A t = 5-mm -thick sheet of anodized aluminum is used to reject heat in a space power application. The edge of the sheet is attached to a hot source, and the sheet is maintained at nearly isothermal conditions at T = 300 K . The sheet is not subjected to irradiation. (a) Determine the ne radiation heat transfer from both sides of the 200 mm × 200 mm sheet to deep space. (b) An engineer suggests boring 3-mm-diameter holes through the sheet. The holes are spaced 5 mm apart. The interior surfaces of the holes are anodized after they are bored. Determine the net radiation heat transfer from both sides of the sheet to deep space. (c) As an alternative design, the 3-mm-diameter flat-bottomed holes are not bored completely through the sheet but are bored to depths of 2 mm on each side, leaving a 1-mm-thick web of aluminum separating the bottoms of the holes located on opposite sides of the sheet. Determine the net radiation heat transfer from both sides of the sheet to deep space. (d) Compare the ratio of the net radiation heat transfer to the mass of the sheet for the three designs.
A t = 5-mm -thick sheet of anodized aluminum is used to reject heat in a space power application. The edge of the sheet is attached to a hot source, and the sheet is maintained at nearly isothermal conditions at T = 300 K . The sheet is not subjected to irradiation. (a) Determine the ne radiation heat transfer from both sides of the 200 mm × 200 mm sheet to deep space. (b) An engineer suggests boring 3-mm-diameter holes through the sheet. The holes are spaced 5 mm apart. The interior surfaces of the holes are anodized after they are bored. Determine the net radiation heat transfer from both sides of the sheet to deep space. (c) As an alternative design, the 3-mm-diameter flat-bottomed holes are not bored completely through the sheet but are bored to depths of 2 mm on each side, leaving a 1-mm-thick web of aluminum separating the bottoms of the holes located on opposite sides of the sheet. Determine the net radiation heat transfer from both sides of the sheet to deep space. (d) Compare the ratio of the net radiation heat transfer to the mass of the sheet for the three designs.
Solution Summary: The author analyzes the net radiation heat transfer from both sides of the 200mmtimes sheet to deep space. The emissivity of anodized aluminum is eps
A
t
=
5-mm
-thick sheet of anodized aluminum is used to reject heat in a space power application. The edge of the sheet is attached to a hot source, and the sheet is maintained at nearly isothermal conditions at
T
=
300
K
. The sheet is not subjected to irradiation. (a) Determine the ne radiation heat transfer from both sides of the
200
mm
×
200
mm
sheet to deep space. (b) An engineer suggests boring 3-mm-diameter holes through the sheet. The holes are spaced 5 mm apart. The interior surfaces of the holes are anodized after they are bored. Determine the net radiation heat transfer from both sides of the sheet to deep space. (c) As an alternative design, the 3-mm-diameter flat-bottomed holes are not bored completely through the sheet but are bored to depths of 2 mm on each side, leaving a 1-mm-thick web of aluminum separating the bottoms of the holes located on opposite sides of the sheet. Determine the net radiation heat transfer from both sides of the sheet to deep space. (d) Compare the ratio of the net radiation heat transfer to the mass of the sheet for the three designs.
A thin, disk-shaped silicon wafer of diameter D=20 cm on a production line must be maintained at a temperature of 100 deg C. The wafer loses heat to the room by convection and radiation from its upper surface, while heat is supplied at a constant flux from below. The surrounding air is at 20 deg C, while all surrounding surfaces (which can be treated as blackbodies) can be approximated to be isothermal at a temperature of 15 deg C. The wafer-to-air heat transfer coefficient is 30 W/m2-K and the emissivity of the wafer’s surface (which can be approximated to be gray) is 0.85. How much heat (in W) must be supplied to the wafer?
Consider a silicon wafer positioned in a furnace that is zone-heated on the top section and cooled on the lower section. The wafer is
placed such that the top and bottom surfaces of the wafer exchange radiation with the hot and cold zones respectively of the furnace.
The zone temperatures are Tsur.h = 900 K and Tsur.c = 330 K. The emissivity and thickness of the wafer are ɛ = 0.65 and d = 0.78
mm, respectively. With the ambient gas at T, = 700 K, convection heat transfer coefficients at the upper and lower surfaces of the
wafer are 8 and 4 W/m2-K. Find the steady-state temperature of the wafer, in K.
Tw
i
K
An uninsulated steam pipe passes through a room in which the air and walls are at 25°C. The tube's outer diameter is 70 mm and its surface temperature and emissivity are 200°C and 0.8, respectively. Determine the surface emissive power and the irradiation. If the coefficient associated with the natural convection of surface heat transfer to air is 15 W/m².K, what will be the heat transfer rate per unit length of pipe?
Need a deep-dive on the concept behind this application? Look no further. Learn more about this topic, mechanical-engineering and related others by exploring similar questions and additional content below.