Degarmo's Materials And Processes In Manufacturing
13th Edition
ISBN: 9781119492825
Author: Black, J. Temple, Kohser, Ronald A., Author.
Publisher: Wiley,
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Chapter 29, Problem 36RQ
What is dry etching?
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Recall that the CWH equation involves two important assumptions. Let us investigate how these
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PROBLEM 2.50
1.8 m
The concrete post (E-25 GPa and a
=
9.9 x 10°/°C) is reinforced with six
steel bars, each of 22-mm diameter (E, = 200 GPa and a, = 11.7 x 10°/°C).
Determine the normal stresses induced in the steel and in the concrete by a
temperature rise of 35°C.
6c
"
0.391 MPa
240 mm
240 mm
6₁ =
-9.47 MPa
For some viscoelastic polymers that are subjected to stress relaxation tests, the stress decays with
time according to
a(t) = a(0) exp(-4)
(15.10)
where σ(t) and o(0) represent the time-dependent and initial (i.e., time = 0) stresses, respectively, and t and T denote
elapsed time and the relaxation time, respectively; T is a time-independent constant characteristic of the material. A
specimen of a viscoelastic polymer whose stress relaxation obeys Equation 15.10 was suddenly pulled in tension to
a measured strain of 0.5; the stress necessary to maintain this constant strain was measured as a function of time.
Determine E (10) for this material if the initial stress level was 3.5 MPa (500 psi), which dropped to 0.5 MPa (70
psi) after 30 s.
Chapter 29 Solutions
Degarmo's Materials And Processes In Manufacturing
Ch. 29 - Over the latter half of the 20th century, what...Ch. 29 - What was the major motivation for developing...Ch. 29 - Prob. 3RQCh. 29 - What is an example of a device feature that is...Ch. 29 - What type of manufacturing technology dominates...Ch. 29 - Name the four categories of miniature systems...Ch. 29 - Give two differences between lab-on-a-chip and...Ch. 29 - What is a scaling law?Ch. 29 - As the primary dimensions of an object decrease,...Ch. 29 - In the design of a water heater, the mean time...
Ch. 29 - Prob. 11RQCh. 29 - Name two conventional manufacturing processes that...Ch. 29 - Prob. 13RQCh. 29 - Why does breadth of scale of a product have an...Ch. 29 - What is the most complicated, expensive, and...Ch. 29 - Name three purposes that a resist mask can play.Ch. 29 - Name four key lithography methods.Ch. 29 - Name two through-mask lithography techniques.Ch. 29 - Name two direct-write lithography techniques.Ch. 29 - List the sequence of steps involved in...Ch. 29 - Of the two major classifications of photoresists,...Ch. 29 - List four requirements of a photoresist.Ch. 29 - What limits the resolution of a photoresist?Ch. 29 - What is meant by resist sensitivity?Ch. 29 - What is one requirement that contributes to the...Ch. 29 - List the three types of exposure methods used in...Ch. 29 - Why is projection printing equipment called a...Ch. 29 - What are typical materials etched during...Ch. 29 - What is etch bias?Ch. 29 - Prob. 30RQCh. 29 - What are some possible defects that can result...Ch. 29 - What are some possible defects that can result...Ch. 29 - List and describe two properties of etchants.Ch. 29 - What is etch anisotropy dependent upon?Ch. 29 - What is the difference between wet and dry?...Ch. 29 - What is dry etching?Ch. 29 - What are the three main categories of dry etching...Ch. 29 - What is the difference between plasma etching and...Ch. 29 - What is deep reactive ion etching?Ch. 29 - What is a benefit of using UV lasers to machine...Ch. 29 - Which type of non-lithographic micromachining...Ch. 29 - What are thin films?Ch. 29 - A) What is the difference between solution...Ch. 29 - What are the two broad categories of vapor...Ch. 29 - List two different types of physical vapor...Ch. 29 - List two advantages of sputtering over...Ch. 29 - What is meant by step coverage with regards to...Ch. 29 - Why is step coverage important?Ch. 29 - Prob. 49RQCh. 29 - What does gettering mean in relation to wafer...Ch. 29 - How are undesirable gas-phase reactions controlled...Ch. 29 - What is the key difference in the reactor designs...Ch. 29 - What are the two types of LPCVD reactor designs?...Ch. 29 - In metallization, what is the difference between a...Ch. 29 - What is the advantage of using plasma-enhanced on...Ch. 29 - A) What is epitaxy? B) is it important for...Ch. 29 - Name four techniques for solution deposition onto...Ch. 29 - Name four roll-to-roll processing techniques for...Ch. 29 - What is a semiconductor?Ch. 29 - Name three common semiconductor materials.Ch. 29 - Give three reasons why silicon is the most popular...Ch. 29 - Prob. 62RQCh. 29 - What is a silicon boule?Ch. 29 - Prob. 64RQCh. 29 - What are some geometric concerns involved with...Ch. 29 - What is meant by the term doping?Ch. 29 - What is the difference between n�type and...Ch. 29 - Name three methods for doping a silicon wafer.Ch. 29 - Prob. 69RQCh. 29 - Prob. 70RQCh. 29 - Prob. 71RQCh. 29 - Why are rapid thermal processing technologies...Ch. 29 - What are two ways in which silicon dioxide is...Ch. 29 - Give two reasons why wet oxidation is better...Ch. 29 - What is a p�n junction? \What can it be used...Ch. 29 - Prob. 76RQCh. 29 - Assuming an n�doped substrate is clean, list the...Ch. 29 - What is planarization and why is it needed?Ch. 29 - What is meant by the term ULSI?Ch. 29 - In general, what technological breakthroughs were...Ch. 29 - What drives the increase in component density and...Ch. 29 - Why are clean rooms so important to...Ch. 29 - What is the advantage of electron microscopy over...Ch. 29 - What is the collective advantage of...Ch. 29 - Why do samples analyzed in an electron microscopes...Ch. 29 - What are two differences between a scanning...Ch. 29 - What is important about a dual�beam focused ion...Ch. 29 - Why is white light normally preferred for...Ch. 29 - What is one advantage of an atomic force...Ch. 29 - What is the breadth of scale of an automotive...Ch. 29 - What is the breadth of scale of a computer...Ch. 29 - Which has a larger breadth of scale, the...Ch. 29 - Prob. 4PCh. 29 - A piece of silicon has an integrated resistor...Ch. 29 - Based on what you learned in problem #5, which...
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- This is an old practice exam question.arrow_forwardSteam enters the high-pressure turbine of a steam power plant that operates on the ideal reheat Rankine cycle at 700 psia and 900°F and leaves as saturated vapor. Steam is then reheated to 800°F before it expands to a pressure of 1 psia. Heat is transferred to the steam in the boiler at a rate of 6 × 104 Btu/s. Steam is cooled in the condenser by the cooling water from a nearby river, which enters the condenser at 45°F. Use steam tables. NOTE: This is a multi-part question. Once an answer is submitted, you will be unable to return to this part. Determine the pressure at which reheating takes place. Use steam tables. Find: The reheat pressure is psia. (P4)Find thermal efficiencyFind m dotarrow_forwardAir at T1 = 24°C, p1 = 1 bar, 50% relative humidity enters an insulated chamber operating at steady state with a mass flow rate of 3 kg/min and mixes with a saturated moist air stream entering at T2 = 7°C, p2 = 1 bar. A single mixed stream exits at T3 = 17°C, p3 = 1 bar. Neglect kinetic and potential energy effects Determine mass flow rate of the moist air entering at state 2, in kg/min Determine the relative humidity of the exiting stream. Determine the rate of entropy production, in kJ/min.Karrow_forward
- Air at T1 = 24°C, p1 = 1 bar, 50% relative humidity enters an insulated chamber operating at steady state with a mass flow rate of 3 kg/min and mixes with a saturated moist air stream entering at T2 = 7°C, p2 = 1 bar. A single mixed stream exits at T3 = 17°C, p3 = 1 bar. Neglect kinetic and potential energy effects Determine mass flow rate of the moist air entering at state 2, in kg/min Determine the relative humidity of the exiting stream. Determine the rate of entropy production, in kJ/min.Karrow_forwardAir at T1 = 24°C, p1 = 1 bar, 50% relative humidity enters an insulated chamber operating at steady state with a mass flow rate of 3 kg/min and mixes with a saturated moist air stream entering at T2 = 7°C, p2 = 1 bar. A single mixed stream exits at T3 = 17°C, p3 = 1 bar. Neglect kinetic and potential energy effects (a) Determine mass flow rate of the moist air entering at state 2, in kg/min (b) Determine the relative humidity of the exiting stream. (c) Determine the rate of entropy production, in kJ/min.Karrow_forwardA simple ideal Brayton cycle operates with air with minimum and maximum temperatures of 27°C and 727°C. It is designed so that the maximum cycle pressure is 2000 kPa and the minimum cycle pressure is 100 kPa. The isentropic efficiencies of the turbine and compressor are 91% and 80%, respectively, and there is a 50 kPa pressure drop across the combustion chamber. Determine the net work produced per unit mass of air each time this cycle is executed and the cycle’s thermal efficiency. Use constant specific heats at room temperature. The properties of air at room temperature are cp = 1.005 kJ/kg·K and k = 1.4. The fluid flow through the cycle is in a clockwise direction from point 1 to 4. Heat Q sub in is given to a component between points 2 and 3 of the cycle. Heat Q sub out is given out by a component between points 1 and 4. An arrow from the turbine labeled as W sub net points to the right. The net work produced per unit mass of air is kJ/kg. The thermal efficiency is %.arrow_forward
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