DeGarmo's Materials and Processes in Manufacturing
12th Edition
ISBN: 9781118987674
Author: J. T. Black, Ronald A. Kohser
Publisher: WILEY
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Chapter 29, Problem 71RQ
To determine
The reason behind to annealed the ion implanted substrate.
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Chapter 29 Solutions
DeGarmo's Materials and Processes in Manufacturing
Ch. 29 - Over the latter half of the 20th century, what...Ch. 29 - What was the major motivation for developing...Ch. 29 - Prob. 3RQCh. 29 - What is an example of a device feature that is...Ch. 29 - What type of manufacturing technology dominates...Ch. 29 - Name the four categories of miniature systems...Ch. 29 - Give two differences between lab-on-a-chip and...Ch. 29 - What is a scaling law?Ch. 29 - As the primary dimensions of an object decrease,...Ch. 29 - In the design of a water heater, the mean time...
Ch. 29 - Prob. 11RQCh. 29 - Name two conventional manufacturing processes that...Ch. 29 - Prob. 13RQCh. 29 - Why does breadth of scale of a product have an...Ch. 29 - What is the most complicated, expensive, and...Ch. 29 - Name three purposes that a resist mask can play.Ch. 29 - Name four key lithography methods.Ch. 29 - Name two through-mask lithography techniques.Ch. 29 - Name two direct-write lithography techniques.Ch. 29 - List the sequence of steps involved in...Ch. 29 - Of the two major classifications of photoresists,...Ch. 29 - List four requirements of a photoresist.Ch. 29 - What limits the resolution of a photoresist?Ch. 29 - What is meant by resist sensitivity?Ch. 29 - What is one requirement that contributes to the...Ch. 29 - List the three types of exposure methods used in...Ch. 29 - Why is projection printing equipment called a...Ch. 29 - What are typical materials etched during...Ch. 29 - What is etch bias?Ch. 29 - Prob. 30RQCh. 29 - What are some possible defects that can result...Ch. 29 - What are some possible defects that can result...Ch. 29 - List and describe two properties of etchants.Ch. 29 - What is etch anisotropy dependent upon?Ch. 29 - What is the difference between wet and dry?...Ch. 29 - What is dry etching?Ch. 29 - What are the three main categories of dry etching...Ch. 29 - What is the difference between plasma etching and...Ch. 29 - What is deep reactive ion etching?Ch. 29 - What is a benefit of using UV lasers to machine...Ch. 29 - Which type of non-lithographic micromachining...Ch. 29 - What are thin films?Ch. 29 - A) What is the difference between solution...Ch. 29 - What are the two broad categories of vapor...Ch. 29 - List two different types of physical vapor...Ch. 29 - List two advantages of sputtering over...Ch. 29 - What is meant by step coverage with regards to...Ch. 29 - Why is step coverage important?Ch. 29 - Prob. 49RQCh. 29 - What does gettering mean in relation to wafer...Ch. 29 - How are undesirable gas-phase reactions controlled...Ch. 29 - What is the key difference in the reactor designs...Ch. 29 - What are the two types of LPCVD reactor designs?...Ch. 29 - In metallization, what is the difference between a...Ch. 29 - What is the advantage of using plasma-enhanced on...Ch. 29 - A) What is epitaxy? B) is it important for...Ch. 29 - Name four techniques for solution deposition onto...Ch. 29 - Name four roll-to-roll processing techniques for...Ch. 29 - What is a semiconductor?Ch. 29 - Name three common semiconductor materials.Ch. 29 - Give three reasons why silicon is the most popular...Ch. 29 - Prob. 62RQCh. 29 - What is a silicon boule?Ch. 29 - Prob. 64RQCh. 29 - What are some geometric concerns involved with...Ch. 29 - What is meant by the term doping?Ch. 29 - What is the difference between n�type and...Ch. 29 - Name three methods for doping a silicon wafer.Ch. 29 - Prob. 69RQCh. 29 - Prob. 70RQCh. 29 - Prob. 71RQCh. 29 - Why are rapid thermal processing technologies...Ch. 29 - What are two ways in which silicon dioxide is...Ch. 29 - Give two reasons why wet oxidation is better...Ch. 29 - What is a p�n junction? \What can it be used...Ch. 29 - Prob. 76RQCh. 29 - Assuming an n�doped substrate is clean, list the...Ch. 29 - What is planarization and why is it needed?Ch. 29 - What is meant by the term ULSI?Ch. 29 - In general, what technological breakthroughs were...Ch. 29 - What drives the increase in component density and...Ch. 29 - Why are clean rooms so important to...Ch. 29 - What is the advantage of electron microscopy over...Ch. 29 - What is the collective advantage of...Ch. 29 - Why do samples analyzed in an electron microscopes...Ch. 29 - What are two differences between a scanning...Ch. 29 - What is important about a dual�beam focused ion...Ch. 29 - Why is white light normally preferred for...Ch. 29 - What is one advantage of an atomic force...Ch. 29 - What is the breadth of scale of an automotive...Ch. 29 - What is the breadth of scale of a computer...Ch. 29 - Which has a larger breadth of scale, the...Ch. 29 - Prob. 4PCh. 29 - A piece of silicon has an integrated resistor...
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- Sketch and describe hatch coamings. Describe structrual requirements to deck plating to compensate discontinuity for corners of a hatch. Show what is done to the deck plating when the decks are cut away and include the supporting members.arrow_forwardAn Inclining experiment done on a ship thats 6500 t, a mass of 30t was moved 6.0 m transvesly causing a 30 cm deflection in a 6m pendulum, calculate the transverse meta centre height.arrow_forwarda ship 150 m long and 20.5 m beam floats at a draught of8 m and displaces 19 500 tonne. The TPC is 26.5 and midshipsection area coefficient 0.94. Calculate the block, prismatic andwaterplane area coefficients.arrow_forward
- A vessel loads 680 t fuel between forward and aft deep tanks. centre of gravity of forward tank is 24m forward of ships COG. centre to centre between tanks is 42 m. how much in each tank to keep trim the samearrow_forwardBeam of a vessel is 11% its length. Cw =0.72. When floating in SW of relative denisity 1.03, TPC is 0.35t greater than in freshwater. Find the length of the shiparrow_forwardAn inclining experiment was carried out on a ship of 4000tonne displacement, when masses of 6 tonne were moved transverselythrough 13.5 m. The deflections of a 7.5 m pendulurnwere 81, 78, 85, 83, 79, 82, 84 and 80 mm respectively.Caiculate the metacentric height.arrow_forward
- A ship of 10 000 tonne displacement has a waterplanearea of 1300 m2. The ship loads in water of 1.010 t/m3 andmoves into water of 1.026 t/m3. Find the change in meandraughtarrow_forwardA ship of 7000 tonne displacement has a waterplane areaof 1500 m2. In passing from sea water into river water of1005 kg/m3 there is an increase in draught of 10 cm. Find the Idensity of the sea water.arrow_forwardA ship has 300 tonne of cargo in the hold, 24 m forward ofmidships. The displacement of the vessel is 6000 tonne and its centre of gravity is 1.2 m forward of midships.Find the new position of the centre of gravity if this cargo ismoved to an after hold, 40 m from midshipsarrow_forward
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