DeGarmo's Materials and Processes in Manufacturing
12th Edition
ISBN: 9781118987674
Author: J. T. Black, Ronald A. Kohser
Publisher: WILEY
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Chapter 29, Problem 70RQ
To determine
The advantages of ion implantation over thermal diffusion.
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Multiple Choice
Circle the best answer to each statement.
1. Which geometry attribute deviation(s) can be limited
with a profile of a surface tolerance?
A. Location
B. Orientation
C.
Form
D.
All of the above
2. A true profile may be defined with:
A.
Basic radii
B. Basic angles
C. Formulas
D. All of the above
3. Which modifier may be applied to the profile tolerance
value?
A
B
C.
D. All of the above
4. The default tolerance zone for a profile tolerance is:
A. Non-uniform
B. Unilateral
C. Bilateral equal distribution
D. Bilateral-unequal distribution
5. An advantage of using a profile tolerance in place of a
coordinate tolerance is:
A. A bonus tolerance is permitted.
B. A datum feature sequence may be specified
C. A profile tolerance always controls size
D. All of the above
6. The shape of the tolerance zone for a profile tolerance is:
A. Two parallel planes
B. The same as the true profile of the toleranced
surface
C. Equal bilateral
D. Cylindrical when the diameter symbol is speci-
fied…
One thousand kg/h of a (50-50 wt%) acetone-in-water solution is to be extracted at 25C in a continuous,
countercurrent system with pure 1,1,2-trichloroethane to obtain a raffinate containing 10 wt% acetone. Using the
following equilibrium data, determine with an equilateral-triangle diagram:
a- the minimum flow rate of solvent;
b- the number of stages required for a solvent rate equal to 1.5 times minimum, and composition of each
streamleaving each stage.
c- Repeat the calculation of (a) and (b) if the solvent used has purity 93wt% (4wr% acetone, 3wt% water
impurities)
acetone water
1,1,2-trichloroethane
Raffinate. Weight
Extract. Weight
0.6
0.13
0.27
Fraction Acetone
Fraction Acetone
0.5
0.04
0.46
0.44
0.56
0.4
0.03
0.57
0.29
0.40
0.3
0.02
0.68
0.12
0.18
0.2
0.015
0.785
0.0
0.0
0.1
0.01
0.89
0.55
0.35
0.1
0.5
0.43
0.07
0.4
0.57
0.03
0.3
0.68
0.02
0.2
0.79
0.01
0.1
0.895
0.005
Chapter 29 Solutions
DeGarmo's Materials and Processes in Manufacturing
Ch. 29 - Over the latter half of the 20th century, what...Ch. 29 - What was the major motivation for developing...Ch. 29 - Prob. 3RQCh. 29 - What is an example of a device feature that is...Ch. 29 - What type of manufacturing technology dominates...Ch. 29 - Name the four categories of miniature systems...Ch. 29 - Give two differences between lab-on-a-chip and...Ch. 29 - What is a scaling law?Ch. 29 - As the primary dimensions of an object decrease,...Ch. 29 - In the design of a water heater, the mean time...
Ch. 29 - Prob. 11RQCh. 29 - Name two conventional manufacturing processes that...Ch. 29 - Prob. 13RQCh. 29 - Why does breadth of scale of a product have an...Ch. 29 - What is the most complicated, expensive, and...Ch. 29 - Name three purposes that a resist mask can play.Ch. 29 - Name four key lithography methods.Ch. 29 - Name two through-mask lithography techniques.Ch. 29 - Name two direct-write lithography techniques.Ch. 29 - List the sequence of steps involved in...Ch. 29 - Of the two major classifications of photoresists,...Ch. 29 - List four requirements of a photoresist.Ch. 29 - What limits the resolution of a photoresist?Ch. 29 - What is meant by resist sensitivity?Ch. 29 - What is one requirement that contributes to the...Ch. 29 - List the three types of exposure methods used in...Ch. 29 - Why is projection printing equipment called a...Ch. 29 - What are typical materials etched during...Ch. 29 - What is etch bias?Ch. 29 - Prob. 30RQCh. 29 - What are some possible defects that can result...Ch. 29 - What are some possible defects that can result...Ch. 29 - List and describe two properties of etchants.Ch. 29 - What is etch anisotropy dependent upon?Ch. 29 - What is the difference between wet and dry?...Ch. 29 - What is dry etching?Ch. 29 - What are the three main categories of dry etching...Ch. 29 - What is the difference between plasma etching and...Ch. 29 - What is deep reactive ion etching?Ch. 29 - What is a benefit of using UV lasers to machine...Ch. 29 - Which type of non-lithographic micromachining...Ch. 29 - What are thin films?Ch. 29 - A) What is the difference between solution...Ch. 29 - What are the two broad categories of vapor...Ch. 29 - List two different types of physical vapor...Ch. 29 - List two advantages of sputtering over...Ch. 29 - What is meant by step coverage with regards to...Ch. 29 - Why is step coverage important?Ch. 29 - Prob. 49RQCh. 29 - What does gettering mean in relation to wafer...Ch. 29 - How are undesirable gas-phase reactions controlled...Ch. 29 - What is the key difference in the reactor designs...Ch. 29 - What are the two types of LPCVD reactor designs?...Ch. 29 - In metallization, what is the difference between a...Ch. 29 - What is the advantage of using plasma-enhanced on...Ch. 29 - A) What is epitaxy? B) is it important for...Ch. 29 - Name four techniques for solution deposition onto...Ch. 29 - Name four roll-to-roll processing techniques for...Ch. 29 - What is a semiconductor?Ch. 29 - Name three common semiconductor materials.Ch. 29 - Give three reasons why silicon is the most popular...Ch. 29 - Prob. 62RQCh. 29 - What is a silicon boule?Ch. 29 - Prob. 64RQCh. 29 - What are some geometric concerns involved with...Ch. 29 - What is meant by the term doping?Ch. 29 - What is the difference between n�type and...Ch. 29 - Name three methods for doping a silicon wafer.Ch. 29 - Prob. 69RQCh. 29 - Prob. 70RQCh. 29 - Prob. 71RQCh. 29 - Why are rapid thermal processing technologies...Ch. 29 - What are two ways in which silicon dioxide is...Ch. 29 - Give two reasons why wet oxidation is better...Ch. 29 - What is a p�n junction? \What can it be used...Ch. 29 - Prob. 76RQCh. 29 - Assuming an n�doped substrate is clean, list the...Ch. 29 - What is planarization and why is it needed?Ch. 29 - What is meant by the term ULSI?Ch. 29 - In general, what technological breakthroughs were...Ch. 29 - What drives the increase in component density and...Ch. 29 - Why are clean rooms so important to...Ch. 29 - What is the advantage of electron microscopy over...Ch. 29 - What is the collective advantage of...Ch. 29 - Why do samples analyzed in an electron microscopes...Ch. 29 - What are two differences between a scanning...Ch. 29 - What is important about a dual�beam focused ion...Ch. 29 - Why is white light normally preferred for...Ch. 29 - What is one advantage of an atomic force...Ch. 29 - What is the breadth of scale of an automotive...Ch. 29 - What is the breadth of scale of a computer...Ch. 29 - Which has a larger breadth of scale, the...Ch. 29 - Prob. 4PCh. 29 - A piece of silicon has an integrated resistor...
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- 2500 kg/hr of (20-80) nicotine water solution is to be extracted with benzene containing 0.5% nicotine in the 1st and 2ed stages while the 3rd stage is free of nicotine. Cross- current operation is used with different amounts of solvent for each stages 2000kg/hr in the 1st stage, 2300 kg/hr in the 2nd stage, 2600 kg/hr in the 3rd, determine: - a- The final raffinate concentration and % extraction. b- b- The minimum amount of solvent required for counter-current operation if the minimum concentration will be reduced to 5% in the outlet raffinate. Equilibrium data Wt % Nicotine in water Wt % Nicotine in benzene 0 4 16 25 0 4 21 30arrow_forwardQuiz/An eccentrically loaded bracket is welded to the support as shown in Figure below. The load is static. The weld size for weld w1 is h1=6mm, for w2 h2 5mm, and for w3 is h3 -5.5 mm. Determine the safety factor (S.f) for the welds. F=22 kN. Use an AWS Electrode type (E90xx). 140 101.15 REDMI NOTE 8 PRO AI QUAD CAMERA Farrow_forward(read image)arrow_forward
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