One way to cool chips mounted on the circuit boards ofa computer is to encapsulate the boards in metal framesthat provide efficient pathways for conduction to supporting cold plates. Heat generated by the chips is thendissipated by transfer to water flowing through passages drilled in the plates. Because the plates are madefrom a metal of large thermal conductivity (typicallyaluminium or copper), they may he assumed to be at atemperature, T s , c p . (a) Consider circuit hoards attached to cold plates ofheight H = 75 0 mm and width L = 6 00 mm . eachwith N = 10 holes of diameter D = l 0 mm . Ifoperating conditions maintain plate temperatures of T s , c p = 32 ° C with water flow at m 1 = 0.2 Kg/s perpassage and T m , i = 7 ° C , how much heat may he dissipated by the Circuit boards? (b) To enhance cooling, thereby allowing increased power generation without an attendant increase insystem temperatures, a hybrid cooling scheme maybe used. The scheme involves forced airflow over theencapsulated circuit boards, as well as water flowthrough the cold plates. Consider conditions forwhich N c b = 10 circuit hoards of width W = 35 0 mm are attached to the cold plates and their average surface temperature is T s , c b = 47 ° C when T s , c p = 32 ° C . Ifair is in parallel flow over the plates with u ∞ = 10 m/sand T ∞ = 7 ° C , how much of the heat generated bythe circuit hoards is transferred to the air?
One way to cool chips mounted on the circuit boards ofa computer is to encapsulate the boards in metal framesthat provide efficient pathways for conduction to supporting cold plates. Heat generated by the chips is thendissipated by transfer to water flowing through passages drilled in the plates. Because the plates are madefrom a metal of large thermal conductivity (typicallyaluminium or copper), they may he assumed to be at atemperature, T s , c p . (a) Consider circuit hoards attached to cold plates ofheight H = 75 0 mm and width L = 6 00 mm . eachwith N = 10 holes of diameter D = l 0 mm . Ifoperating conditions maintain plate temperatures of T s , c p = 32 ° C with water flow at m 1 = 0.2 Kg/s perpassage and T m , i = 7 ° C , how much heat may he dissipated by the Circuit boards? (b) To enhance cooling, thereby allowing increased power generation without an attendant increase insystem temperatures, a hybrid cooling scheme maybe used. The scheme involves forced airflow over theencapsulated circuit boards, as well as water flowthrough the cold plates. Consider conditions forwhich N c b = 10 circuit hoards of width W = 35 0 mm are attached to the cold plates and their average surface temperature is T s , c b = 47 ° C when T s , c p = 32 ° C . Ifair is in parallel flow over the plates with u ∞ = 10 m/sand T ∞ = 7 ° C , how much of the heat generated bythe circuit hoards is transferred to the air?
Solution Summary: The author analyzes the heat dissipated from the circuit board. The mass flow rate of water is 0.2kg/s.
One way to cool chips mounted on the circuit boards ofa computer is to encapsulate the boards in metal framesthat provide efficient pathways for conduction to supporting cold plates. Heat generated by the chips is thendissipated by transfer to water flowing through passages drilled in the plates. Because the plates are madefrom a metal of large thermal conductivity (typicallyaluminium or copper), they may he assumed to be at atemperature,
T
s
,
c
p
.
(a) Consider circuit hoards attached to cold plates ofheight
H
=
75
0
mm
and width
L
=
6
00
mm
. eachwith N = 10 holes of diameter
D
=
l
0
mm
. Ifoperating conditions maintain plate temperatures of
T
s
,
c
p
=
32
°
C
with water flow at
m
1
=
0.2
Kg/s
perpassage and
T
m
,
i
=
7
°
C
, how much heat may he dissipated by the Circuit boards?
(b) To enhance cooling, thereby allowing increased power generation without an attendant increase insystem temperatures, a hybrid cooling scheme maybe used. The scheme involves forced airflow over theencapsulated circuit boards, as well as water flowthrough the cold plates. Consider conditions forwhich
N
c
b
=
10
circuit hoards of width
W
=
35
0
mm
are attached to the cold plates and their average surface temperature is
T
s
,
c
b
=
47
°
C
when
T
s
,
c
p
=
32
°
C
. Ifair is in parallel flow over the plates with
u
∞
=
10
m/sand
T
∞
=
7
°
C
, how much of the heat generated bythe circuit hoards is transferred to the air?
1. A 40 lb. force is applied at point E. There are pins at
A, B, C, D, and F and a roller at A.
a. Draw a FBD of member EFC showing all the known and
unknown forces acting on it.
b. Draw a FBD of member ABF showing all the known and
unknown forces acting on it.
c. Draw a FBD of member BCD showing all the known and
unknown forces acting on it.
d. Draw a FBD of the entire assembly ADE showing all the
known and unknown forces acting on it.
e. Determine the reactions at A and D.
f. Determine the magnitude of the pin reaction at C.
40 lbs.
B
A
6 in.
4 in.
D
F
-5 in.4 in 4.
A crude oil of specific gravity0.85 flows upward at a volumetric rate of flow of 70litres per
second through
a vertical
venturimeter,with an inlet diameter of 250 mm and a throat
diameter of 150mm. The coefficient
of discharge of venturimeter is 0.96. The vertical
differences betwecen the pressure toppings is
350mm.
i)
Draw a well labeled diagram to represent the above in formation
i)
If the two pressure gauges are connected at the tapings such that they are
positioned at the levels of their corresponding tapping points,
determine the
difference of readings in N/CM² of the two pressure gauges
ii)
If a mercury differential
manometer
is connected in place of pressure gauges,
to the tappings such that the connecting tube up to mercury are filled with oil
determine the difference in the level of mercury column.
Can you solve it analytically using laplace transforms and with Matlab code as well please. Thank You
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Principles of Heat Transfer (Activate Learning wi...Mechanical EngineeringISBN:9781305387102Author:Kreith, Frank; Manglik, Raj M.Publisher:Cengage Learning