Degarmo's Materials And Processes In Manufacturing
13th Edition
ISBN: 9781119492825
Author: Black, J. Temple, Kohser, Ronald A., Author.
Publisher: Wiley,
expand_more
expand_more
format_list_bulleted
Textbook Question
Chapter 29, Problem 63RQ
What is a silicon boule?
Expert Solution & Answer
Want to see the full answer?
Check out a sample textbook solutionStudents have asked these similar questions
2. In lithography process, you are asked to deposit nanoparticle in holes. Select the process steps in order.
Resist
A metal
elching
Substrate
After development
SHiping
Nanomaterial
of resist
deposited in holes
wetChem cal)
(a) Striping resist Deposition of nanomaterial -Etching
(b) Etching - Deposition of nanomaterial Striping resist
(c) Deposition of nanomaterial- Striping resist Etching
Cmone
Does Czochralski crystal growth the only method for Si wafer production? What is the max. pull rate to obtain a 12-inch diameter Ge wafer
please answer quickly
Chapter 29 Solutions
Degarmo's Materials And Processes In Manufacturing
Ch. 29 - Over the latter half of the 20th century, what...Ch. 29 - What was the major motivation for developing...Ch. 29 - Prob. 3RQCh. 29 - What is an example of a device feature that is...Ch. 29 - What type of manufacturing technology dominates...Ch. 29 - Name the four categories of miniature systems...Ch. 29 - Give two differences between lab-on-a-chip and...Ch. 29 - What is a scaling law?Ch. 29 - As the primary dimensions of an object decrease,...Ch. 29 - In the design of a water heater, the mean time...
Ch. 29 - Prob. 11RQCh. 29 - Name two conventional manufacturing processes that...Ch. 29 - Prob. 13RQCh. 29 - Why does breadth of scale of a product have an...Ch. 29 - What is the most complicated, expensive, and...Ch. 29 - Name three purposes that a resist mask can play.Ch. 29 - Name four key lithography methods.Ch. 29 - Name two through-mask lithography techniques.Ch. 29 - Name two direct-write lithography techniques.Ch. 29 - List the sequence of steps involved in...Ch. 29 - Of the two major classifications of photoresists,...Ch. 29 - List four requirements of a photoresist.Ch. 29 - What limits the resolution of a photoresist?Ch. 29 - What is meant by resist sensitivity?Ch. 29 - What is one requirement that contributes to the...Ch. 29 - List the three types of exposure methods used in...Ch. 29 - Why is projection printing equipment called a...Ch. 29 - What are typical materials etched during...Ch. 29 - What is etch bias?Ch. 29 - Prob. 30RQCh. 29 - What are some possible defects that can result...Ch. 29 - What are some possible defects that can result...Ch. 29 - List and describe two properties of etchants.Ch. 29 - What is etch anisotropy dependent upon?Ch. 29 - What is the difference between wet and dry?...Ch. 29 - What is dry etching?Ch. 29 - What are the three main categories of dry etching...Ch. 29 - What is the difference between plasma etching and...Ch. 29 - What is deep reactive ion etching?Ch. 29 - What is a benefit of using UV lasers to machine...Ch. 29 - Which type of non-lithographic micromachining...Ch. 29 - What are thin films?Ch. 29 - A) What is the difference between solution...Ch. 29 - What are the two broad categories of vapor...Ch. 29 - List two different types of physical vapor...Ch. 29 - List two advantages of sputtering over...Ch. 29 - What is meant by step coverage with regards to...Ch. 29 - Why is step coverage important?Ch. 29 - Prob. 49RQCh. 29 - What does gettering mean in relation to wafer...Ch. 29 - How are undesirable gas-phase reactions controlled...Ch. 29 - What is the key difference in the reactor designs...Ch. 29 - What are the two types of LPCVD reactor designs?...Ch. 29 - In metallization, what is the difference between a...Ch. 29 - What is the advantage of using plasma-enhanced on...Ch. 29 - A) What is epitaxy? B) is it important for...Ch. 29 - Name four techniques for solution deposition onto...Ch. 29 - Name four roll-to-roll processing techniques for...Ch. 29 - What is a semiconductor?Ch. 29 - Name three common semiconductor materials.Ch. 29 - Give three reasons why silicon is the most popular...Ch. 29 - Prob. 62RQCh. 29 - What is a silicon boule?Ch. 29 - Prob. 64RQCh. 29 - What are some geometric concerns involved with...Ch. 29 - What is meant by the term doping?Ch. 29 - What is the difference between n�type and...Ch. 29 - Name three methods for doping a silicon wafer.Ch. 29 - Prob. 69RQCh. 29 - Prob. 70RQCh. 29 - Prob. 71RQCh. 29 - Why are rapid thermal processing technologies...Ch. 29 - What are two ways in which silicon dioxide is...Ch. 29 - Give two reasons why wet oxidation is better...Ch. 29 - What is a p�n junction? \What can it be used...Ch. 29 - Prob. 76RQCh. 29 - Assuming an n�doped substrate is clean, list the...Ch. 29 - What is planarization and why is it needed?Ch. 29 - What is meant by the term ULSI?Ch. 29 - In general, what technological breakthroughs were...Ch. 29 - What drives the increase in component density and...Ch. 29 - Why are clean rooms so important to...Ch. 29 - What is the advantage of electron microscopy over...Ch. 29 - What is the collective advantage of...Ch. 29 - Why do samples analyzed in an electron microscopes...Ch. 29 - What are two differences between a scanning...Ch. 29 - What is important about a dual�beam focused ion...Ch. 29 - Why is white light normally preferred for...Ch. 29 - What is one advantage of an atomic force...Ch. 29 - What is the breadth of scale of an automotive...Ch. 29 - What is the breadth of scale of a computer...Ch. 29 - Which has a larger breadth of scale, the...Ch. 29 - Prob. 4PCh. 29 - A piece of silicon has an integrated resistor...Ch. 29 - Based on what you learned in problem #5, which...
Knowledge Booster
Learn more about
Need a deep-dive on the concept behind this application? Look no further. Learn more about this topic, mechanical-engineering and related others by exploring similar questions and additional content below.Similar questions
- Draw schematically the XRD pattern of crystalline, amorphous and Nanocrystalline materials.arrow_forwardWhy is the unit cell concept important? (one sentence)arrow_forwardThe spacing between two adjacent (123) planes in a simple cubic crystal with the lattice parameter a=0.4 nm is _______ (nm). Draw [322] in a body centered cubic crystal. Draw (202) in a face centered cubic crystal. The planar density of (003) should be higher than that of (002) in a body centered cubic crystal. Ture___ or False____. You need to justify why to the answer.arrow_forward
- Compute linear density for Mo [101] in nm-1. Round your answer to 2 decimal place.arrow_forward1. Why does a metal generally have a higher electrical conductivity than a ceramic? 2. Give 2 reasons why fluorine has the highest electronegativity of any element. 3. Why does ice have a lower density than liquid water? 4. Why do FCC and HCP have identical atomic packing factors (0.74) if they have different crystal structures? 5. Why are Pearson symbols not sufficient to precisely describe all crystal structures?arrow_forward4. Poly-Si of the following structure is to be etched using a completely anisotropic dry-etch process, to remove poly-Si at a rate of 0.1 mm /min. However, this etching process has poor selectivities: selectivity to SiO₂ is 5; selectivity to photoresist is 2. (a) Sketch the cross-section after 5 minutes of etching. (b) Calculate the angle of the SiO₂ sidewalls after 5 minutes of etching. 0.lum oxide 1 um 0.7um Poly-Si I photoresist 0.5 umarrow_forward
- e) What are called semi-conductor ? What are the Characteristics of Semiconductors? Give any two application of semi-conductor? What are called bio materials and Write any two applications of Bio materials?arrow_forwardhow do u know to use molybdenum?arrow_forward0: (44 || 4 10:24 Nickel oxide (NiO) is a ceramic that has the same crystal structure as Nacl. Given: R(Ni2+)= 0.075 nm and R(02)=0.132 Calculate the lonic Packing Factor (IPF) of NiO? ONa C- center Select one: a. 0.14 O b. 0.47 c. 0.12 d. 0.74 e. 0.41 f. 0.51arrow_forward
arrow_back_ios
SEE MORE QUESTIONS
arrow_forward_ios
Recommended textbooks for you
- Automotive Technology: A Systems Approach (MindTa...Mechanical EngineeringISBN:9781133612315Author:Jack Erjavec, Rob ThompsonPublisher:Cengage LearningElectrical Transformers and Rotating MachinesMechanical EngineeringISBN:9781305494817Author:Stephen L. HermanPublisher:Cengage LearningUnderstanding Motor ControlsMechanical EngineeringISBN:9781337798686Author:Stephen L. HermanPublisher:Delmar Cengage Learning
- Welding: Principles and Applications (MindTap Cou...Mechanical EngineeringISBN:9781305494695Author:Larry JeffusPublisher:Cengage Learning
Automotive Technology: A Systems Approach (MindTa...
Mechanical Engineering
ISBN:9781133612315
Author:Jack Erjavec, Rob Thompson
Publisher:Cengage Learning
Electrical Transformers and Rotating Machines
Mechanical Engineering
ISBN:9781305494817
Author:Stephen L. Herman
Publisher:Cengage Learning
Understanding Motor Controls
Mechanical Engineering
ISBN:9781337798686
Author:Stephen L. Herman
Publisher:Delmar Cengage Learning
Welding: Principles and Applications (MindTap Cou...
Mechanical Engineering
ISBN:9781305494695
Author:Larry Jeffus
Publisher:Cengage Learning
Microelectronics Fabrication Center; Author: AnritsuCompany;https://www.youtube.com/watch?v=oDC6WWj3gmk;License: Standard Youtube License