
DeGarmo's Materials and Processes in Manufacturing
12th Edition
ISBN: 9781118987674
Author: J. T. Black, Ronald A. Kohser
Publisher: WILEY
expand_more
expand_more
format_list_bulleted
Concept explainers
Textbook Question
Chapter 29, Problem 8RQ
What is a scaling law?
Expert Solution & Answer

Want to see the full answer?
Check out a sample textbook solution
Students have asked these similar questions
(read image, answer given)
6/86 The connecting rod AB of a certain internal-combustion engine weighs 1.2 lb with mass center at G
and has a radius of gyration about G of 1.12 in. The piston and piston pin A together weigh 1.80 lb. The
engine is running at a constant speed of 3000 rev/min, so that the angular velocity of the crank is
3000(2)/60 = 100л rad/sec. Neglect the weights of the components and the force exerted by the gas in
the cylinder compared with the dynamic forces generated and calculate the magnitude of the force on the
piston pin A for the crank angle 0 = 90°. (Suggestion: Use the alternative moment relation, Eq. 6/3, with B
as the moment center.)
Answer
A = 347 lb
3"
1.3"
B
1.7"
PROBLEM 6/86
6/85 In a study of head injury against the instrument panel of a car during sudden or crash stops where
lap belts without shoulder straps or airbags are used, the segmented human model shown in the figure is
analyzed. The hip joint O is assumed to remain fixed relative to the car, and the torso above the hip is
treated as a rigid body of mass m freely pivoted at O. The center of mass of the torso is at G with the initial
position of OG taken as vertical. The radius of gyration of the torso about O is ko. If the car is brought to a
sudden stop with a constant deceleration a, determine the speed v relative to the car with which the
model's head strikes the instrument panel. Substitute the values m = 50 kg, 7 = 450 mm, r = 800 mm, ko
= 550 mm, 0 = 45°, and a = 10g and compute v.
Answer
v = 11.73 m/s
PROBLEM 6/85
Chapter 29 Solutions
DeGarmo's Materials and Processes in Manufacturing
Ch. 29 - Over the latter half of the 20th century, what...Ch. 29 - What was the major motivation for developing...Ch. 29 - Prob. 3RQCh. 29 - What is an example of a device feature that is...Ch. 29 - What type of manufacturing technology dominates...Ch. 29 - Name the four categories of miniature systems...Ch. 29 - Give two differences between lab-on-a-chip and...Ch. 29 - What is a scaling law?Ch. 29 - As the primary dimensions of an object decrease,...Ch. 29 - In the design of a water heater, the mean time...
Ch. 29 - Prob. 11RQCh. 29 - Name two conventional manufacturing processes that...Ch. 29 - Prob. 13RQCh. 29 - Why does breadth of scale of a product have an...Ch. 29 - What is the most complicated, expensive, and...Ch. 29 - Name three purposes that a resist mask can play.Ch. 29 - Name four key lithography methods.Ch. 29 - Name two through-mask lithography techniques.Ch. 29 - Name two direct-write lithography techniques.Ch. 29 - List the sequence of steps involved in...Ch. 29 - Of the two major classifications of photoresists,...Ch. 29 - List four requirements of a photoresist.Ch. 29 - What limits the resolution of a photoresist?Ch. 29 - What is meant by resist sensitivity?Ch. 29 - What is one requirement that contributes to the...Ch. 29 - List the three types of exposure methods used in...Ch. 29 - Why is projection printing equipment called a...Ch. 29 - What are typical materials etched during...Ch. 29 - What is etch bias?Ch. 29 - Prob. 30RQCh. 29 - What are some possible defects that can result...Ch. 29 - What are some possible defects that can result...Ch. 29 - List and describe two properties of etchants.Ch. 29 - What is etch anisotropy dependent upon?Ch. 29 - What is the difference between wet and dry?...Ch. 29 - What is dry etching?Ch. 29 - What are the three main categories of dry etching...Ch. 29 - What is the difference between plasma etching and...Ch. 29 - What is deep reactive ion etching?Ch. 29 - What is a benefit of using UV lasers to machine...Ch. 29 - Which type of non-lithographic micromachining...Ch. 29 - What are thin films?Ch. 29 - A) What is the difference between solution...Ch. 29 - What are the two broad categories of vapor...Ch. 29 - List two different types of physical vapor...Ch. 29 - List two advantages of sputtering over...Ch. 29 - What is meant by step coverage with regards to...Ch. 29 - Why is step coverage important?Ch. 29 - Prob. 49RQCh. 29 - What does gettering mean in relation to wafer...Ch. 29 - How are undesirable gas-phase reactions controlled...Ch. 29 - What is the key difference in the reactor designs...Ch. 29 - What are the two types of LPCVD reactor designs?...Ch. 29 - In metallization, what is the difference between a...Ch. 29 - What is the advantage of using plasma-enhanced on...Ch. 29 - A) What is epitaxy? B) is it important for...Ch. 29 - Name four techniques for solution deposition onto...Ch. 29 - Name four roll-to-roll processing techniques for...Ch. 29 - What is a semiconductor?Ch. 29 - Name three common semiconductor materials.Ch. 29 - Give three reasons why silicon is the most popular...Ch. 29 - Prob. 62RQCh. 29 - What is a silicon boule?Ch. 29 - Prob. 64RQCh. 29 - What are some geometric concerns involved with...Ch. 29 - What is meant by the term doping?Ch. 29 - What is the difference between n�type and...Ch. 29 - Name three methods for doping a silicon wafer.Ch. 29 - Prob. 69RQCh. 29 - Prob. 70RQCh. 29 - Prob. 71RQCh. 29 - Why are rapid thermal processing technologies...Ch. 29 - What are two ways in which silicon dioxide is...Ch. 29 - Give two reasons why wet oxidation is better...Ch. 29 - What is a p�n junction? \What can it be used...Ch. 29 - Prob. 76RQCh. 29 - Assuming an n�doped substrate is clean, list the...Ch. 29 - What is planarization and why is it needed?Ch. 29 - What is meant by the term ULSI?Ch. 29 - In general, what technological breakthroughs were...Ch. 29 - What drives the increase in component density and...Ch. 29 - Why are clean rooms so important to...Ch. 29 - What is the advantage of electron microscopy over...Ch. 29 - What is the collective advantage of...Ch. 29 - Why do samples analyzed in an electron microscopes...Ch. 29 - What are two differences between a scanning...Ch. 29 - What is important about a dual�beam focused ion...Ch. 29 - Why is white light normally preferred for...Ch. 29 - What is one advantage of an atomic force...Ch. 29 - What is the breadth of scale of an automotive...Ch. 29 - What is the breadth of scale of a computer...Ch. 29 - Which has a larger breadth of scale, the...Ch. 29 - Prob. 4PCh. 29 - A piece of silicon has an integrated resistor...
Knowledge Booster
Learn more about
Need a deep-dive on the concept behind this application? Look no further. Learn more about this topic, mechanical-engineering and related others by exploring similar questions and additional content below.Similar questions
- Using AutoCADarrow_forward340 lb 340 lb Δarrow_forward4. In a table of vector differential operators, look up the expressions for V x V in a cylindrical coordinate system. (a) Compute the vorticity for the flow in a round tube where the velocity profile is = vo [1-(³] V₂ = Vo (b) Compute the vorticity for an ideal vortex where the velocity is Ve= r where constant. 2πг (c) Compute the vorticity in the vortex flow given by Ve= r 2лг 1- exp ( r² 4vt (d) Sketch all the velocity and vorticity profiles.arrow_forward
- In the figure, Neglects the heat loss and kinetic and potential energy changes, calculate the work produced by the turbine in kJ T = ??? Steam at P=3 MPa, T = 280°C Turbine Rigid tank V = 1000 m³ Turbine Rigid tank V = 100 m³ V = 1000 m³ V = 100 m³ The valve is opened. Initially: evacuated (empty) tank O a. 802.8 Initially: Closed valve O b. 572 O c. 159.93 Od. 415 e. 627.76 equilibriumarrow_forwardPlease find the torsional yield strength, the yield strength, the spring index, and the mean diameter. Use: E = 28.6 Mpsi, G = 11.5 Mpsi, A = 140 kpsi·in, m = 0.190, and relative cost= 1.arrow_forwardA viscoelastic column is made of a material with a creep compliance of D(t)= 0.75+0.5log10t+0.18(log10t)^2 GPA^-1 for t in s. If a constant compressive stress of σ0 = –100 MPa is applied at t = 0, how long will it take (= t1/2) for the height of the column to decrease to ½ its original value? Note: You will obtain multiple answers for this problem! One makes sense physically and one does not.arrow_forward
- A group of 23 power transistors, dissipating 2 W each, are to be cooled by attaching them to a black-anodized square aluminum plate and mounting the plate on the wall of a room at 30°C. The emissivity of the transistor and the plate surfaces is 0.9. Assuming the heat transfer from the back side of the plate to be negligible and the temperature of the surrounding surfaces to be the same as the air temperature of the room, determine the length of the square plate if the average surface temperature of the plate is not to exceed 50°C. Start the iteration process with an initial guess of the size of the plate as 43 cm. The properties of air at 1 atm and the film temperature of (Ts + T)/2 = (50 + 30)/2 = 40°C are k = 0.02662 W/m·°C, ν = 1.702 × 10–5 m2 /s, Pr = 0.7255, and β = 0.003195 K–1. Multiple Choice 0.473 m 0.284 m 0.513 m 0.671 marrow_forwardA 40-cm-diameter, 127-cm-high cylindrical hot water tank is located in the bathroom of a house maintained at 20°C. The surface temperature of the tank is measured to be 44°C and its emissivity is 0.4. Taking the surrounding surface temperature to be also 20°C, determine the rate of heat loss from all surfaces of the tank by natural convection and radiation. The properties of air at 32°C are k=0.02603 W/m-K, v=1.627 x 10-5 m²/s, Pr = 0.7276, and ẞ = 0.003279 K-1 The rate of heat loss from all surfaces of the tank by natural convection is The rate of heat loss from all surfaces of the tank by radiation is W. W.arrow_forwardA 2.5-m-long thin vertical plate is subjected to uniform heat flux on one side, while the other side is exposed to cool air at 5°C. The plate surface has an emissivity of 0.73, and its midpoint temperature is 55°C. Determine the heat flux subjected on the plate surface. Uniform heat flux -Plate, € = 0.73 Cool air 5°C 7 TSUIT Given: The properties of water at Tf,c= 30°C. k=0.02588 W/m.K, v=1.608 x 10-5 m²/s Pr = 0.7282 The heat flux subjected on the plate surface is W/m²arrow_forward
- Hot water is flowing at an average velocity of 5.82 ft/s through a cast iron pipe (k=30 Btu/h-ft-°F) whose inner and outer diameters are 1.0 in and 1.2 in, respectively. The pipe passes through a 50-ft-long section of a basement whose temperature is 60°F. The emissivity of the outer surface of the pipe is 0.5, and the walls of the basement are also at about 60°F. If the inlet temperature of the water is 150°F and the heat transfer coefficient on the inner surface of the pipe is 30 Btu/h-ft².°F, determine the temperature drop of water as it passes through the basement. Evaluate air properties at a film temperature of 105°C and 1 atm pressure. The properties of air at 1 atm and the film temperature of (Ts+ T∞)/2 = (150+60)/2 = 105°F are k=0.01541 Btu/h-ft-°F. v=0.1838 × 10-3 ft2/s, Pr = 0.7253, and ẞ = 0.00177R-1arrow_forwardhand-written solutions only, please. correct answers upvoted!arrow_forwardhand-written solutions only, please. correct answers upvoted!arrow_forward
arrow_back_ios
SEE MORE QUESTIONS
arrow_forward_ios
Recommended textbooks for you
- Electrical Transformers and Rotating MachinesMechanical EngineeringISBN:9781305494817Author:Stephen L. HermanPublisher:Cengage LearningAutomotive Technology: A Systems Approach (MindTa...Mechanical EngineeringISBN:9781133612315Author:Jack Erjavec, Rob ThompsonPublisher:Cengage LearningWelding: Principles and Applications (MindTap Cou...Mechanical EngineeringISBN:9781305494695Author:Larry JeffusPublisher:Cengage Learning

Electrical Transformers and Rotating Machines
Mechanical Engineering
ISBN:9781305494817
Author:Stephen L. Herman
Publisher:Cengage Learning

Automotive Technology: A Systems Approach (MindTa...
Mechanical Engineering
ISBN:9781133612315
Author:Jack Erjavec, Rob Thompson
Publisher:Cengage Learning

Welding: Principles and Applications (MindTap Cou...
Mechanical Engineering
ISBN:9781305494695
Author:Larry Jeffus
Publisher:Cengage Learning
Physics - Thermodynamics: (21 of 22) Change Of State: Process Summary; Author: Michel van Biezen;https://www.youtube.com/watch?v=AzmXVvxXN70;License: Standard Youtube License