Degarmo's Materials And Processes In Manufacturing
Degarmo's Materials And Processes In Manufacturing
13th Edition
ISBN: 9781119492825
Author: Black, J. Temple, Kohser, Ronald A., Author.
Publisher: Wiley,
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Chapter 29, Problem 28RQ

What are typical materials etched during semiconductor processing?

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Problem (17): water flowing in an open channel of a rectangular cross-section with width (b) transitions from a mild slope to a steep slope (i.e., from subcritical to supercritical flow) with normal water depths of (y₁) and (y2), respectively. Given the values of y₁ [m], y₂ [m], and b [m], calculate the discharge in the channel (Q) in [Lit/s]. Givens: y1 = 4.112 m y2 = 0.387 m b = 0.942 m Answers: ( 1 ) 1880.186 lit/s ( 2 ) 4042.945 lit/s ( 3 ) 2553.11 lit/s ( 4 ) 3130.448 lit/s
Problem (14): A pump is being used to lift water from an underground tank through a pipe of diameter (d) at discharge (Q). The total head loss until the pump entrance can be calculated as (h₁ = K[V²/2g]), h where (V) is the flow velocity in the pipe. The elevation difference between the pump and tank surface is (h). Given the values of h [cm], d [cm], and K [-], calculate the maximum discharge Q [Lit/s] beyond which cavitation would take place at the pump entrance. Assume Turbulent flow conditions. Givens: h = 120.31 cm d = 14.455 cm K = 8.976 Q Answers: (1) 94.917 lit/s (2) 49.048 lit/s ( 3 ) 80.722 lit/s 68.588 lit/s 4
Problem (13): A pump is being used to lift water from the bottom tank to the top tank in a galvanized iron pipe at a discharge (Q). The length and diameter of the pipe section from the bottom tank to the pump are (L₁) and (d₁), respectively. The length and diameter of the pipe section from the pump to the top tank are (L2) and (d2), respectively. Given the values of Q [L/s], L₁ [m], d₁ [m], L₂ [m], d₂ [m], calculate total head loss due to friction (i.e., major loss) in the pipe (hmajor-loss) in [cm]. Givens: L₁,d₁ Pump L₂,d2 오 0.533 lit/s L1 = 6920.729 m d1 = 1.065 m L2 = 70.946 m d2 0.072 m Answers: (1) 3.069 cm (2) 3.914 cm ( 3 ) 2.519 cm ( 4 ) 1.855 cm TABLE 8.1 Equivalent Roughness for New Pipes Pipe Riveted steel Concrete Wood stave Cast iron Galvanized iron Equivalent Roughness, & Feet Millimeters 0.003-0.03 0.9-9.0 0.001-0.01 0.3-3.0 0.0006-0.003 0.18-0.9 0.00085 0.26 0.0005 0.15 0.045 0.000005 0.0015 0.0 (smooth) 0.0 (smooth) Commercial steel or wrought iron 0.00015 Drawn…

Chapter 29 Solutions

Degarmo's Materials And Processes In Manufacturing

Ch. 29 - Prob. 11RQCh. 29 - Name two conventional manufacturing processes that...Ch. 29 - Prob. 13RQCh. 29 - Why does breadth of scale of a product have an...Ch. 29 - What is the most complicated, expensive, and...Ch. 29 - Name three purposes that a resist mask can play.Ch. 29 - Name four key lithography methods.Ch. 29 - Name two through-mask lithography techniques.Ch. 29 - Name two direct-write lithography techniques.Ch. 29 - List the sequence of steps involved in...Ch. 29 - Of the two major classifications of photoresists,...Ch. 29 - List four requirements of a photoresist.Ch. 29 - What limits the resolution of a photoresist?Ch. 29 - What is meant by resist sensitivity?Ch. 29 - What is one requirement that contributes to the...Ch. 29 - List the three types of exposure methods used in...Ch. 29 - Why is projection printing equipment called a...Ch. 29 - What are typical materials etched during...Ch. 29 - What is etch bias?Ch. 29 - Prob. 30RQCh. 29 - What are some possible defects that can result...Ch. 29 - What are some possible defects that can result...Ch. 29 - List and describe two properties of etchants.Ch. 29 - What is etch anisotropy dependent upon?Ch. 29 - What is the difference between wet and dry?...Ch. 29 - What is dry etching?Ch. 29 - What are the three main categories of dry etching...Ch. 29 - What is the difference between plasma etching and...Ch. 29 - What is deep reactive ion etching?Ch. 29 - What is a benefit of using UV lasers to machine...Ch. 29 - Which type of non-lithographic micromachining...Ch. 29 - What are thin films?Ch. 29 - A) What is the difference between solution...Ch. 29 - What are the two broad categories of vapor...Ch. 29 - List two different types of physical vapor...Ch. 29 - List two advantages of sputtering over...Ch. 29 - What is meant by step coverage with regards to...Ch. 29 - Why is step coverage important?Ch. 29 - Prob. 49RQCh. 29 - What does gettering mean in relation to wafer...Ch. 29 - How are undesirable gas-phase reactions controlled...Ch. 29 - What is the key difference in the reactor designs...Ch. 29 - What are the two types of LPCVD reactor designs?...Ch. 29 - In metallization, what is the difference between a...Ch. 29 - What is the advantage of using plasma-enhanced on...Ch. 29 - A) What is epitaxy? B) is it important for...Ch. 29 - Name four techniques for solution deposition onto...Ch. 29 - Name four roll-to-roll processing techniques for...Ch. 29 - What is a semiconductor?Ch. 29 - Name three common semiconductor materials.Ch. 29 - Give three reasons why silicon is the most popular...Ch. 29 - Prob. 62RQCh. 29 - What is a silicon boule?Ch. 29 - Prob. 64RQCh. 29 - What are some geometric concerns involved with...Ch. 29 - What is meant by the term doping?Ch. 29 - What is the difference between n�type and...Ch. 29 - Name three methods for doping a silicon wafer.Ch. 29 - Prob. 69RQCh. 29 - Prob. 70RQCh. 29 - Prob. 71RQCh. 29 - Why are rapid thermal processing technologies...Ch. 29 - What are two ways in which silicon dioxide is...Ch. 29 - Give two reasons why wet oxidation is better...Ch. 29 - What is a p�n junction? \What can it be used...Ch. 29 - Prob. 76RQCh. 29 - Assuming an n�doped substrate is clean, list the...Ch. 29 - What is planarization and why is it needed?Ch. 29 - What is meant by the term ULSI?Ch. 29 - In general, what technological breakthroughs were...Ch. 29 - What drives the increase in component density and...Ch. 29 - Why are clean rooms so important to...Ch. 29 - What is the advantage of electron microscopy over...Ch. 29 - What is the collective advantage of...Ch. 29 - Why do samples analyzed in an electron microscopes...Ch. 29 - What are two differences between a scanning...Ch. 29 - What is important about a dual�beam focused ion...Ch. 29 - Why is white light normally preferred for...Ch. 29 - What is one advantage of an atomic force...Ch. 29 - What is the breadth of scale of an automotive...Ch. 29 - What is the breadth of scale of a computer...Ch. 29 - Which has a larger breadth of scale, the...Ch. 29 - Prob. 4PCh. 29 - A piece of silicon has an integrated resistor...Ch. 29 - Based on what you learned in problem #5, which...
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