DeGarmo's Materials and Processes in Manufacturing
12th Edition
ISBN: 9781118987674
Author: J. T. Black, Ronald A. Kohser
Publisher: WILEY
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Chapter 29, Problem 61RQ
Give three reasons why silicon is the most popular semiconductor used today.
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Chapter 29 Solutions
DeGarmo's Materials and Processes in Manufacturing
Ch. 29 - Over the latter half of the 20th century, what...Ch. 29 - What was the major motivation for developing...Ch. 29 - Prob. 3RQCh. 29 - What is an example of a device feature that is...Ch. 29 - What type of manufacturing technology dominates...Ch. 29 - Name the four categories of miniature systems...Ch. 29 - Give two differences between lab-on-a-chip and...Ch. 29 - What is a scaling law?Ch. 29 - As the primary dimensions of an object decrease,...Ch. 29 - In the design of a water heater, the mean time...
Ch. 29 - Prob. 11RQCh. 29 - Name two conventional manufacturing processes that...Ch. 29 - Prob. 13RQCh. 29 - Why does breadth of scale of a product have an...Ch. 29 - What is the most complicated, expensive, and...Ch. 29 - Name three purposes that a resist mask can play.Ch. 29 - Name four key lithography methods.Ch. 29 - Name two through-mask lithography techniques.Ch. 29 - Name two direct-write lithography techniques.Ch. 29 - List the sequence of steps involved in...Ch. 29 - Of the two major classifications of photoresists,...Ch. 29 - List four requirements of a photoresist.Ch. 29 - What limits the resolution of a photoresist?Ch. 29 - What is meant by resist sensitivity?Ch. 29 - What is one requirement that contributes to the...Ch. 29 - List the three types of exposure methods used in...Ch. 29 - Why is projection printing equipment called a...Ch. 29 - What are typical materials etched during...Ch. 29 - What is etch bias?Ch. 29 - Prob. 30RQCh. 29 - What are some possible defects that can result...Ch. 29 - What are some possible defects that can result...Ch. 29 - List and describe two properties of etchants.Ch. 29 - What is etch anisotropy dependent upon?Ch. 29 - What is the difference between wet and dry?...Ch. 29 - What is dry etching?Ch. 29 - What are the three main categories of dry etching...Ch. 29 - What is the difference between plasma etching and...Ch. 29 - What is deep reactive ion etching?Ch. 29 - What is a benefit of using UV lasers to machine...Ch. 29 - Which type of non-lithographic micromachining...Ch. 29 - What are thin films?Ch. 29 - A) What is the difference between solution...Ch. 29 - What are the two broad categories of vapor...Ch. 29 - List two different types of physical vapor...Ch. 29 - List two advantages of sputtering over...Ch. 29 - What is meant by step coverage with regards to...Ch. 29 - Why is step coverage important?Ch. 29 - Prob. 49RQCh. 29 - What does gettering mean in relation to wafer...Ch. 29 - How are undesirable gas-phase reactions controlled...Ch. 29 - What is the key difference in the reactor designs...Ch. 29 - What are the two types of LPCVD reactor designs?...Ch. 29 - In metallization, what is the difference between a...Ch. 29 - What is the advantage of using plasma-enhanced on...Ch. 29 - A) What is epitaxy? B) is it important for...Ch. 29 - Name four techniques for solution deposition onto...Ch. 29 - Name four roll-to-roll processing techniques for...Ch. 29 - What is a semiconductor?Ch. 29 - Name three common semiconductor materials.Ch. 29 - Give three reasons why silicon is the most popular...Ch. 29 - Prob. 62RQCh. 29 - What is a silicon boule?Ch. 29 - Prob. 64RQCh. 29 - What are some geometric concerns involved with...Ch. 29 - What is meant by the term doping?Ch. 29 - What is the difference between n�type and...Ch. 29 - Name three methods for doping a silicon wafer.Ch. 29 - Prob. 69RQCh. 29 - Prob. 70RQCh. 29 - Prob. 71RQCh. 29 - Why are rapid thermal processing technologies...Ch. 29 - What are two ways in which silicon dioxide is...Ch. 29 - Give two reasons why wet oxidation is better...Ch. 29 - What is a p�n junction? \What can it be used...Ch. 29 - Prob. 76RQCh. 29 - Assuming an n�doped substrate is clean, list the...Ch. 29 - What is planarization and why is it needed?Ch. 29 - What is meant by the term ULSI?Ch. 29 - In general, what technological breakthroughs were...Ch. 29 - What drives the increase in component density and...Ch. 29 - Why are clean rooms so important to...Ch. 29 - What is the advantage of electron microscopy over...Ch. 29 - What is the collective advantage of...Ch. 29 - Why do samples analyzed in an electron microscopes...Ch. 29 - What are two differences between a scanning...Ch. 29 - What is important about a dual�beam focused ion...Ch. 29 - Why is white light normally preferred for...Ch. 29 - What is one advantage of an atomic force...Ch. 29 - What is the breadth of scale of an automotive...Ch. 29 - What is the breadth of scale of a computer...Ch. 29 - Which has a larger breadth of scale, the...Ch. 29 - Prob. 4PCh. 29 - A piece of silicon has an integrated resistor...
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- The link lengths and the value of 2 and offset for some fourbar crank-slide linkages are defined in Table 1. The linkage configuration and terminology are shown in Figure 1. For the rows assigned, find (a) all possible solutions for angle & and slider position d by vector loop method. (b) the transmission angle corresponding to angle 03. (Hint: Treat the vector R4 as virtual rocker) Show your work in details: vector loop, vector equations, solution procedure. Table 1 Row Link 2 Link 3 Offset Ө a 1.4 4 1 45° b 3 8 2 -30° C 5 20 -5 225° 03 slider axis B X offset Link 2 A R3 Link 3 R4 04 R2 02 R1 d Figure 1. Xarrow_forward4. Two links made of heat treated 6061 aluminum (Sy = 276 MPa, Sys = 160 MPa) are pinned together using a steel dowel pin (Sy = 1398 MPa, Sys = 806 MPa) as shown below. The links are to support a load P with a factor of safety of at least 2.0. Determine if the link will fail first by tearout, direct shear of the pin, bearing stress on the link, or tensile stress at section AA. (Hint: find the load P for each case and choose the case that gives the smallest load.) P 8 mm P 8 mm ¡+A 3 mm →A 10 mm Parrow_forward1. For a feature other than a sphere, circularity is where: A. The axis is a straight line B. The modifier is specified with a size dimension C. All points of the surface intersected by any plane perpendicular to an axis or spine (curved line) are equidistant from that axis or spine D. All points of the surface intersected by any plane passing through a common center are equidistant from that center 2. What type of variation is limited by a circularity toler- ance zone? A. Ovality B. Tapering C. Bending D. Warping 3. How does the Rule #1 boundary affect the application of a circularity tolerance? A. The modifier must be used. B. The feature control frame must be placed next to the size dimension. C. The circularity tolerance value must be less than the limits of size tolerance. D. Circularity cannot be applied where a Rule #1 boundary exists. 4. A circularity tolerance may use a modifier. A. Ø B. F C. M D. ℗ 5. A real-world application for a circularity tolerance is: A. Assembly (i.e.,…arrow_forward
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