Manufacturing Engineering & Technology
7th Edition
ISBN: 9780133128741
Author: Serope Kalpakjian, Steven Schmid
Publisher: Prentice Hall
expand_more
expand_more
format_list_bulleted
Videos
Textbook Question
Chapter 28, Problem 22QLP
The table that follows describes three wafer-manufacturing changes: increasing the wafer diameter, reducing the chip size, and increasing process complexity. Complete the table by filling in “increase,” “decrease,” or “no change,” and indicate the effect that each change would have on the wafer yield and on the overall number of functional chips.
| Change | Wafer yield | Number of functional chips |
| Increase wafer diameter Reduce chip size Increase process complexity |
Expert Solution & Answer
Want to see the full answer?
Check out a sample textbook solution
Students have asked these similar questions
Multiple-Choice Questions
In 4D printing, what is the fourth dimension?
A. Space
B. Movement
C. Time
D. Material
What inspired the team at the MIT self-assembly lab to conceive the Autonomous
Mass Assembly concept?
A. The natural growth of viruses
B. Japanese architecture
C.
Islamic patterns in traditional ornaments
D. The movie "Avatar"
Which of the following are possible applications of 4D printing? Select all correct
answers.
A. Smart water pipes
B. Self-assembled structures
C. Ready-made electronic devices
D. Superior sound systems
What activating energies are used in the 4D products presented in the lesson?
A. Heat
B. Water
C. Microwave
D. Sound-waves
Q1 – Area vs Die/wafer – a) What is the area ratio between a 300mm and 200mm diameter wafer? (The 300mm diameter waferhas x.xx times the area of a 200mm).b) How many 15x15mm die can be completely printed on a 100mm, 200mm, and 300mm wafer? Showyour work. Do not include partial fields; you may assume no scribe lines or edge exclusion zone. Thereis no flat, only a notch for the 200mm and 300mm wafers. How many times more die can you getwhen going from 200 to 300mm wafers? How does this number compare to the area increasebetween 200 and 300mm? c) Now assume a 100um scribe line and a 3mm edge exclusion zone. How may die per wafer for 200mmand 300mm wafers? How did you calculate this – show your work. How does this compare to the arearatio? Is it the same? If not, why not?
Calculate the number of finished goods (output) or N for the manufacturing process illustrated in the next page.
Chapter 28 Solutions
Manufacturing Engineering & Technology
Ch. 28 - Define the terms wafer, chip, die, device,...Ch. 28 - Why is silicon the semiconductor most used in...Ch. 28 - What do the abbreviations BJT, MOSFET, VLSI,...Ch. 28 - Prob. 4RQCh. 28 - Prob. 5RQCh. 28 - What are the purposes of prebaking and...Ch. 28 - Define selectivity and isotropy, and their...Ch. 28 - Prob. 8RQCh. 28 - Prob. 9RQCh. 28 - What are the levels of interconnection?
Ch. 28 - Which is cleaner, a Class-10 or a Class-1 clean...Ch. 28 - Prob. 12RQCh. 28 - What is a via? Why is it important?Ch. 28 - Describe how electrical connections are...Ch. 28 - Prob. 15RQCh. 28 - Prob. 16RQCh. 28 - Comment on your observations regarding the...Ch. 28 - Describe how n-type and p-type dopants differ.Ch. 28 - Prob. 19QLPCh. 28 - How is epitaxy different from other techniques...Ch. 28 - Note that, in a horizontal epitaxial reactor...Ch. 28 - The table that follows describes three...Ch. 28 - Prob. 23QLPCh. 28 - What is accelerated life testing? Why is it...Ch. 28 - Explain the difference between a die, a chip, anda...Ch. 28 - A common problem in ion implantation is...Ch. 28 - Examine the hole profiles shown in Fig. P28.27...Ch. 28 - Referring to Fig. 28.24, sketch the shape of the...Ch. 28 - Prob. 29QTPCh. 28 - Prob. 30QTPCh. 28 - Prob. 31QTPCh. 28 - A certain design rule calls for metal lines to be...Ch. 28 - Prob. 33QTPCh. 28 - If a square mask of side length 100 m is placed on...Ch. 28 - Obtain an expression for the width of the trench...Ch. 28 - Prob. 36SDPCh. 28 - Inspect various electronic and computer equipment,...Ch. 28 - Describe your understanding of the important...Ch. 28 - Make a survey of the necessity for clean rooms in...Ch. 28 - Prob. 40SDPCh. 28 - Prob. 41SDPCh. 28 - Estimate the time required to etch a spur gear...Ch. 28 - Prob. 43SDPCh. 28 - Review the specific devices, shown in Fig. V.2....
Knowledge Booster
Learn more about
Need a deep-dive on the concept behind this application? Look no further. Learn more about this topic, mechanical-engineering and related others by exploring similar questions and additional content below.Similar questions
- Plz solve it within half n hour and plz hand written..... I'll give you multiple upvote hand written plz..... Plz solve 1 hour...arrow_forwardSOLVE STEP BY STEP IN DIGITAL FORMAT Investigate the use of advanced materials in aircraft design, such as composites or nanomaterials, and their potential benefits and limitations.arrow_forwardDive into Microchip's involvement in automotive electronics and safety-critical systems. How are their products used in automotive applications, and what safety standards do they comply with?arrow_forward
- write a Report compare traditional manufacturing to 3d printing and modern. *defention * historical data * properties * the use of each * statical data * graphics # 1500 words minimum with less than 15% plagiarismarrow_forwardMark the good definitionarrow_forwardHow does microchip design differ from microchip fabrication, and what tools and software are commonly used in microchip design?arrow_forward
- As a computer manufacturer, your goal is to provide high-quality computers with rapid processing speeds that are nevertheless accessible to the general public at reasonable prices. What is the best way to build a high-quality, speedy machine at a low cost?arrow_forwardSOFTCOPY ONLY (MS WORD) METHODS OF RESEARCHarrow_forwardOne of the most important responsibilities you have as a computer manufacturer is to provide goods that are unparalleled in terms of both their quality and their performance, all while ensuring that their costs remain reasonable. How can a machine be built that is both fast and of high quality while yet being within a reasonable price range?arrow_forward
- How does a 3D printer work, and what are some common applications of 3D printing technology?arrow_forwardAnswer the following questions based on scaling arguments, i.e., by applying “the variable X must be proportional to the Zth power of variable Y because of some relevant physical principle”-type reasoning. A. In a surface passivation process for Si wafers, the required processing time to create a 0.1 micron thick SiO2 layer on a pure Si wafer was 2 hours. Estimate the process time required to create an SiO2 layer of thickness 0.15 microns on a pure Si wafer under identical processing conditions. B. A puddle of volatile liquid of initial thickness of 1 cm was found to evaporate to form a thinner 0.5 cm layer in 1 day. How much longer would it take for the liquid layer to evaporate completely?arrow_forwardThe title of our study is "Design and Fabrication of an Agricultural Spraying Attachment for an Autonomous Rover" we need help in the machine design part of our study, specifically Pump selection, battery selection, and center of gravity computation Rover weight capacity 35 kilo grams (payload) Rover measurements: Wheel distance - 14.5 inches and 8.5 inches Rover platform size (width & length) 14.4 inches x 10.4 inches Height- 15.8 inchesarrow_forward
arrow_back_ios
SEE MORE QUESTIONS
arrow_forward_ios
Recommended textbooks for you
Precision Machining Technology (MindTap Course Li...Mechanical EngineeringISBN:9781285444543Author:Peter J. Hoffman, Eric S. Hopewell, Brian JanesPublisher:Cengage Learning
Welding: Principles and Applications (MindTap Cou...Mechanical EngineeringISBN:9781305494695Author:Larry JeffusPublisher:Cengage Learning
Precision Machining Technology (MindTap Course Li...
Mechanical Engineering
ISBN:9781285444543
Author:Peter J. Hoffman, Eric S. Hopewell, Brian Janes
Publisher:Cengage Learning
Welding: Principles and Applications (MindTap Cou...
Mechanical Engineering
ISBN:9781305494695
Author:Larry Jeffus
Publisher:Cengage Learning
Mod-01 Lec-16 Basics of Instrumentation; Author: nptelhrd;https://www.youtube.com/watch?v=qbKnW42ZM5c;License: Standard YouTube License, CC-BY