DeGarmo's Materials and Processes in Manufacturing
12th Edition
ISBN: 9781118987674
Author: J. T. Black, Ronald A. Kohser
Publisher: WILEY
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Textbook Question
Chapter 29, Problem 16RQ
Name three purposes that a resist mask can play.
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100
As a spring is heated, its spring constant decreases. Suppose the spring is heated and then cooled so that the
spring constant at time t is k(t) = t sin + N/m. If the mass-spring system has mass m = 2 kg and a
damping constant b = 1 N-sec/m with initial conditions x(0) = 6 m and x'(0) = -5 m/sec and it is
subjected to the harmonic external force f (t) = 100 cos 3t N. Find at least the first four nonzero terms in
a power series expansion about t = 0, i.e. Maclaurin series expansion, for the displacement:
• Analytically (hand calculations)
Creating Simulink Model
Plot solutions for first two, three and four non-zero terms as well as the Simulink solution on the same graph
for the first 15 sec. The graph must be fully formatted by code.
Two springs and two masses are attached in a straight vertical line as shown in Figure Q3. The system is set
in motion by holding the mass m₂ at its equilibrium position and pushing the mass m₁ downwards of its
equilibrium position a distance 2 m and then releasing both masses. if m₁ = m² = 1 kg, k₁ = 3 N/m and
k₂ = 2 N/m.
(y₁ = 0)
www
k₁ = 3
Jm₁ = 1
k2=2
www
(Net change in
spring length
=32-31)
(y₂ = 0)
m₂ = 1
32
32
System in
static
equilibrium
System in
motion
Figure Q3 - Coupled mass-spring system
Determine the equations of motion y₁ (t) and y₂(t) for the two masses m₁ and m₂ respectively:
Analytically (hand calculations)
Using MATLAB Numerical Functions (ode45)
Creating Simulink Model
Produce an animation of the system for all solutions for the first minute.
Two large tanks, each holding 100 L of liquid, are interconnected by pipes, with the liquid flowing from tank
A into tank B at a rate of 3 L/min and from B into A at a rate of 1 L/min (see Figure Q1). The liquid inside each
tank is kept well stirred. A brine solution with a concentration of 0.2 kg/L of salt flows into tank A at a rate of
6 L/min. The diluted solution flows out of the system from tank A at 4 L/min and from tank B at 2 L/min. If,
initially, tank A contains pure water and tank B contains 20 kg of salt.
A
6 L/min
0.2 kg/L
x(t)
100 L
4 L/min
x(0) = 0 kg
3 L/min
1 L/min
B
y(t)
100 L
y(0) = 20 kg
2 L/min
Figure Q1 - Mixing problem for interconnected tanks
Determine the mass of salt in each tank at time t≥ 0:
Analytically (hand calculations)
Using MATLAB Numerical Functions (ode45)
Creating Simulink Model
Plot all solutions on the same graph for the first 15 min. The graph must be fully formatted by code.
Chapter 29 Solutions
DeGarmo's Materials and Processes in Manufacturing
Ch. 29 - Over the latter half of the 20th century, what...Ch. 29 - What was the major motivation for developing...Ch. 29 - Prob. 3RQCh. 29 - What is an example of a device feature that is...Ch. 29 - What type of manufacturing technology dominates...Ch. 29 - Name the four categories of miniature systems...Ch. 29 - Give two differences between lab-on-a-chip and...Ch. 29 - What is a scaling law?Ch. 29 - As the primary dimensions of an object decrease,...Ch. 29 - In the design of a water heater, the mean time...
Ch. 29 - Prob. 11RQCh. 29 - Name two conventional manufacturing processes that...Ch. 29 - Prob. 13RQCh. 29 - Why does breadth of scale of a product have an...Ch. 29 - What is the most complicated, expensive, and...Ch. 29 - Name three purposes that a resist mask can play.Ch. 29 - Name four key lithography methods.Ch. 29 - Name two through-mask lithography techniques.Ch. 29 - Name two direct-write lithography techniques.Ch. 29 - List the sequence of steps involved in...Ch. 29 - Of the two major classifications of photoresists,...Ch. 29 - List four requirements of a photoresist.Ch. 29 - What limits the resolution of a photoresist?Ch. 29 - What is meant by resist sensitivity?Ch. 29 - What is one requirement that contributes to the...Ch. 29 - List the three types of exposure methods used in...Ch. 29 - Why is projection printing equipment called a...Ch. 29 - What are typical materials etched during...Ch. 29 - What is etch bias?Ch. 29 - Prob. 30RQCh. 29 - What are some possible defects that can result...Ch. 29 - What are some possible defects that can result...Ch. 29 - List and describe two properties of etchants.Ch. 29 - What is etch anisotropy dependent upon?Ch. 29 - What is the difference between wet and dry?...Ch. 29 - What is dry etching?Ch. 29 - What are the three main categories of dry etching...Ch. 29 - What is the difference between plasma etching and...Ch. 29 - What is deep reactive ion etching?Ch. 29 - What is a benefit of using UV lasers to machine...Ch. 29 - Which type of non-lithographic micromachining...Ch. 29 - What are thin films?Ch. 29 - A) What is the difference between solution...Ch. 29 - What are the two broad categories of vapor...Ch. 29 - List two different types of physical vapor...Ch. 29 - List two advantages of sputtering over...Ch. 29 - What is meant by step coverage with regards to...Ch. 29 - Why is step coverage important?Ch. 29 - Prob. 49RQCh. 29 - What does gettering mean in relation to wafer...Ch. 29 - How are undesirable gas-phase reactions controlled...Ch. 29 - What is the key difference in the reactor designs...Ch. 29 - What are the two types of LPCVD reactor designs?...Ch. 29 - In metallization, what is the difference between a...Ch. 29 - What is the advantage of using plasma-enhanced on...Ch. 29 - A) What is epitaxy? B) is it important for...Ch. 29 - Name four techniques for solution deposition onto...Ch. 29 - Name four roll-to-roll processing techniques for...Ch. 29 - What is a semiconductor?Ch. 29 - Name three common semiconductor materials.Ch. 29 - Give three reasons why silicon is the most popular...Ch. 29 - Prob. 62RQCh. 29 - What is a silicon boule?Ch. 29 - Prob. 64RQCh. 29 - What are some geometric concerns involved with...Ch. 29 - What is meant by the term doping?Ch. 29 - What is the difference between n�type and...Ch. 29 - Name three methods for doping a silicon wafer.Ch. 29 - Prob. 69RQCh. 29 - Prob. 70RQCh. 29 - Prob. 71RQCh. 29 - Why are rapid thermal processing technologies...Ch. 29 - What are two ways in which silicon dioxide is...Ch. 29 - Give two reasons why wet oxidation is better...Ch. 29 - What is a p�n junction? \What can it be used...Ch. 29 - Prob. 76RQCh. 29 - Assuming an n�doped substrate is clean, list the...Ch. 29 - What is planarization and why is it needed?Ch. 29 - What is meant by the term ULSI?Ch. 29 - In general, what technological breakthroughs were...Ch. 29 - What drives the increase in component density and...Ch. 29 - Why are clean rooms so important to...Ch. 29 - What is the advantage of electron microscopy over...Ch. 29 - What is the collective advantage of...Ch. 29 - Why do samples analyzed in an electron microscopes...Ch. 29 - What are two differences between a scanning...Ch. 29 - What is important about a dual�beam focused ion...Ch. 29 - Why is white light normally preferred for...Ch. 29 - What is one advantage of an atomic force...Ch. 29 - What is the breadth of scale of an automotive...Ch. 29 - What is the breadth of scale of a computer...Ch. 29 - Which has a larger breadth of scale, the...Ch. 29 - Prob. 4PCh. 29 - A piece of silicon has an integrated resistor...
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