Degarmo's Materials And Processes In Manufacturing
13th Edition
ISBN: 9781119492825
Author: Black, J. Temple, Kohser, Ronald A., Author.
Publisher: Wiley,
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Chapter 29, Problem 35RQ
What is the difference between “wet” and “dry?” etching?
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Fresh air at 21.1 C in which partial
pressure of water vapor is 0.018
atmosphere is blown at the rate of 214
m3/h first through a preheater and then
adiabatically saturated in spray chambers
to 100% saturation and again reheated
this reheated air has humidity of 0.024 kg
water vapor per kg dry air. It is assumed
that the fresh air and the air leaving the
re-heater have the same percentage
humidity.
Determine:-
a- The temperature of preheater,
spray-chamber and re-heater
b- Heat requirement for preheating and
re-heating
11:39 م
The answer to the problem is 7.24 N. Please show me how to get the final answer
The answer to the problem is 17.9N. Please show me how to get the final answer
Chapter 29 Solutions
Degarmo's Materials And Processes In Manufacturing
Ch. 29 - Over the latter half of the 20th century, what...Ch. 29 - What was the major motivation for developing...Ch. 29 - Prob. 3RQCh. 29 - What is an example of a device feature that is...Ch. 29 - What type of manufacturing technology dominates...Ch. 29 - Name the four categories of miniature systems...Ch. 29 - Give two differences between lab-on-a-chip and...Ch. 29 - What is a scaling law?Ch. 29 - As the primary dimensions of an object decrease,...Ch. 29 - In the design of a water heater, the mean time...
Ch. 29 - Prob. 11RQCh. 29 - Name two conventional manufacturing processes that...Ch. 29 - Prob. 13RQCh. 29 - Why does breadth of scale of a product have an...Ch. 29 - What is the most complicated, expensive, and...Ch. 29 - Name three purposes that a resist mask can play.Ch. 29 - Name four key lithography methods.Ch. 29 - Name two through-mask lithography techniques.Ch. 29 - Name two direct-write lithography techniques.Ch. 29 - List the sequence of steps involved in...Ch. 29 - Of the two major classifications of photoresists,...Ch. 29 - List four requirements of a photoresist.Ch. 29 - What limits the resolution of a photoresist?Ch. 29 - What is meant by resist sensitivity?Ch. 29 - What is one requirement that contributes to the...Ch. 29 - List the three types of exposure methods used in...Ch. 29 - Why is projection printing equipment called a...Ch. 29 - What are typical materials etched during...Ch. 29 - What is etch bias?Ch. 29 - Prob. 30RQCh. 29 - What are some possible defects that can result...Ch. 29 - What are some possible defects that can result...Ch. 29 - List and describe two properties of etchants.Ch. 29 - What is etch anisotropy dependent upon?Ch. 29 - What is the difference between wet and dry?...Ch. 29 - What is dry etching?Ch. 29 - What are the three main categories of dry etching...Ch. 29 - What is the difference between plasma etching and...Ch. 29 - What is deep reactive ion etching?Ch. 29 - What is a benefit of using UV lasers to machine...Ch. 29 - Which type of non-lithographic micromachining...Ch. 29 - What are thin films?Ch. 29 - A) What is the difference between solution...Ch. 29 - What are the two broad categories of vapor...Ch. 29 - List two different types of physical vapor...Ch. 29 - List two advantages of sputtering over...Ch. 29 - What is meant by step coverage with regards to...Ch. 29 - Why is step coverage important?Ch. 29 - Prob. 49RQCh. 29 - What does gettering mean in relation to wafer...Ch. 29 - How are undesirable gas-phase reactions controlled...Ch. 29 - What is the key difference in the reactor designs...Ch. 29 - What are the two types of LPCVD reactor designs?...Ch. 29 - In metallization, what is the difference between a...Ch. 29 - What is the advantage of using plasma-enhanced on...Ch. 29 - A) What is epitaxy? B) is it important for...Ch. 29 - Name four techniques for solution deposition onto...Ch. 29 - Name four roll-to-roll processing techniques for...Ch. 29 - What is a semiconductor?Ch. 29 - Name three common semiconductor materials.Ch. 29 - Give three reasons why silicon is the most popular...Ch. 29 - Prob. 62RQCh. 29 - What is a silicon boule?Ch. 29 - Prob. 64RQCh. 29 - What are some geometric concerns involved with...Ch. 29 - What is meant by the term doping?Ch. 29 - What is the difference between n�type and...Ch. 29 - Name three methods for doping a silicon wafer.Ch. 29 - Prob. 69RQCh. 29 - Prob. 70RQCh. 29 - Prob. 71RQCh. 29 - Why are rapid thermal processing technologies...Ch. 29 - What are two ways in which silicon dioxide is...Ch. 29 - Give two reasons why wet oxidation is better...Ch. 29 - What is a p�n junction? \What can it be used...Ch. 29 - Prob. 76RQCh. 29 - Assuming an n�doped substrate is clean, list the...Ch. 29 - What is planarization and why is it needed?Ch. 29 - What is meant by the term ULSI?Ch. 29 - In general, what technological breakthroughs were...Ch. 29 - What drives the increase in component density and...Ch. 29 - Why are clean rooms so important to...Ch. 29 - What is the advantage of electron microscopy over...Ch. 29 - What is the collective advantage of...Ch. 29 - Why do samples analyzed in an electron microscopes...Ch. 29 - What are two differences between a scanning...Ch. 29 - What is important about a dual�beam focused ion...Ch. 29 - Why is white light normally preferred for...Ch. 29 - What is one advantage of an atomic force...Ch. 29 - What is the breadth of scale of an automotive...Ch. 29 - What is the breadth of scale of a computer...Ch. 29 - Which has a larger breadth of scale, the...Ch. 29 - Prob. 4PCh. 29 - A piece of silicon has an integrated resistor...Ch. 29 - Based on what you learned in problem #5, which...
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- The answer to the problem is 2.93 ft/s. Please show me how to get the final answerarrow_forwardExample(3): 0.15 kg/s steam at atmospheric pressure and superheated to 400 K is bled into an air stream at 320 K and 20 per cent relative humidity. What is the temperature, enthalpy, and relative humidity of the mixed stream if the air is flowing at 5 kg/ s? How much steam would be required to provide an exit temperature of 330 K and what would be the humidity of this mixture? 11:39 مarrow_forwardThe answer to the problem is 31.3rad/s. Please show me how to get the final answerarrow_forward
- A cylindrical tank of diameter D is currently filled with water to a height h, as shown in the figure to the right. Water enters the tank through the pipe at (1) with a cross-sectional area A₁ and a uniform velocity V₁. The height of water in the tank is increasing at a constant rate of 5 mm/s. Given the parameters below, find the volumetric flow rate in the pipe at (2), V2, in cm³/s, and classify it as an inflow or outflow. D = 20 cm h = 0.5 m A₁ = 1 cm² V₁ = 0.1 m/s h 1 V₁ D Pwater = 1,000 kg/m³ V2 2arrow_forwardThe answer to the problem is 2.33 rad/s. Please show me how to get the final answerarrow_forwardThe answer to the problem is 0.14 rad/s. Please show me how to get the final answerarrow_forward
- Marks) culate numerically the temperatures of the internal s shown in Fig. 3. The temperature of all boundaries is and the circle (arc) radius is 3m. The temperature PDE is: эт дх + ат 0. 3 = 2 ду Ay -3m Fig. (3)arrow_forwardThe answer to the problem is 58.7 ft/s^2. Please show me how to get the final answerarrow_forwardThe answer to the problem is 21.4 rad/s. Please show me how to get the final answerarrow_forward
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