DeGarmo's Materials and Processes in Manufacturing
12th Edition
ISBN: 9781118987674
Author: J. T. Black, Ronald A. Kohser
Publisher: WILEY
expand_more
expand_more
format_list_bulleted
Textbook Question
Chapter 29, Problem 16RQ
Name three purposes that a resist mask can play.
Expert Solution & Answer
Want to see the full answer?
Check out a sample textbook solutionStudents have asked these similar questions
Which statement is right :
In photolithography, the mask is essential. Without the mask, photolithography can be finished.
positive photoresist will stay on the substrate after UV exposure and subsequent development
negative photoresist will be dissolved after UV exposure and subsequent development
A 1000-level cleanroom is much better than a 10-level one
chrome mask is better than a film mask
Needs quick solution with Explanation
Need quick solution with Explanation
Chapter 29 Solutions
DeGarmo's Materials and Processes in Manufacturing
Ch. 29 - Over the latter half of the 20th century, what...Ch. 29 - What was the major motivation for developing...Ch. 29 - Prob. 3RQCh. 29 - What is an example of a device feature that is...Ch. 29 - What type of manufacturing technology dominates...Ch. 29 - Name the four categories of miniature systems...Ch. 29 - Give two differences between lab-on-a-chip and...Ch. 29 - What is a scaling law?Ch. 29 - As the primary dimensions of an object decrease,...Ch. 29 - In the design of a water heater, the mean time...
Ch. 29 - Prob. 11RQCh. 29 - Name two conventional manufacturing processes that...Ch. 29 - Prob. 13RQCh. 29 - Why does breadth of scale of a product have an...Ch. 29 - What is the most complicated, expensive, and...Ch. 29 - Name three purposes that a resist mask can play.Ch. 29 - Name four key lithography methods.Ch. 29 - Name two through-mask lithography techniques.Ch. 29 - Name two direct-write lithography techniques.Ch. 29 - List the sequence of steps involved in...Ch. 29 - Of the two major classifications of photoresists,...Ch. 29 - List four requirements of a photoresist.Ch. 29 - What limits the resolution of a photoresist?Ch. 29 - What is meant by resist sensitivity?Ch. 29 - What is one requirement that contributes to the...Ch. 29 - List the three types of exposure methods used in...Ch. 29 - Why is projection printing equipment called a...Ch. 29 - What are typical materials etched during...Ch. 29 - What is etch bias?Ch. 29 - Prob. 30RQCh. 29 - What are some possible defects that can result...Ch. 29 - What are some possible defects that can result...Ch. 29 - List and describe two properties of etchants.Ch. 29 - What is etch anisotropy dependent upon?Ch. 29 - What is the difference between wet and dry?...Ch. 29 - What is dry etching?Ch. 29 - What are the three main categories of dry etching...Ch. 29 - What is the difference between plasma etching and...Ch. 29 - What is deep reactive ion etching?Ch. 29 - What is a benefit of using UV lasers to machine...Ch. 29 - Which type of non-lithographic micromachining...Ch. 29 - What are thin films?Ch. 29 - A) What is the difference between solution...Ch. 29 - What are the two broad categories of vapor...Ch. 29 - List two different types of physical vapor...Ch. 29 - List two advantages of sputtering over...Ch. 29 - What is meant by step coverage with regards to...Ch. 29 - Why is step coverage important?Ch. 29 - Prob. 49RQCh. 29 - What does gettering mean in relation to wafer...Ch. 29 - How are undesirable gas-phase reactions controlled...Ch. 29 - What is the key difference in the reactor designs...Ch. 29 - What are the two types of LPCVD reactor designs?...Ch. 29 - In metallization, what is the difference between a...Ch. 29 - What is the advantage of using plasma-enhanced on...Ch. 29 - A) What is epitaxy? B) is it important for...Ch. 29 - Name four techniques for solution deposition onto...Ch. 29 - Name four roll-to-roll processing techniques for...Ch. 29 - What is a semiconductor?Ch. 29 - Name three common semiconductor materials.Ch. 29 - Give three reasons why silicon is the most popular...Ch. 29 - Prob. 62RQCh. 29 - What is a silicon boule?Ch. 29 - Prob. 64RQCh. 29 - What are some geometric concerns involved with...Ch. 29 - What is meant by the term doping?Ch. 29 - What is the difference between n�type and...Ch. 29 - Name three methods for doping a silicon wafer.Ch. 29 - Prob. 69RQCh. 29 - Prob. 70RQCh. 29 - Prob. 71RQCh. 29 - Why are rapid thermal processing technologies...Ch. 29 - What are two ways in which silicon dioxide is...Ch. 29 - Give two reasons why wet oxidation is better...Ch. 29 - What is a p�n junction? \What can it be used...Ch. 29 - Prob. 76RQCh. 29 - Assuming an n�doped substrate is clean, list the...Ch. 29 - What is planarization and why is it needed?Ch. 29 - What is meant by the term ULSI?Ch. 29 - In general, what technological breakthroughs were...Ch. 29 - What drives the increase in component density and...Ch. 29 - Why are clean rooms so important to...Ch. 29 - What is the advantage of electron microscopy over...Ch. 29 - What is the collective advantage of...Ch. 29 - Why do samples analyzed in an electron microscopes...Ch. 29 - What are two differences between a scanning...Ch. 29 - What is important about a dual�beam focused ion...Ch. 29 - Why is white light normally preferred for...Ch. 29 - What is one advantage of an atomic force...Ch. 29 - What is the breadth of scale of an automotive...Ch. 29 - What is the breadth of scale of a computer...Ch. 29 - Which has a larger breadth of scale, the...Ch. 29 - Prob. 4PCh. 29 - A piece of silicon has an integrated resistor...
Additional Engineering Textbook Solutions
Find more solutions based on key concepts
The force applied at the handle of the rigid lever causes the lever to rotate clockwise about the pin B through...
Statics and Mechanics of Materials (5th Edition)
Express each of the forces in Cartesian vector form and determine the magnitude and coordinate direction angles...
INTERNATIONAL EDITION---Engineering Mechanics: Statics, 14th edition (SI unit)
Water flows in a pipeline composed of 75-mm and 150-mm pipe. Calculate the mean velocity in the 75-mm pipe when...
Fox and McDonald's Introduction to Fluid Mechanics
23. We have made many measurements of coffee cooling in a ceramic coffee cup. We realize that as the coffee coo...
Thinking Like an Engineer: An Active Learning Approach (3rd Edition)
Determine the normal stress in each member of the truss structure. All joints are ball joint, and the material ...
Introduction To Finite Element Analysis And Design
Using Fig. 4-1, draw a conclusion about the comfort of a mixed group of men and women in typical seasonal cloth...
Heating Ventilating and Air Conditioning: Analysis and Design
Knowledge Booster
Learn more about
Need a deep-dive on the concept behind this application? Look no further. Learn more about this topic, mechanical-engineering and related others by exploring similar questions and additional content below.Similar questions
- Stereolithography is a additive manufacturing process. based foil O powder filament liquidarrow_forwardDifferentite between enclosure hoods, canopy hoods, and capturing hoods.arrow_forwardBased on the table below, which of the statements below is/are correct regarding the 3D printing process shown in the schematic? a.You can produce a room-temperature non-fragile 225C oven-safe food container with at least one material from the above table using this process and a 280C nozzle b.You can use this process to print plastic or brittle objects but not elastomers and rubbers c.Manufacturing a thermoplastic HDPE hose with an extrusion nozzle heated to 175C is possible with this process d.You can print thermoplastic and thermoset polymers with this process, you only need to make sure that the nozzle specs and the crosslinking conditions match the polymer requirements e.This process is best suited for the low volume production of tubes, bars and beams due to the nature of the extrusion processarrow_forward
- Based on the table below, which of the statements below is/are correct regarding the 3D printing process shown in the schematic? Z AXIS X AXIS YAXIS LEGEND A: Extruder B: Nozzle C: Printed part D: Hot plate E: Filament Table 15.2 Melting and Glass Transition Temperatures for Some of the More Common Polymeric Materials Material Polyethylene (low density) Polytetrafluoroethylene Polyethylene (high density) Polypropylene Nylon 6,6 Polyester (PET) Poly(vinyl chloride) Polystyrene Polycarbonate Glass Transition Temperature [°C (°F)] -110 (-165) -97 (-140) -90 (-130) -18 (0) 57 (135) 69 (155) 87 (190) 100 (212) 150 (300) Melting Temperature [°C (°F)] 115 (240) 327 (620) 137 (279) 175 (347) 265 (510) 265 (510) 212 (415) 240 (465) 265 (510) a. This process is best suited for the low volume production of tubes, bars and beams due to the nature of the extrusion process b. Manufacturing a thermoplastic HDPE hose with an extrusion nozzle heated to 175C is possible with this process □c. You can…arrow_forward5. For the process flow below in the yellow highlighted boxes: (i) Mark off location of mask and resist; Label the process step in (ii). Label the process step in (i). Label the process flow in (iv). LMark-off Expose location of resist Develop : =: and mask (left) Material Material iL Label this process step i. Label this process step Material w. Label this process step Dope, redeposit resist and re-do Materialarrow_forwardBriefly explain the steps involved in the dye penetrant processarrow_forward
- What is a Digital display device? Write any two examples of Digital display device.arrow_forwardAnswer each of the following questions in one to three sentences. (a) What is lithography field? (b) What is misalignment in lithography? (e) What is selectivity in an etching process? (d) What is end-point detection in an etching process?arrow_forwardChoose the best , fast please.arrow_forward
- What is the Significance of the study of Fuse 3d printing Using Pet bottles in the Environmentarrow_forward1. the impact that 'Be my Eyes" has on people with disabilities. 2. The impact " Assistive Touch" has on disabled people.arrow_forwardDiscuss the Passive Transducers and Active Transducers.arrow_forward
arrow_back_ios
SEE MORE QUESTIONS
arrow_forward_ios
Recommended textbooks for you
- Precision Machining Technology (MindTap Course Li...Mechanical EngineeringISBN:9781285444543Author:Peter J. Hoffman, Eric S. Hopewell, Brian JanesPublisher:Cengage Learning
Precision Machining Technology (MindTap Course Li...
Mechanical Engineering
ISBN:9781285444543
Author:Peter J. Hoffman, Eric S. Hopewell, Brian Janes
Publisher:Cengage Learning
The Refrigeration Cycle Explained - The Four Major Components; Author: HVAC Know It All;https://www.youtube.com/watch?v=zfciSvOZDUY;License: Standard YouTube License, CC-BY