Degarmo's Materials And Processes In Manufacturing
13th Edition
ISBN: 9781119492825
Author: Black, J. Temple, Kohser, Ronald A., Author.
Publisher: Wiley,
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Textbook Question
Chapter 29, Problem 75RQ
What is a p�n junction? \What can it be used for?
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Chapter 29 Solutions
Degarmo's Materials And Processes In Manufacturing
Ch. 29 - Over the latter half of the 20th century, what...Ch. 29 - What was the major motivation for developing...Ch. 29 - Prob. 3RQCh. 29 - What is an example of a device feature that is...Ch. 29 - What type of manufacturing technology dominates...Ch. 29 - Name the four categories of miniature systems...Ch. 29 - Give two differences between lab-on-a-chip and...Ch. 29 - What is a scaling law?Ch. 29 - As the primary dimensions of an object decrease,...Ch. 29 - In the design of a water heater, the mean time...
Ch. 29 - Prob. 11RQCh. 29 - Name two conventional manufacturing processes that...Ch. 29 - Prob. 13RQCh. 29 - Why does breadth of scale of a product have an...Ch. 29 - What is the most complicated, expensive, and...Ch. 29 - Name three purposes that a resist mask can play.Ch. 29 - Name four key lithography methods.Ch. 29 - Name two through-mask lithography techniques.Ch. 29 - Name two direct-write lithography techniques.Ch. 29 - List the sequence of steps involved in...Ch. 29 - Of the two major classifications of photoresists,...Ch. 29 - List four requirements of a photoresist.Ch. 29 - What limits the resolution of a photoresist?Ch. 29 - What is meant by resist sensitivity?Ch. 29 - What is one requirement that contributes to the...Ch. 29 - List the three types of exposure methods used in...Ch. 29 - Why is projection printing equipment called a...Ch. 29 - What are typical materials etched during...Ch. 29 - What is etch bias?Ch. 29 - Prob. 30RQCh. 29 - What are some possible defects that can result...Ch. 29 - What are some possible defects that can result...Ch. 29 - List and describe two properties of etchants.Ch. 29 - What is etch anisotropy dependent upon?Ch. 29 - What is the difference between wet and dry?...Ch. 29 - What is dry etching?Ch. 29 - What are the three main categories of dry etching...Ch. 29 - What is the difference between plasma etching and...Ch. 29 - What is deep reactive ion etching?Ch. 29 - What is a benefit of using UV lasers to machine...Ch. 29 - Which type of non-lithographic micromachining...Ch. 29 - What are thin films?Ch. 29 - A) What is the difference between solution...Ch. 29 - What are the two broad categories of vapor...Ch. 29 - List two different types of physical vapor...Ch. 29 - List two advantages of sputtering over...Ch. 29 - What is meant by step coverage with regards to...Ch. 29 - Why is step coverage important?Ch. 29 - Prob. 49RQCh. 29 - What does gettering mean in relation to wafer...Ch. 29 - How are undesirable gas-phase reactions controlled...Ch. 29 - What is the key difference in the reactor designs...Ch. 29 - What are the two types of LPCVD reactor designs?...Ch. 29 - In metallization, what is the difference between a...Ch. 29 - What is the advantage of using plasma-enhanced on...Ch. 29 - A) What is epitaxy? B) is it important for...Ch. 29 - Name four techniques for solution deposition onto...Ch. 29 - Name four roll-to-roll processing techniques for...Ch. 29 - What is a semiconductor?Ch. 29 - Name three common semiconductor materials.Ch. 29 - Give three reasons why silicon is the most popular...Ch. 29 - Prob. 62RQCh. 29 - What is a silicon boule?Ch. 29 - Prob. 64RQCh. 29 - What are some geometric concerns involved with...Ch. 29 - What is meant by the term doping?Ch. 29 - What is the difference between n�type and...Ch. 29 - Name three methods for doping a silicon wafer.Ch. 29 - Prob. 69RQCh. 29 - Prob. 70RQCh. 29 - Prob. 71RQCh. 29 - Why are rapid thermal processing technologies...Ch. 29 - What are two ways in which silicon dioxide is...Ch. 29 - Give two reasons why wet oxidation is better...Ch. 29 - What is a p�n junction? \What can it be used...Ch. 29 - Prob. 76RQCh. 29 - Assuming an n�doped substrate is clean, list the...Ch. 29 - What is planarization and why is it needed?Ch. 29 - What is meant by the term ULSI?Ch. 29 - In general, what technological breakthroughs were...Ch. 29 - What drives the increase in component density and...Ch. 29 - Why are clean rooms so important to...Ch. 29 - What is the advantage of electron microscopy over...Ch. 29 - What is the collective advantage of...Ch. 29 - Why do samples analyzed in an electron microscopes...Ch. 29 - What are two differences between a scanning...Ch. 29 - What is important about a dual�beam focused ion...Ch. 29 - Why is white light normally preferred for...Ch. 29 - What is one advantage of an atomic force...Ch. 29 - What is the breadth of scale of an automotive...Ch. 29 - What is the breadth of scale of a computer...Ch. 29 - Which has a larger breadth of scale, the...Ch. 29 - Prob. 4PCh. 29 - A piece of silicon has an integrated resistor...Ch. 29 - Based on what you learned in problem #5, which...
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- Problem 2 (55 pts). We now consider the FEM solution of Problem 1.(a) [5pts] Briefly describe the 4 steps necessary to obtain the approximate solution of thatBVP using the Galerkin FEM. Use the minimum amount of math necessary to supportyour explanations.(b) [20pts] Derive the weak form of the BVP.(c) [10pts] Assuming a mesh of two equal elements and linear shape functions, sketch byhand how you expect the FEM solution to look like. Also sketch the analytical solutionfor comparison. In your sketch, identify the nodal degrees of freedom that the FEMsolution seeks to find.(d) [10pts] By analogy with the elastic rod problem and heat conduction problem considered in class, write down the stiffness matrix and force vector for each of the twoelements considered in (c).(e) [10pts] Assemble the global system of equations, and verbally explain how to solve it.arrow_forwardAn aluminum rod of length L = 1m has mass density ρ = 2700 kgm3 andYoung’s modulus E = 70GPa. The rod is fixed at both ends. The exactnatural eigenfrequencies of the rod are ωexactn =πnLqEρfor n=1,2,3,. . . .1. What is the minimum number of linear elements necessary todetermine the fundamental frequency ω1 of the system? Discretizethe rod in that many elements of equal length, assemble the globalsystem of equations KU = ω2MU, and find the fundamentalfrequency ω1. Compute the relative error e1 = (ω1 − ωexact1)/ωexact1.Sketch the fundamental mode of vibration.arrow_forwardProblem 1 (65 pts, suggested time 50 mins). An elastic string of constant line tension1T is pinned at x = 0 and x = L. A constant distributed vertical force per unit length p(with units N/m) is applied to the string. Under this force, the string deflects by an amountv(x) from its undeformed (horizontal) state, as shown in the figure below.The PDE describing mechanical equilibrium for the string isddx Tdvdx− p = 0 . (1)(a) [5pts] Identify the BCs for the string and identify their type (essential/natural). Writedown the strong-form BVP for the string, including PDE and BCs.(b) [10pts] Find the analytical solution of the BVP in (a). Compute the exact deflectionof the midpoint v(L/2).(c) [15pts] Derive the weak-form BVP.(d) [5pts] What is the minimum number of linear elements necessary to compute the deflection of the midpoint?(e) [15pts] Write down the element stiffness matrix and the element force vector for eachelement.arrow_forward
- Problem 1 (35 pts). An elastic string of constant line tension1 T is pinned at x = 0 andx = L. A constant distributed vertical force per unit length p (with units N/m) is appliedto the string. Under this force, the string deflects by an amount v(x) from its undeformed(horizontal) state, as shown in the figure below.Force equilibrium in the string requires thatdfdx − p = 0 , (1)where f(x) is the internal vertical force in the string, which is given byf = Tdvdx . (2)(a) [10pts] Write down the BVP (strong form) that the string deflection v(x) must satisfy.(b) [2pts] What order is the governing PDE in the BVP of (a)?(c) [3pts] Identify the type (essential/natural) of each boundary condition in (a).(d) [20pts] Find the analytical solution of the BVP in (a).arrow_forwardProblem 2 (25 pts, (suggested time 15 mins). An elastic string of line tension T andmass per unit length µ is pinned at x = 0 and x = L. The string is free to vibrate, and itsfirst vibration mode is shown below.In order to find the frequency of the first mode (or fundamental frequency), the string isdiscretized into a certain number of linear elements. The stiffness and mass matrices of thei-th element are, respectivelyESMi =TLi1 −1−1 1 EMMi =Liµ62 11 2 . (2)(a) [5pts] What is the minimum number of linear elements necessary to compute the fundamental frequency of the vibrating string?(b) [20pts] Assemble the global eigenvalue problem and find the fundamental frequency ofvibration of the stringarrow_forwardI need part all parts please in detail (including f)arrow_forward
- Problem 3 (10 pts, suggested time 5 mins). In class we considered the mutiphysics problem of thermal stresses in a rod. When using linear shape functions, we found that the stress in the rod is affected by unphysical oscillations like in the following plot E*(ux-a*T) 35000 30000 25000 20000 15000 10000 5000 -5000 -10000 0 Line Graph: E*(ux-a*T) MULT 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Arc length (a) [10pts] What is the origin of this issue and how can we fix it?arrow_forwardanswer the questions and explain all of it in words. Ignore where it says screencast and in class explanationarrow_forwardB5 Please help on the attached question.arrow_forward
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