Degarmo's Materials And Processes In Manufacturing
13th Edition
ISBN: 9781119492825
Author: Black, J. Temple, Kohser, Ronald A., Author.
Publisher: Wiley,
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Chapter 29, Problem 55RQ
What is the advantage of using plasma-enhanced on late-stage processing of interconnects?
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Two large tanks, each holding 100 L of liquid, are interconnected by pipes, with the liquid flowing from tank
A into tank B at a rate of 3 L/min and from B into A at a rate of 1 L/min (see Figure Q1). The liquid inside each
tank is kept well stirred. A brine solution with a concentration of 0.2 kg/L of salt flows into tank A at a rate of
6 L/min. The diluted solution flows out of the system from tank A at 4 L/min and from tank B at 2 L/min. If,
initially, tank A contains pure water and tank B contains 20 kg of salt.
A
6 L/min
0.2 kg/L
x(t)
100 L
4 L/min
x(0) = 0 kg
3 L/min
B
y(t)
100 L
y(0) = 20 kg
2 L/min
1 L/min
Figure Q1 - Mixing problem for interconnected tanks
Determine the mass of salt in each tank at time t > 0:
Analytically (hand calculations)
Two springs and two masses are attached in a straight vertical line as shown in Figure Q3. The system is set
in motion by holding the mass m₂ at its equilibrium position and pushing the mass m₁ downwards of its
equilibrium position a distance 2 m and then releasing both masses. if m₁ = m₂ = 1 kg, k₁ = 3 N/m and
k₂ = 2 N/m.
www.m
k₁ = 3
(y₁ = 0).
m₁ = 1
k2=2
(y₂ = 0)
|m₂ = 1
Y2
y 2
System in
static
equilibrium
(Net change in
spring length
=32-31)
System in
motion
Figure Q3 - Coupled mass-spring system
Determine the equations of motion y₁(t) and y₂(t) for the two masses m₁ and m₂ respectively:
Analytically (hand calculations)
100
As a spring is heated, its spring constant decreases. Suppose the spring is heated and then cooled so that the
spring constant at time t is k(t) = t sin N/m. If the mass-spring system has mass m = 2 kg and a
damping constant b = 1 N-sec/m with initial conditions x(0) = 6 m and x'(0) = -5 m/sec and it is
subjected to the harmonic external force f(t) = 100 cos 3t N. Find at least the first four nonzero terms in
a power series expansion about t = 0, i.e. Maclaurin series expansion, for the displacement:
Analytically (hand calculations)
Chapter 29 Solutions
Degarmo's Materials And Processes In Manufacturing
Ch. 29 - Over the latter half of the 20th century, what...Ch. 29 - What was the major motivation for developing...Ch. 29 - Prob. 3RQCh. 29 - What is an example of a device feature that is...Ch. 29 - What type of manufacturing technology dominates...Ch. 29 - Name the four categories of miniature systems...Ch. 29 - Give two differences between lab-on-a-chip and...Ch. 29 - What is a scaling law?Ch. 29 - As the primary dimensions of an object decrease,...Ch. 29 - In the design of a water heater, the mean time...
Ch. 29 - Prob. 11RQCh. 29 - Name two conventional manufacturing processes that...Ch. 29 - Prob. 13RQCh. 29 - Why does breadth of scale of a product have an...Ch. 29 - What is the most complicated, expensive, and...Ch. 29 - Name three purposes that a resist mask can play.Ch. 29 - Name four key lithography methods.Ch. 29 - Name two through-mask lithography techniques.Ch. 29 - Name two direct-write lithography techniques.Ch. 29 - List the sequence of steps involved in...Ch. 29 - Of the two major classifications of photoresists,...Ch. 29 - List four requirements of a photoresist.Ch. 29 - What limits the resolution of a photoresist?Ch. 29 - What is meant by resist sensitivity?Ch. 29 - What is one requirement that contributes to the...Ch. 29 - List the three types of exposure methods used in...Ch. 29 - Why is projection printing equipment called a...Ch. 29 - What are typical materials etched during...Ch. 29 - What is etch bias?Ch. 29 - Prob. 30RQCh. 29 - What are some possible defects that can result...Ch. 29 - What are some possible defects that can result...Ch. 29 - List and describe two properties of etchants.Ch. 29 - What is etch anisotropy dependent upon?Ch. 29 - What is the difference between wet and dry?...Ch. 29 - What is dry etching?Ch. 29 - What are the three main categories of dry etching...Ch. 29 - What is the difference between plasma etching and...Ch. 29 - What is deep reactive ion etching?Ch. 29 - What is a benefit of using UV lasers to machine...Ch. 29 - Which type of non-lithographic micromachining...Ch. 29 - What are thin films?Ch. 29 - A) What is the difference between solution...Ch. 29 - What are the two broad categories of vapor...Ch. 29 - List two different types of physical vapor...Ch. 29 - List two advantages of sputtering over...Ch. 29 - What is meant by step coverage with regards to...Ch. 29 - Why is step coverage important?Ch. 29 - Prob. 49RQCh. 29 - What does gettering mean in relation to wafer...Ch. 29 - How are undesirable gas-phase reactions controlled...Ch. 29 - What is the key difference in the reactor designs...Ch. 29 - What are the two types of LPCVD reactor designs?...Ch. 29 - In metallization, what is the difference between a...Ch. 29 - What is the advantage of using plasma-enhanced on...Ch. 29 - A) What is epitaxy? B) is it important for...Ch. 29 - Name four techniques for solution deposition onto...Ch. 29 - Name four roll-to-roll processing techniques for...Ch. 29 - What is a semiconductor?Ch. 29 - Name three common semiconductor materials.Ch. 29 - Give three reasons why silicon is the most popular...Ch. 29 - Prob. 62RQCh. 29 - What is a silicon boule?Ch. 29 - Prob. 64RQCh. 29 - What are some geometric concerns involved with...Ch. 29 - What is meant by the term doping?Ch. 29 - What is the difference between n�type and...Ch. 29 - Name three methods for doping a silicon wafer.Ch. 29 - Prob. 69RQCh. 29 - Prob. 70RQCh. 29 - Prob. 71RQCh. 29 - Why are rapid thermal processing technologies...Ch. 29 - What are two ways in which silicon dioxide is...Ch. 29 - Give two reasons why wet oxidation is better...Ch. 29 - What is a p�n junction? \What can it be used...Ch. 29 - Prob. 76RQCh. 29 - Assuming an n�doped substrate is clean, list the...Ch. 29 - What is planarization and why is it needed?Ch. 29 - What is meant by the term ULSI?Ch. 29 - In general, what technological breakthroughs were...Ch. 29 - What drives the increase in component density and...Ch. 29 - Why are clean rooms so important to...Ch. 29 - What is the advantage of electron microscopy over...Ch. 29 - What is the collective advantage of...Ch. 29 - Why do samples analyzed in an electron microscopes...Ch. 29 - What are two differences between a scanning...Ch. 29 - What is important about a dual�beam focused ion...Ch. 29 - Why is white light normally preferred for...Ch. 29 - What is one advantage of an atomic force...Ch. 29 - What is the breadth of scale of an automotive...Ch. 29 - What is the breadth of scale of a computer...Ch. 29 - Which has a larger breadth of scale, the...Ch. 29 - Prob. 4PCh. 29 - A piece of silicon has an integrated resistor...Ch. 29 - Based on what you learned in problem #5, which...
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