 Solutions

Fundamentals of Heat and Mass Transfer

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