DeGarmo's Materials and Processes in Manufacturing
12th Edition
ISBN: 9781118987674
Author: J. T. Black, Ronald A. Kohser
Publisher: WILEY
expand_more
expand_more
format_list_bulleted
Videos
Textbook Question
Chapter 29, Problem 24RQ
What is meant by resist sensitivity?
Expert Solution & Answer
Want to see the full answer?
Check out a sample textbook solution
Students have asked these similar questions
A group of 23 power transistors, dissipating 2 W each, are to be cooled by attaching them to a black-anodized square aluminum plate and mounting the plate on the wall of a room at 30°C. The emissivity of the transistor and the plate surfaces is 0.9. Assuming the heat transfer from the back side of the plate to be negligible and the temperature of the surrounding surfaces to be the same as the air temperature of the room, determine the length of the square plate if the average surface temperature of the plate is not to exceed 50°C. Start the iteration process with an initial guess of the size of the plate as 43 cm.
The properties of air at 1 atm and the film temperature of (Ts + T)/2 = (50 + 30)/2 = 40°C are k = 0.02662 W/m·°C, ν = 1.702 × 10–5 m2 /s, Pr = 0.7255, and β = 0.003195 K–1.
Multiple Choice
0.473 m
0.284 m
0.513 m
0.671 m
A 40-cm-diameter, 127-cm-high cylindrical hot water tank is located in the bathroom of a house maintained at 20°C. The surface
temperature of the tank is measured to be 44°C and its emissivity is 0.4. Taking the surrounding surface temperature to be also 20°C,
determine the rate of heat loss from all surfaces of the tank by natural convection and radiation.
The properties of air at 32°C are k=0.02603 W/m-K, v=1.627 x 10-5 m²/s, Pr = 0.7276, and ẞ = 0.003279 K-1
The rate of heat loss from all surfaces of the tank by natural convection is
The rate of heat loss from all surfaces of the tank by radiation is
W.
W.
A 2.5-m-long thin vertical plate is subjected to uniform heat flux on one side, while the other side is exposed to cool air at 5°C. The
plate surface has an emissivity of 0.73, and its midpoint temperature is 55°C. Determine the heat flux subjected on the plate surface.
Uniform
heat flux
-Plate, € = 0.73
Cool air
5°C
7
TSUIT
Given: The properties of water at Tf,c= 30°C.
k=0.02588 W/m.K,
v=1.608 x 10-5 m²/s
Pr = 0.7282
The heat flux subjected on the plate surface is
W/m²
Chapter 29 Solutions
DeGarmo's Materials and Processes in Manufacturing
Ch. 29 - Over the latter half of the 20th century, what...Ch. 29 - What was the major motivation for developing...Ch. 29 - Prob. 3RQCh. 29 - What is an example of a device feature that is...Ch. 29 - What type of manufacturing technology dominates...Ch. 29 - Name the four categories of miniature systems...Ch. 29 - Give two differences between lab-on-a-chip and...Ch. 29 - What is a scaling law?Ch. 29 - As the primary dimensions of an object decrease,...Ch. 29 - In the design of a water heater, the mean time...
Ch. 29 - Prob. 11RQCh. 29 - Name two conventional manufacturing processes that...Ch. 29 - Prob. 13RQCh. 29 - Why does breadth of scale of a product have an...Ch. 29 - What is the most complicated, expensive, and...Ch. 29 - Name three purposes that a resist mask can play.Ch. 29 - Name four key lithography methods.Ch. 29 - Name two through-mask lithography techniques.Ch. 29 - Name two direct-write lithography techniques.Ch. 29 - List the sequence of steps involved in...Ch. 29 - Of the two major classifications of photoresists,...Ch. 29 - List four requirements of a photoresist.Ch. 29 - What limits the resolution of a photoresist?Ch. 29 - What is meant by resist sensitivity?Ch. 29 - What is one requirement that contributes to the...Ch. 29 - List the three types of exposure methods used in...Ch. 29 - Why is projection printing equipment called a...Ch. 29 - What are typical materials etched during...Ch. 29 - What is etch bias?Ch. 29 - Prob. 30RQCh. 29 - What are some possible defects that can result...Ch. 29 - What are some possible defects that can result...Ch. 29 - List and describe two properties of etchants.Ch. 29 - What is etch anisotropy dependent upon?Ch. 29 - What is the difference between wet and dry?...Ch. 29 - What is dry etching?Ch. 29 - What are the three main categories of dry etching...Ch. 29 - What is the difference between plasma etching and...Ch. 29 - What is deep reactive ion etching?Ch. 29 - What is a benefit of using UV lasers to machine...Ch. 29 - Which type of non-lithographic micromachining...Ch. 29 - What are thin films?Ch. 29 - A) What is the difference between solution...Ch. 29 - What are the two broad categories of vapor...Ch. 29 - List two different types of physical vapor...Ch. 29 - List two advantages of sputtering over...Ch. 29 - What is meant by step coverage with regards to...Ch. 29 - Why is step coverage important?Ch. 29 - Prob. 49RQCh. 29 - What does gettering mean in relation to wafer...Ch. 29 - How are undesirable gas-phase reactions controlled...Ch. 29 - What is the key difference in the reactor designs...Ch. 29 - What are the two types of LPCVD reactor designs?...Ch. 29 - In metallization, what is the difference between a...Ch. 29 - What is the advantage of using plasma-enhanced on...Ch. 29 - A) What is epitaxy? B) is it important for...Ch. 29 - Name four techniques for solution deposition onto...Ch. 29 - Name four roll-to-roll processing techniques for...Ch. 29 - What is a semiconductor?Ch. 29 - Name three common semiconductor materials.Ch. 29 - Give three reasons why silicon is the most popular...Ch. 29 - Prob. 62RQCh. 29 - What is a silicon boule?Ch. 29 - Prob. 64RQCh. 29 - What are some geometric concerns involved with...Ch. 29 - What is meant by the term doping?Ch. 29 - What is the difference between n�type and...Ch. 29 - Name three methods for doping a silicon wafer.Ch. 29 - Prob. 69RQCh. 29 - Prob. 70RQCh. 29 - Prob. 71RQCh. 29 - Why are rapid thermal processing technologies...Ch. 29 - What are two ways in which silicon dioxide is...Ch. 29 - Give two reasons why wet oxidation is better...Ch. 29 - What is a p�n junction? \What can it be used...Ch. 29 - Prob. 76RQCh. 29 - Assuming an n�doped substrate is clean, list the...Ch. 29 - What is planarization and why is it needed?Ch. 29 - What is meant by the term ULSI?Ch. 29 - In general, what technological breakthroughs were...Ch. 29 - What drives the increase in component density and...Ch. 29 - Why are clean rooms so important to...Ch. 29 - What is the advantage of electron microscopy over...Ch. 29 - What is the collective advantage of...Ch. 29 - Why do samples analyzed in an electron microscopes...Ch. 29 - What are two differences between a scanning...Ch. 29 - What is important about a dual�beam focused ion...Ch. 29 - Why is white light normally preferred for...Ch. 29 - What is one advantage of an atomic force...Ch. 29 - What is the breadth of scale of an automotive...Ch. 29 - What is the breadth of scale of a computer...Ch. 29 - Which has a larger breadth of scale, the...Ch. 29 - Prob. 4PCh. 29 - A piece of silicon has an integrated resistor...
Knowledge Booster
Learn more about
Need a deep-dive on the concept behind this application? Look no further. Learn more about this topic, mechanical-engineering and related others by exploring similar questions and additional content below.Similar questions
- Hot water is flowing at an average velocity of 5.82 ft/s through a cast iron pipe (k=30 Btu/h-ft-°F) whose inner and outer diameters are 1.0 in and 1.2 in, respectively. The pipe passes through a 50-ft-long section of a basement whose temperature is 60°F. The emissivity of the outer surface of the pipe is 0.5, and the walls of the basement are also at about 60°F. If the inlet temperature of the water is 150°F and the heat transfer coefficient on the inner surface of the pipe is 30 Btu/h-ft².°F, determine the temperature drop of water as it passes through the basement. Evaluate air properties at a film temperature of 105°C and 1 atm pressure. The properties of air at 1 atm and the film temperature of (Ts+ T∞)/2 = (150+60)/2 = 105°F are k=0.01541 Btu/h-ft-°F. v=0.1838 × 10-3 ft2/s, Pr = 0.7253, and ẞ = 0.00177R-1arrow_forwardhand-written solutions only, please. correct answers upvoted!arrow_forwardhand-written solutions only, please. correct answers upvoted!arrow_forward
- ! Required information Consider a flat-plate solar collector placed horizontally on the flat roof of a house. The collector is 1.3 m wide and 2.8 m long, and the average temperature of the exposed surface of the collector is 42°C. The properties of air at 1 atm and the film temperature are k=0.02551 W/m-°C, v = 1.562 × 10-5 m²/s, Pr = 0.7286, and ẞ= 0.003356 K-1 Determine the rate of heat loss from the collector by natural convection during a calm day when the ambient air temperature is 8°C. The rate of heat loss from the collector by natural convection is W.arrow_forwardhand-written solutions only, please. correct answers upvoted!arrow_forwardhand-written solutions only, please. correct answers upvoted!arrow_forward
- Please find the torsional yield strength, the yield strength, the spring index, and the mean diameter.arrow_forward(read image) (Answer Given)arrow_forward6.76 A wind turbine is operating in a 12 m/s wind that has a den- sity of 1.2 kg/m³. The diameter of the turbine silhouette is 4 m. The constant-pressure (atmospheric) streamline has a diameter of 3 m upstream of the windmill and 4.5 m downstream. Assume that the velocity distributions are uniform and the air is incom- pressible. Determine the force on the wind turbine. m P = Patm 4 Vz 4m 4 m Fx. Problem 6.76arrow_forward
arrow_back_ios
SEE MORE QUESTIONS
arrow_forward_ios
Recommended textbooks for you
Precision Machining Technology (MindTap Course Li...Mechanical EngineeringISBN:9781285444543Author:Peter J. Hoffman, Eric S. Hopewell, Brian JanesPublisher:Cengage Learning
Understanding Motor ControlsMechanical EngineeringISBN:9781337798686Author:Stephen L. HermanPublisher:Delmar Cengage Learning
Precision Machining Technology (MindTap Course Li...
Mechanical Engineering
ISBN:9781285444543
Author:Peter J. Hoffman, Eric S. Hopewell, Brian Janes
Publisher:Cengage Learning
Understanding Motor Controls
Mechanical Engineering
ISBN:9781337798686
Author:Stephen L. Herman
Publisher:Delmar Cengage Learning
Microelectronics Fabrication Center; Author: AnritsuCompany;https://www.youtube.com/watch?v=oDC6WWj3gmk;License: Standard Youtube License