One way to cool chips mounted on the circuit boards ofa computer is to encapsulate the boards in metal framesthat provide efficient pathways for conduction to supporting cold plates. Heat generated by the chips is thendissipated by transfer to water flowing through passages drilled in the plates. Because the plates are madefrom a metal of large thermal conductivity (typicallyaluminium or copper), they may he assumed to be at atemperature, T s , c p . (a) Consider circuit hoards attached to cold plates ofheight H = 75 0 mm and width L = 6 00 mm . eachwith N = 10 holes of diameter D = l 0 mm . Ifoperating conditions maintain plate temperatures of T s , c p = 32 ° C with water flow at m 1 = 0.2 Kg/s perpassage and T m , i = 7 ° C , how much heat may he dissipated by the Circuit boards? (b) To enhance cooling, thereby allowing increased power generation without an attendant increase insystem temperatures, a hybrid cooling scheme maybe used. The scheme involves forced airflow over theencapsulated circuit boards, as well as water flowthrough the cold plates. Consider conditions forwhich N c b = 10 circuit hoards of width W = 35 0 mm are attached to the cold plates and their average surface temperature is T s , c b = 47 ° C when T s , c p = 32 ° C . Ifair is in parallel flow over the plates with u ∞ = 10 m/sand T ∞ = 7 ° C , how much of the heat generated bythe circuit hoards is transferred to the air?
One way to cool chips mounted on the circuit boards ofa computer is to encapsulate the boards in metal framesthat provide efficient pathways for conduction to supporting cold plates. Heat generated by the chips is thendissipated by transfer to water flowing through passages drilled in the plates. Because the plates are madefrom a metal of large thermal conductivity (typicallyaluminium or copper), they may he assumed to be at atemperature, T s , c p . (a) Consider circuit hoards attached to cold plates ofheight H = 75 0 mm and width L = 6 00 mm . eachwith N = 10 holes of diameter D = l 0 mm . Ifoperating conditions maintain plate temperatures of T s , c p = 32 ° C with water flow at m 1 = 0.2 Kg/s perpassage and T m , i = 7 ° C , how much heat may he dissipated by the Circuit boards? (b) To enhance cooling, thereby allowing increased power generation without an attendant increase insystem temperatures, a hybrid cooling scheme maybe used. The scheme involves forced airflow over theencapsulated circuit boards, as well as water flowthrough the cold plates. Consider conditions forwhich N c b = 10 circuit hoards of width W = 35 0 mm are attached to the cold plates and their average surface temperature is T s , c b = 47 ° C when T s , c p = 32 ° C . Ifair is in parallel flow over the plates with u ∞ = 10 m/sand T ∞ = 7 ° C , how much of the heat generated bythe circuit hoards is transferred to the air?
Solution Summary: The author analyzes the heat dissipated from the circuit board. The mass flow rate of water is 0.2kg/s.
One way to cool chips mounted on the circuit boards ofa computer is to encapsulate the boards in metal framesthat provide efficient pathways for conduction to supporting cold plates. Heat generated by the chips is thendissipated by transfer to water flowing through passages drilled in the plates. Because the plates are madefrom a metal of large thermal conductivity (typicallyaluminium or copper), they may he assumed to be at atemperature,
T
s
,
c
p
.
(a) Consider circuit hoards attached to cold plates ofheight
H
=
75
0
mm
and width
L
=
6
00
mm
. eachwith N = 10 holes of diameter
D
=
l
0
mm
. Ifoperating conditions maintain plate temperatures of
T
s
,
c
p
=
32
°
C
with water flow at
m
1
=
0.2
Kg/s
perpassage and
T
m
,
i
=
7
°
C
, how much heat may he dissipated by the Circuit boards?
(b) To enhance cooling, thereby allowing increased power generation without an attendant increase insystem temperatures, a hybrid cooling scheme maybe used. The scheme involves forced airflow over theencapsulated circuit boards, as well as water flowthrough the cold plates. Consider conditions forwhich
N
c
b
=
10
circuit hoards of width
W
=
35
0
mm
are attached to the cold plates and their average surface temperature is
T
s
,
c
b
=
47
°
C
when
T
s
,
c
p
=
32
°
C
. Ifair is in parallel flow over the plates with
u
∞
=
10
m/sand
T
∞
=
7
°
C
, how much of the heat generated bythe circuit hoards is transferred to the air?
Please do not use any AI tools to solve this question.
I need a fully manual, step-by-step solution with clear explanations, as if it were done by a human tutor.
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This is an old practice exam. Fce = 110lb and FBCD = 62 lb but why
Quiz/An eccentrically loaded bracket is welded to the support as shown in Figure below. The load is static. The weld size
for weld w1 is h1 = 4mm, for w2 h2 = 6mm, and for w3 is h3 =6.5 mm. Determine the safety factor (S.f) for the welds.
F=29 kN. Use an AWS Electrode type (E100xx).
163 mm
S
133 mm
140 mm
Please solve the question above
I solved the question but I'm sure the answer is wrong
the link :
https://drive.google.com/file/d/1w5UD2EPDiaKSx3W33aj
Rv0olChuXtrQx/view?usp=sharing
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Principles of Heat Transfer (Activate Learning wi...Mechanical EngineeringISBN:9781305387102Author:Kreith, Frank; Manglik, Raj M.Publisher:Cengage Learning