Degarmo's Materials And Processes In Manufacturing
13th Edition
ISBN: 9781119492825
Author: Black, J. Temple, Kohser, Ronald A., Author.
Publisher: Wiley,
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Chapter 29, Problem 39RQ
What is deep reactive ion etching?
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العنوان
use only
Two rods fins) having same dimensions, one made orass (k = 85 Wm
K) and the mer of copper (k = 375 W/m K), having of their ends inserted
into a furna. At a section 10.5 cm a way from furnace, the temperature of
brass rod 120 Find the distance at which the ame temperature would be
reached in the per rod ? both ends are ex osed to the same environment.
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For the beam show below, draw A.F.D, S.F.D, B.M.D
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1. Two long rods of the same diameter-one made of brass (k=85w/m.k) and
the other made of copper (k=375 w/m.k) have one of their ends inserted
into a furnace (as shown in the following figure). Both rods are exposed to
the same environment. At a distance of 105 mm from the furnace, the
temperature of the brass rod is 120°C. At what distance from the furnace
will the same temperature be reached in the copper rod?
Furnace
105 mm T₁
Brass rod
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Copper rod
Chapter 29 Solutions
Degarmo's Materials And Processes In Manufacturing
Ch. 29 - Over the latter half of the 20th century, what...Ch. 29 - What was the major motivation for developing...Ch. 29 - Prob. 3RQCh. 29 - What is an example of a device feature that is...Ch. 29 - What type of manufacturing technology dominates...Ch. 29 - Name the four categories of miniature systems...Ch. 29 - Give two differences between lab-on-a-chip and...Ch. 29 - What is a scaling law?Ch. 29 - As the primary dimensions of an object decrease,...Ch. 29 - In the design of a water heater, the mean time...
Ch. 29 - Prob. 11RQCh. 29 - Name two conventional manufacturing processes that...Ch. 29 - Prob. 13RQCh. 29 - Why does breadth of scale of a product have an...Ch. 29 - What is the most complicated, expensive, and...Ch. 29 - Name three purposes that a resist mask can play.Ch. 29 - Name four key lithography methods.Ch. 29 - Name two through-mask lithography techniques.Ch. 29 - Name two direct-write lithography techniques.Ch. 29 - List the sequence of steps involved in...Ch. 29 - Of the two major classifications of photoresists,...Ch. 29 - List four requirements of a photoresist.Ch. 29 - What limits the resolution of a photoresist?Ch. 29 - What is meant by resist sensitivity?Ch. 29 - What is one requirement that contributes to the...Ch. 29 - List the three types of exposure methods used in...Ch. 29 - Why is projection printing equipment called a...Ch. 29 - What are typical materials etched during...Ch. 29 - What is etch bias?Ch. 29 - Prob. 30RQCh. 29 - What are some possible defects that can result...Ch. 29 - What are some possible defects that can result...Ch. 29 - List and describe two properties of etchants.Ch. 29 - What is etch anisotropy dependent upon?Ch. 29 - What is the difference between wet and dry?...Ch. 29 - What is dry etching?Ch. 29 - What are the three main categories of dry etching...Ch. 29 - What is the difference between plasma etching and...Ch. 29 - What is deep reactive ion etching?Ch. 29 - What is a benefit of using UV lasers to machine...Ch. 29 - Which type of non-lithographic micromachining...Ch. 29 - What are thin films?Ch. 29 - A) What is the difference between solution...Ch. 29 - What are the two broad categories of vapor...Ch. 29 - List two different types of physical vapor...Ch. 29 - List two advantages of sputtering over...Ch. 29 - What is meant by step coverage with regards to...Ch. 29 - Why is step coverage important?Ch. 29 - Prob. 49RQCh. 29 - What does gettering mean in relation to wafer...Ch. 29 - How are undesirable gas-phase reactions controlled...Ch. 29 - What is the key difference in the reactor designs...Ch. 29 - What are the two types of LPCVD reactor designs?...Ch. 29 - In metallization, what is the difference between a...Ch. 29 - What is the advantage of using plasma-enhanced on...Ch. 29 - A) What is epitaxy? B) is it important for...Ch. 29 - Name four techniques for solution deposition onto...Ch. 29 - Name four roll-to-roll processing techniques for...Ch. 29 - What is a semiconductor?Ch. 29 - Name three common semiconductor materials.Ch. 29 - Give three reasons why silicon is the most popular...Ch. 29 - Prob. 62RQCh. 29 - What is a silicon boule?Ch. 29 - Prob. 64RQCh. 29 - What are some geometric concerns involved with...Ch. 29 - What is meant by the term doping?Ch. 29 - What is the difference between n�type and...Ch. 29 - Name three methods for doping a silicon wafer.Ch. 29 - Prob. 69RQCh. 29 - Prob. 70RQCh. 29 - Prob. 71RQCh. 29 - Why are rapid thermal processing technologies...Ch. 29 - What are two ways in which silicon dioxide is...Ch. 29 - Give two reasons why wet oxidation is better...Ch. 29 - What is a p�n junction? \What can it be used...Ch. 29 - Prob. 76RQCh. 29 - Assuming an n�doped substrate is clean, list the...Ch. 29 - What is planarization and why is it needed?Ch. 29 - What is meant by the term ULSI?Ch. 29 - In general, what technological breakthroughs were...Ch. 29 - What drives the increase in component density and...Ch. 29 - Why are clean rooms so important to...Ch. 29 - What is the advantage of electron microscopy over...Ch. 29 - What is the collective advantage of...Ch. 29 - Why do samples analyzed in an electron microscopes...Ch. 29 - What are two differences between a scanning...Ch. 29 - What is important about a dual�beam focused ion...Ch. 29 - Why is white light normally preferred for...Ch. 29 - What is one advantage of an atomic force...Ch. 29 - What is the breadth of scale of an automotive...Ch. 29 - What is the breadth of scale of a computer...Ch. 29 - Which has a larger breadth of scale, the...Ch. 29 - Prob. 4PCh. 29 - A piece of silicon has an integrated resistor...Ch. 29 - Based on what you learned in problem #5, which...
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- : +0 العنوان use only Two rods fins) having same dimensions, one made orass (k = 85 Wm K) and the mer of copper (k = 375 W/m K), having of their ends inserted into a furna. At a section 10.5 cm a way from furnace, the temperature of brass rod 120 Find the distance at which the ame temperature would be reached in the per rod ? both ends are ex osed to the same environment. ns 2.05 ۲/۱ ostrararrow_forwardمشر on ۲/۱ Two rods (fins) having same dimensions, one made of brass(k=85 m K) and the other of copper (k = 375 W/m K), having one of their ends inserted into a furnace. At a section 10.5 cm a way from the furnace, the temperature brass rod 120°C. Find the distance at which the same temperature would be reached in the copper rod ? both ends are exposed to the same environment. 22.05 ofthearrow_forwardThe composite wall of oven with A= 1m² as in Fig.1 consists of three materials, two of with kA = 20 W/m K and kc = 50 W/m K with thickness, LA=0.3 m, L= 0.15 m and Lc 0.15 m. The inner surface temperature T1=900 K and the outer surface temperature T4 300 K, and an oven air temperature of To=1100 K, h=25 W/m². K. Determine kɛ and the temperatures T2 and T3 also draw the thermal resistance networkarrow_forward
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