DeGarmo's Materials and Processes in Manufacturing

12th Edition

ISBN: 9781118987674

Author: J. T. Black, Ronald A. Kohser

Publisher: WILEY

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Textbook Question

Chapter 29, Problem 58RQ

Name four roll-to-roll processing techniques for solution deposition.

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Chapter 29, Problem 57RQ

Chapter 29, Problem 59RQ

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Based on the table below, which of the statements below is/are correct regarding the 3D printing process shown in the schematic? Z AXIS X AXIS YAXIS LEGEND A: Extruder B: Nozzle C: Printed part D: Hot plate E: Filament Table 15.2 Melting and Glass Transition Temperatures for Some of the More Common Polymeric Materials Material Polyethylene (low density) Polytetrafluoroethylene Polyethylene (high density) Polypropylene Nylon 6,6 Polyester (PET) Poly(vinyl chloride) Polystyrene Polycarbonate Glass Transition Temperature [°C (°F)] -110 (-165) -97 (-140) -90 (-130) -18 (0) 57 (135) 69 (155) 87 (190) 100 (212) 150 (300) Melting Temperature [°C (°F)] 115 (240) 327 (620) 137 (279) 175 (347) 265 (510) 265 (510) 212 (415) 240 (465) 265 (510) a. This process is best suited for the low volume production of tubes, bars and beams due to the nature of the extrusion process b. Manufacturing a thermoplastic HDPE hose with an extrusion nozzle heated to 175C is possible with this process □c. You can…

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Based on the table below, which of the statements below is/are correct regarding the 3D printing process shown in the schematic? a.You can produce a room-temperature non-fragile 225C oven-safe food container with at least one material from the above table using this process and a 280C nozzle b.You can use this process to print plastic or brittle objects but not elastomers and rubbers c.Manufacturing a thermoplastic HDPE hose with an extrusion nozzle heated to 175C is possible with this process d.You can print thermoplastic and thermoset polymers with this process, you only need to make sure that the nozzle specs and the crosslinking conditions match the polymer requirements e.This process is best suited for the low volume production of tubes, bars and beams due to the nature of the extrusion process

Chapter 29 Solutions

DeGarmo's Materials and Processes in Manufacturing

Ch. 29 - Over the latter half of the 20th century, what...Ch. 29 - What was the major motivation for developing...Ch. 29 - Prob. 3RQ Ch. 29 - What is an example of a device feature that is...Ch. 29 - What type of manufacturing technology dominates...Ch. 29 - Name the four categories of miniature systems...Ch. 29 - Give two differences between lab-on-a-chip and...Ch. 29 - What is a scaling law?Ch. 29 - As the primary dimensions of an object decrease,...Ch. 29 - In the design of a water heater, the mean time...

Ch. 29 - Prob. 11RQ Ch. 29 - Name two conventional manufacturing processes that...Ch. 29 - Prob. 13RQ Ch. 29 - Why does breadth of scale of a product have an...Ch. 29 - What is the most complicated, expensive, and...Ch. 29 - Name three purposes that a resist mask can play.Ch. 29 - Name four key lithography methods.Ch. 29 - Name two through-mask lithography techniques.Ch. 29 - Name two direct-write lithography techniques.Ch. 29 - List the sequence of steps involved in...Ch. 29 - Of the two major classifications of photoresists,...Ch. 29 - List four requirements of a photoresist.Ch. 29 - What limits the resolution of a photoresist?Ch. 29 - What is meant by resist sensitivity?Ch. 29 - What is one requirement that contributes to the...Ch. 29 - List the three types of exposure methods used in...Ch. 29 - Why is projection printing equipment called a...Ch. 29 - What are typical materials etched during...Ch. 29 - What is etch bias?Ch. 29 - Prob. 30RQ Ch. 29 - What are some possible defects that can result...Ch. 29 - What are some possible defects that can result...Ch. 29 - List and describe two properties of etchants.Ch. 29 - What is etch anisotropy dependent upon?Ch. 29 - What is the difference between wet and dry?...Ch. 29 - What is dry etching?Ch. 29 - What are the three main categories of dry etching...Ch. 29 - What is the difference between plasma etching and...Ch. 29 - What is deep reactive ion etching?Ch. 29 - What is a benefit of using UV lasers to machine...Ch. 29 - Which type of non-lithographic micromachining...Ch. 29 - What are thin films?Ch. 29 - A) What is the difference between solution...Ch. 29 - What are the two broad categories of vapor...Ch. 29 - List two different types of physical vapor...Ch. 29 - List two advantages of sputtering over...Ch. 29 - What is meant by step coverage with regards to...Ch. 29 - Why is step coverage important?Ch. 29 - Prob. 49RQ Ch. 29 - What does gettering mean in relation to wafer...Ch. 29 - How are undesirable gas-phase reactions controlled...Ch. 29 - What is the key difference in the reactor designs...Ch. 29 - What are the two types of LPCVD reactor designs?...Ch. 29 - In metallization, what is the difference between a...Ch. 29 - What is the advantage of using plasma-enhanced on...Ch. 29 - A) What is epitaxy? B) is it important for...Ch. 29 - Name four techniques for solution deposition onto...Ch. 29 - Name four roll-to-roll processing techniques for...Ch. 29 - What is a semiconductor?Ch. 29 - Name three common semiconductor materials.Ch. 29 - Give three reasons why silicon is the most popular...Ch. 29 - Prob. 62RQ Ch. 29 - What is a silicon boule?Ch. 29 - Prob. 64RQ Ch. 29 - What are some geometric concerns involved with...Ch. 29 - What is meant by the term doping?Ch. 29 - What is the difference between nâ€�type and...Ch. 29 - Name three methods for doping a silicon wafer.Ch. 29 - Prob. 69RQ Ch. 29 - Prob. 70RQ Ch. 29 - Prob. 71RQ Ch. 29 - Why are rapid thermal processing technologies...Ch. 29 - What are two ways in which silicon dioxide is...Ch. 29 - Give two reasons why wet oxidation is better...Ch. 29 - What is a pâ€�n junction? \What can it be used...Ch. 29 - Prob. 76RQ Ch. 29 - Assuming an nâ€�doped substrate is clean, list the...Ch. 29 - What isÂ planarizationÂ and why is it needed?Ch. 29 - What is meant by the term ULSI?Ch. 29 - In general, what technological breakthroughs were...Ch. 29 - What drives the increase in component density and...Ch. 29 - Why are clean rooms so important to...Ch. 29 - What is the advantage of electron microscopy over...Ch. 29 - What is the collective advantage of...Ch. 29 - Why do samples analyzed in an electron microscopes...Ch. 29 - What are two differences between a scanning...Ch. 29 - What is important about a dualâ€�beam focused ion...Ch. 29 - Why is white light normally preferred for...Ch. 29 - What is one advantage of an atomic force...Ch. 29 - What is the breadth of scale of an automotive...Ch. 29 - What is the breadth of scale of a computer...Ch. 29 - Which has a larger breadth of scale, the...Ch. 29 - Prob. 4P Ch. 29 - A piece of silicon has an integrated resistor...

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