DeGarmo's Materials and Processes in Manufacturing
12th Edition
ISBN: 9781118987674
Author: J. T. Black, Ronald A. Kohser
Publisher: WILEY
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Textbook Question
Chapter 29, Problem 58RQ
Name four roll-to-roll processing techniques for solution deposition.
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Students have asked these similar questions
Q1. A curved beam of a circular cross section of diameter "d" is fixed at one end and
subjected to a concentrated load P at the free end (Fig. 1). Calculate stresses at points
A and C. Given: P = 800 N, d = 30 mm, a 25 mm, and b = 15 mm.
Fig.1
P
b
B
(10 Marks)
You are working as an engineer in a bearing systems design company. The flow of
lubricant inside a hydrodynamic bearing (p = 0.001 kg m-1 s-1) can be approximated
as a parallel, steady, two-dimensional, incompressible flow between two parallel plates.
The top plate, representing the moving part of the bearing, travels at a constant speed,
U, while the bottom plate remains stationary (Figure Q1). The plates are separated by
a distance of 2h = 1 cm and are W = 20 cm wide. Their length is L = 10 cm. By
applying the above approximations to the Navier-Stokes equations and assuming that
end effects can be neglected, the horizontal velocity profile can be shown to be
y = +h
I
2h = 1 cm
x1
y = -h
u(y)
1 dP
2μ dx
-y² + Ay + B
moving plate
stationary plate
U
2
I2
L = 10 cm
Figure Q1: Flow in a hydrodynamic bearing. The plates extend a width, W = 20 cm,
into the page.
Question 1
You are working as an engineer in a bearing systems design company. The flow of
lubricant inside a hydrodynamic bearing (µ = 0.001 kg m¯¹ s¯¹) can be approximated
as a parallel, steady, two-dimensional, incompressible flow between two parallel plates.
The top plate, representing the moving part of the bearing, travels at a constant speed,
U, while the bottom plate remains stationary (Figure Q1). The plates are separated by
a distance of 2h = 1 cm and are W = 20 cm wide. Their length is L = 10 cm. By
applying the above approximations to the Navier-Stokes equations and assuming that
end effects can be neglected, the horizontal velocity profile can be shown to be
1 dP
u(y)
=
2μ dx
-y² + Ay + B
y= +h
Ꮖ
2h=1 cm
1
x1
y = −h
moving plate
stationary plate
2
X2
L = 10 cm
Figure Q1: Flow in a hydrodynamic bearing. The plates extend a width, W = 20 cm,
into the page.
(a) By considering the appropriate boundary conditions, show that the constants take
the following forms:
U
U
1 dP
A =…
Chapter 29 Solutions
DeGarmo's Materials and Processes in Manufacturing
Ch. 29 - Over the latter half of the 20th century, what...Ch. 29 - What was the major motivation for developing...Ch. 29 - Prob. 3RQCh. 29 - What is an example of a device feature that is...Ch. 29 - What type of manufacturing technology dominates...Ch. 29 - Name the four categories of miniature systems...Ch. 29 - Give two differences between lab-on-a-chip and...Ch. 29 - What is a scaling law?Ch. 29 - As the primary dimensions of an object decrease,...Ch. 29 - In the design of a water heater, the mean time...
Ch. 29 - Prob. 11RQCh. 29 - Name two conventional manufacturing processes that...Ch. 29 - Prob. 13RQCh. 29 - Why does breadth of scale of a product have an...Ch. 29 - What is the most complicated, expensive, and...Ch. 29 - Name three purposes that a resist mask can play.Ch. 29 - Name four key lithography methods.Ch. 29 - Name two through-mask lithography techniques.Ch. 29 - Name two direct-write lithography techniques.Ch. 29 - List the sequence of steps involved in...Ch. 29 - Of the two major classifications of photoresists,...Ch. 29 - List four requirements of a photoresist.Ch. 29 - What limits the resolution of a photoresist?Ch. 29 - What is meant by resist sensitivity?Ch. 29 - What is one requirement that contributes to the...Ch. 29 - List the three types of exposure methods used in...Ch. 29 - Why is projection printing equipment called a...Ch. 29 - What are typical materials etched during...Ch. 29 - What is etch bias?Ch. 29 - Prob. 30RQCh. 29 - What are some possible defects that can result...Ch. 29 - What are some possible defects that can result...Ch. 29 - List and describe two properties of etchants.Ch. 29 - What is etch anisotropy dependent upon?Ch. 29 - What is the difference between wet and dry?...Ch. 29 - What is dry etching?Ch. 29 - What are the three main categories of dry etching...Ch. 29 - What is the difference between plasma etching and...Ch. 29 - What is deep reactive ion etching?Ch. 29 - What is a benefit of using UV lasers to machine...Ch. 29 - Which type of non-lithographic micromachining...Ch. 29 - What are thin films?Ch. 29 - A) What is the difference between solution...Ch. 29 - What are the two broad categories of vapor...Ch. 29 - List two different types of physical vapor...Ch. 29 - List two advantages of sputtering over...Ch. 29 - What is meant by step coverage with regards to...Ch. 29 - Why is step coverage important?Ch. 29 - Prob. 49RQCh. 29 - What does gettering mean in relation to wafer...Ch. 29 - How are undesirable gas-phase reactions controlled...Ch. 29 - What is the key difference in the reactor designs...Ch. 29 - What are the two types of LPCVD reactor designs?...Ch. 29 - In metallization, what is the difference between a...Ch. 29 - What is the advantage of using plasma-enhanced on...Ch. 29 - A) What is epitaxy? B) is it important for...Ch. 29 - Name four techniques for solution deposition onto...Ch. 29 - Name four roll-to-roll processing techniques for...Ch. 29 - What is a semiconductor?Ch. 29 - Name three common semiconductor materials.Ch. 29 - Give three reasons why silicon is the most popular...Ch. 29 - Prob. 62RQCh. 29 - What is a silicon boule?Ch. 29 - Prob. 64RQCh. 29 - What are some geometric concerns involved with...Ch. 29 - What is meant by the term doping?Ch. 29 - What is the difference between n�type and...Ch. 29 - Name three methods for doping a silicon wafer.Ch. 29 - Prob. 69RQCh. 29 - Prob. 70RQCh. 29 - Prob. 71RQCh. 29 - Why are rapid thermal processing technologies...Ch. 29 - What are two ways in which silicon dioxide is...Ch. 29 - Give two reasons why wet oxidation is better...Ch. 29 - What is a p�n junction? \What can it be used...Ch. 29 - Prob. 76RQCh. 29 - Assuming an n�doped substrate is clean, list the...Ch. 29 - What is planarization and why is it needed?Ch. 29 - What is meant by the term ULSI?Ch. 29 - In general, what technological breakthroughs were...Ch. 29 - What drives the increase in component density and...Ch. 29 - Why are clean rooms so important to...Ch. 29 - What is the advantage of electron microscopy over...Ch. 29 - What is the collective advantage of...Ch. 29 - Why do samples analyzed in an electron microscopes...Ch. 29 - What are two differences between a scanning...Ch. 29 - What is important about a dual�beam focused ion...Ch. 29 - Why is white light normally preferred for...Ch. 29 - What is one advantage of an atomic force...Ch. 29 - What is the breadth of scale of an automotive...Ch. 29 - What is the breadth of scale of a computer...Ch. 29 - Which has a larger breadth of scale, the...Ch. 29 - Prob. 4PCh. 29 - A piece of silicon has an integrated resistor...
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