DeGarmo's Materials and Processes in Manufacturing
12th Edition
ISBN: 9781118987674
Author: J. T. Black, Ronald A. Kohser
Publisher: WILEY
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Chapter 29, Problem 41RQ
Which type of non-lithographic micromachining process is capable of producing features down to IO nm in size?
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Assume a Space Launch System (Figure 1(a)) that is approximated as a cantilever undamped single degree of freedom (SDOF) system with a mass at its free end (Figure 1(b)). The cantilever is assumed to be massless. Assume a wind load that is approximated with a concentrated harmonic forcing function p(t) = posin(ωt) acting on the mass. The known properties of the SDOF and the applied forcing function are given below. • Mass of SDOF: m =120 kip/g • Acceleration of gravity: g = 386 in/sec2 • Bending sectional stiffness of SDOF: EI = 1015 lbf×in2 • Height of SDOF: h = 2000 inches • Amplitude of forcing function: po = 6 kip • Forcing frequency: f = 8 Hz Figure 1: Single-degree-of-freedom system in Problem 1. Please compute the following considering the steady-state response of the SDOF system. Do not consider the transient response unless it is explicitly stated in the question. (a) The natural circular frequency and the natural period of the SDOF. (10 points) (b) The maximum displacement of…
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Chapter 29 Solutions
DeGarmo's Materials and Processes in Manufacturing
Ch. 29 - Over the latter half of the 20th century, what...Ch. 29 - What was the major motivation for developing...Ch. 29 - Prob. 3RQCh. 29 - What is an example of a device feature that is...Ch. 29 - What type of manufacturing technology dominates...Ch. 29 - Name the four categories of miniature systems...Ch. 29 - Give two differences between lab-on-a-chip and...Ch. 29 - What is a scaling law?Ch. 29 - As the primary dimensions of an object decrease,...Ch. 29 - In the design of a water heater, the mean time...
Ch. 29 - Prob. 11RQCh. 29 - Name two conventional manufacturing processes that...Ch. 29 - Prob. 13RQCh. 29 - Why does breadth of scale of a product have an...Ch. 29 - What is the most complicated, expensive, and...Ch. 29 - Name three purposes that a resist mask can play.Ch. 29 - Name four key lithography methods.Ch. 29 - Name two through-mask lithography techniques.Ch. 29 - Name two direct-write lithography techniques.Ch. 29 - List the sequence of steps involved in...Ch. 29 - Of the two major classifications of photoresists,...Ch. 29 - List four requirements of a photoresist.Ch. 29 - What limits the resolution of a photoresist?Ch. 29 - What is meant by resist sensitivity?Ch. 29 - What is one requirement that contributes to the...Ch. 29 - List the three types of exposure methods used in...Ch. 29 - Why is projection printing equipment called a...Ch. 29 - What are typical materials etched during...Ch. 29 - What is etch bias?Ch. 29 - Prob. 30RQCh. 29 - What are some possible defects that can result...Ch. 29 - What are some possible defects that can result...Ch. 29 - List and describe two properties of etchants.Ch. 29 - What is etch anisotropy dependent upon?Ch. 29 - What is the difference between wet and dry?...Ch. 29 - What is dry etching?Ch. 29 - What are the three main categories of dry etching...Ch. 29 - What is the difference between plasma etching and...Ch. 29 - What is deep reactive ion etching?Ch. 29 - What is a benefit of using UV lasers to machine...Ch. 29 - Which type of non-lithographic micromachining...Ch. 29 - What are thin films?Ch. 29 - A) What is the difference between solution...Ch. 29 - What are the two broad categories of vapor...Ch. 29 - List two different types of physical vapor...Ch. 29 - List two advantages of sputtering over...Ch. 29 - What is meant by step coverage with regards to...Ch. 29 - Why is step coverage important?Ch. 29 - Prob. 49RQCh. 29 - What does gettering mean in relation to wafer...Ch. 29 - How are undesirable gas-phase reactions controlled...Ch. 29 - What is the key difference in the reactor designs...Ch. 29 - What are the two types of LPCVD reactor designs?...Ch. 29 - In metallization, what is the difference between a...Ch. 29 - What is the advantage of using plasma-enhanced on...Ch. 29 - A) What is epitaxy? B) is it important for...Ch. 29 - Name four techniques for solution deposition onto...Ch. 29 - Name four roll-to-roll processing techniques for...Ch. 29 - What is a semiconductor?Ch. 29 - Name three common semiconductor materials.Ch. 29 - Give three reasons why silicon is the most popular...Ch. 29 - Prob. 62RQCh. 29 - What is a silicon boule?Ch. 29 - Prob. 64RQCh. 29 - What are some geometric concerns involved with...Ch. 29 - What is meant by the term doping?Ch. 29 - What is the difference between n�type and...Ch. 29 - Name three methods for doping a silicon wafer.Ch. 29 - Prob. 69RQCh. 29 - Prob. 70RQCh. 29 - Prob. 71RQCh. 29 - Why are rapid thermal processing technologies...Ch. 29 - What are two ways in which silicon dioxide is...Ch. 29 - Give two reasons why wet oxidation is better...Ch. 29 - What is a p�n junction? \What can it be used...Ch. 29 - Prob. 76RQCh. 29 - Assuming an n�doped substrate is clean, list the...Ch. 29 - What is planarization and why is it needed?Ch. 29 - What is meant by the term ULSI?Ch. 29 - In general, what technological breakthroughs were...Ch. 29 - What drives the increase in component density and...Ch. 29 - Why are clean rooms so important to...Ch. 29 - What is the advantage of electron microscopy over...Ch. 29 - What is the collective advantage of...Ch. 29 - Why do samples analyzed in an electron microscopes...Ch. 29 - What are two differences between a scanning...Ch. 29 - What is important about a dual�beam focused ion...Ch. 29 - Why is white light normally preferred for...Ch. 29 - What is one advantage of an atomic force...Ch. 29 - What is the breadth of scale of an automotive...Ch. 29 - What is the breadth of scale of a computer...Ch. 29 - Which has a larger breadth of scale, the...Ch. 29 - Prob. 4PCh. 29 - A piece of silicon has an integrated resistor...
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- The design of the gear-and-shaft system shown requires that steel shafts of the same diameter be used for both AB and CD. It is further required that the angle D through which end D of shaft CD rotates not exceed 1.5°. Knowing that G = 77.2 GPa, determine the required diameter of the shafts. 40 mm 400 mm 100 mm 600 mm T-1000 N-m Darrow_forwardAssume a Space Launch System (Figure 1(a)) that is approximated as a cantilever undamped single degree of freedom (SDOF) system with a mass at its free end (Figure 1(b)). The cantilever is assumed to be massless. Assume a wind load that is approximated with a concentrated harmonic forcing function p(t) = posin(ωt) acting on the mass. The known properties of the SDOF and the applied forcing function are given below. • Mass of SDOF: m =120 kip/g • Acceleration of gravity: g = 386 in/sec2 • Bending sectional stiffness of SDOF: EI = 1015 lbf×in2 • Height of SDOF: h = 2000 inches • Amplitude of forcing function: po = 6 kip • Forcing frequency: f = 8 Hzarrow_forward13.44 The end of a cylindrical liquid cryogenic propellant tank in free space is to be protected from external (solar) radiation by placing a thin metallic shield in front of the tank. Assume the view factor Fts between the tank and the shield is unity; all surfaces are diffuse and gray, and the surroundings are at 0 K. Tank T₁ Shield, T T₁ = 100 K E1 Solar irradiation Gs ε₁ = ε₂ = 0.05 ε₁ = 0.10 Gs = 1250 W/m² E2 Find the temperature of the shield T, and the heat flux (W/m²) to the end of the tank.arrow_forward
- question 664 thank youarrow_forward13.38 Consider the attic of a home located in a hot climate. The floor of the attic is characterized by a width of L₁ = 8 m while the roof makes an angle of 0 = 30° from the horizontal direction, as shown in the schematic. The homeowner wishes to reduce the heat load to the home by adhering bright aluminum foil (ε = 0.07) onto the surfaces of the attic space. Prior to installation of the foil, the surfaces are of emissivity & = 0.90. Attic A2, 82, T2 0 = 30° A1, E1, T₁ 土 L₁ = 8 m (a) Consider installation on the bottom of the attic roof only. Determine the ratio of the radiation heat transfer after to before the installation of the foil. (b) Determine the ratio of the radiation heat transfer after to before installation if the foil is installed only on the top of the attic floor. (c) Determine the ratio of the radiation heat transfer if the foil is installed on both the roof bottom and the floor top.arrow_forward13.1 Determine F2 and F2 for the following configura- tions using the reciprocity theorem and other basic shape factor relations. Do not use tables or charts. (a) Small sphere of area A, under a concentric hemi- sphere of area A₂ = 3A₁ A₂ A1 (a) (b) Long duct. Also, what is F₁₂? A₂ Αν (b) (c) Long inclined plates (point B is directly above the center of A₁) B 100 mm A₂ - 220 mm (c) (d) Long cylinder lying on infinite plane + A₁ Az (d) (e) Hemisphere-disk arrangement -A₂, hemisphere, diameter D A₂ A₁, disk, diameter D/2 (e) (f) Long, open channel 1 m AA₂ 2 m (f) (g) Long cylinders with A₁ = 4A₁. Also, what is F₁₂? -D₁ A1 -A₂ -D2 (e) (h) Long, square rod in a long cylinder. Also, what is F22? w=D/5 18 A₁ -A2 (h) -Darrow_forward
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- ११११११११ TABLE Much 160,000kg Croll 0,005 CD Ap Par ng При nchs 0.15 5m² 1.2kg/m³ 0.98 0.9 0,98 0,9 0,88 IF 20 10 to add The train is going to make several stops along its journey. It will be important for the train to accelerate quickdy to get back up to speed. In order to get Tesla Model S motors until we get the combined The Forque and power needed we are goins bined power and forque needed to accelerate from 0 to 324 km/hr in less than 5 Minutes. Tesla Prated 270 kW Tesla Trated Twheel ng Jaxle 440 NM 20 8.5kgm² 0.45M a) What is the minimum whole number of Tesla Motors required to achieve accelerate the train from 0 to 324 km/hr in less than 5 Nnutes? Seperate the acceleration into constant torque and constant power 0. b) How long does it take the train to accelerate from 0 to 324 km/hr with the number of Tesla motors from part a? c) Using Matlab plot the relocity profile as a function of time, Is this a constant acceleration profile? Barrow_forwardExample find f(t)? -4s F(s)= (s² + 4)²arrow_forwarddraw a kinematic diagramarrow_forward
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