Introduction to Heat Transfer
6th Edition
ISBN: 9780470501962
Author: Frank P. Incropera, David P. DeWitt, Theodore L. Bergman, Adrienne S. Lavine
Publisher: Wiley, John & Sons, Incorporated
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Chapter 4, Problem 4.60P
To determine
Heat transfer in tube.
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Chapter 4 Solutions
Introduction to Heat Transfer
Ch. 4 - In the method of separation of variables (Section...Ch. 4 - A two-dimensional rectangular plate is subjected...Ch. 4 - Consider the two-dimensional rectangular plate...Ch. 4 - A two-dimensional rectangular plate is subjected...Ch. 4 - Prob. 4.5PCh. 4 - Prob. 4.6PCh. 4 - Free convection heat transfer is sometimes...Ch. 4 - Prob. 4.8PCh. 4 - Radioactive wastes are temporarily stored in a...Ch. 4 - Based on the dimensionless conduction heat rates...
Ch. 4 - Prob. 4.11PCh. 4 - A two-dimensional object is subjected to...Ch. 4 - Prob. 4.13PCh. 4 - Two parallel pipelines spaced 0.5 m apart are...Ch. 4 - A small water droplet of diameter D=100m and...Ch. 4 - Prob. 4.16PCh. 4 - Pressurized steam at 450 K flows through a long,...Ch. 4 - Prob. 4.19PCh. 4 - A furnace of cubical shape, with external...Ch. 4 - Prob. 4.21PCh. 4 - Prob. 4.22PCh. 4 - A pipeline, used for the transport of crude oil,...Ch. 4 - A long power transmission cable is buried at a...Ch. 4 - Prob. 4.25PCh. 4 - A cubical glass melting furnace has exterior...Ch. 4 - Prob. 4.27PCh. 4 - An aluminum heat sink k=240W/mK, used to coolan...Ch. 4 - Hot water is transported from a cogeneration power...Ch. 4 - Prob. 4.30PCh. 4 - Prob. 4.31PCh. 4 - Prob. 4.32PCh. 4 - An igloo is built in the shape of a hemisphere,...Ch. 4 - Consider the thin integrated circuit (chip) of...Ch. 4 - Prob. 4.35PCh. 4 - The elemental unit of an air heater consists of a...Ch. 4 - Prob. 4.37PCh. 4 - Prob. 4.38PCh. 4 - Prob. 4.39PCh. 4 - Prob. 4.40PCh. 4 - Prob. 4.41PCh. 4 - Determine expressions for...Ch. 4 - Prob. 4.43PCh. 4 - Prob. 4.44PCh. 4 - Prob. 4.45PCh. 4 - Derive the nodal finite-difference equations for...Ch. 4 - Prob. 4.47PCh. 4 - Prob. 4.48PCh. 4 - Consider a one-dimensional fin of uniform...Ch. 4 - Prob. 4.50PCh. 4 - Prob. 4.52PCh. 4 - Prob. 4.53PCh. 4 - Prob. 4.54PCh. 4 - Prob. 4.55PCh. 4 - Prob. 4.56PCh. 4 - Steady-state temperatures at selected nodal points...Ch. 4 - Prob. 4.58PCh. 4 - Prob. 4.60PCh. 4 - The steady-state temperatures C associated with...Ch. 4 - A steady-state, finite-difference analysis has...Ch. 4 - Prob. 4.64PCh. 4 - Consider a long bar of square cross section (0.8 m...Ch. 4 - Prob. 4.66PCh. 4 - Prob. 4.67PCh. 4 - Prob. 4.68PCh. 4 - Prob. 4.69PCh. 4 - Consider Problem 4.69. An engineer desires to...Ch. 4 - Consider using the experimental methodology of...Ch. 4 - Prob. 4.72PCh. 4 - Prob. 4.73PCh. 4 - Prob. 4.74PCh. 4 - Prob. 4.75PCh. 4 - Prob. 4.76PCh. 4 - Prob. 4.77PCh. 4 - Prob. 4.78PCh. 4 - Prob. 4.79PCh. 4 - Prob. 4.80PCh. 4 - Spheres A and B arc initially at 800 K, and they...Ch. 4 - Spheres of 40-mm diameter heated to a uniform...Ch. 4 - To determine which parts of a spiders brain are...Ch. 4 - Prob. 4.84P
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- question is imagearrow_forwardA square silicon chip 7 mm x 7 mm in size and 0.5-mm thick is mounted on a plastic substrate as shown in the sketch below. The top surface of the chip is cooled by a synthetic liquid flowing over it. Electronic circuits on the bottom of the chip generate heat at a rate of 5 W that must be transferred through the chip. Estimate the steady-state between the front and back surfaces of the temperature difference chip. The thermal conductivity of silicon is W 150 mK Silicon chip Synthetic liquid Substratearrow_forward3.10 A spherical shell satellite (3-m-OD, 1.25-cm-thick stainless steel walls) re-enters the atmosphere from outer space. If its original temperature is 38°C, the effective average temperature of the atmosphere is 1093°C, and the effective heat transfer coefficient is , estimate the temperature of the shell after reentry, assuming the time of reentry is 10 min and the interior of the shell is evacuated.arrow_forward
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- An underwater sonar that maps the ocean bathymetry is encapsulated in a sphere with a diameter of 85 mm. During operation, the sonar generates heat at a rate of 300W. What is the sonar surface temperature when it’s located in a water column where the temperature is 15o C and the water current is 1 m/sec? The sonar was pulled out of the water without turning it off, thus, it was still working. The air temperature was 15o C and the air speed was 3 m/sec. What was the sonar surface temperature? Was there any reason for concern?arrow_forwardA thin, disk-shaped silicon water of diameter 20cm on a production line must be maintained at a temperature of 100 degree celcius. The wafer loses heat to the room byconvection and radation from its upper surface, while heat is supplied at a constant flux from below. The surrounding air is at 20 degree C while all surrounding surfaces can be approximated to be isothermal at a temperature of 15 degree C. The wafer to air heat transfer coefficient is 30W/m^2-K and the emisivity of the wafer’s surface (approximate as graybodies) is 0.85. How much heat must be applied to the wafer at the unit of W?arrow_forwardREFERENCE: FROM BOOK - ENGINEERING THERMOFLUIDS, M. MASSOUDarrow_forward
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