41 through 52 GO 43, 51 SSM 47, 51 Reflection by thin layers . In Fig. 35-42, light is incident perpendicularly on a thin layer of material 2 that lies between (thicker) materials 1 and 3. (The rays are tilted only for clarity.) The waves of rays r 1 and r 2 interfere, and here we consider the type of interference to be either maximum (max) or minimum (min). For this situation, each problem in Table 35-2 refers to the indexes of refraction n 1 , n 2 , and n 3 , the type of interference, the thin-layer thickness L in nanometers, and the wavelength λ in nanometers of the light as measured in air. Where λ is missing, give the wavelength that is in the visible range. Where L is missing, give the second least thickness or the third least thickness as indicated. Figure 35-42 Problems 41 through 52 Table 35-2 Problems 41 through 52: Reflection by Thin Layers. See the setup for these problems. n 1 n 2 n 3 Type L λ 41 1.68 1.59 1.50 min 2nd 342
41 through 52 GO 43, 51 SSM 47, 51 Reflection by thin layers . In Fig. 35-42, light is incident perpendicularly on a thin layer of material 2 that lies between (thicker) materials 1 and 3. (The rays are tilted only for clarity.) The waves of rays r 1 and r 2 interfere, and here we consider the type of interference to be either maximum (max) or minimum (min). For this situation, each problem in Table 35-2 refers to the indexes of refraction n 1 , n 2 , and n 3 , the type of interference, the thin-layer thickness L in nanometers, and the wavelength λ in nanometers of the light as measured in air. Where λ is missing, give the wavelength that is in the visible range. Where L is missing, give the second least thickness or the third least thickness as indicated. Figure 35-42 Problems 41 through 52 Table 35-2 Problems 41 through 52: Reflection by Thin Layers. See the setup for these problems. n 1 n 2 n 3 Type L λ 41 1.68 1.59 1.50 min 2nd 342
41 through 52 GO 43, 51 SSM 47, 51 Reflection by thin layers. In Fig. 35-42, light is incident perpendicularly on a thin layer of material 2 that lies between (thicker) materials 1 and 3. (The rays are tilted only for clarity.) The waves of rays r1 and r2 interfere, and here we consider the type of interference to be either maximum (max) or minimum (min). For this situation, each problem in Table 35-2 refers to the indexes of refraction n1, n2, and n3, the type of interference, the thin-layer thickness L in nanometers, and the wavelength λ in nanometers of the light as measured in air. Where λ is missing, give the wavelength that is in the visible range. Where L is missing, give the second least thickness or the third least thickness as indicated.
Figure 35-42 Problems 41 through 52
Table 35-2 Problems 41 through 52: Reflection by Thin Layers. See the setup for these problems.
How can you tell which vowel is being produced here ( “ee,” “ah,” or “oo”)? Also, how would you be able to tell for the other vowels?
You want to fabricate a soft microfluidic chip like the one below. How would you go about
fabricating this chip knowing that you are targeting a channel with a square cross-sectional
profile of 200 μm by 200 μm. What materials and steps would you use and why? Disregard the
process to form the inlet and outlet.
Square Cross Section
1. What are the key steps involved in the fabrication of a semiconductor device.
2. You are hired by a chip manufacturing company, and you are asked to prepare a silicon wafer
with the pattern below. Describe the process you would use.
High Aspect
Ratio
Trenches
Undoped Si Wafer
P-doped Si
3. You would like to deposit material within a high aspect ratio trench. What approach would you
use and why?
4. A person is setting up a small clean room space to carry out an outreach activity to educate high
school students about patterning using photolithography. They obtained a positive photoresist, a
used spin coater, a high energy light lamp for exposure and ordered a plastic transparency mask
with a pattern on it to reduce cost. Upon trying this set up multiple times they find that the full
resist gets developed, and they are unable to transfer the pattern onto the resist. Help them
troubleshoot and find out why pattern of transfer has not been successful.
5. You are given a composite…
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