Manufacturing Engineering & Technology
7th Edition
ISBN: 9780133128741
Author: Serope Kalpakjian, Steven Schmid
Publisher: Prentice Hall
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Chapter 28, Problem 6RQ
What are the purposes of prebaking and postbaking in lithography?
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Chapter 28 Solutions
Manufacturing Engineering & Technology
Ch. 28 - Define the terms wafer, chip, die, device,...Ch. 28 - Why is silicon the semiconductor most used in...Ch. 28 - What do the abbreviations BJT, MOSFET, VLSI,...Ch. 28 - Prob. 4RQCh. 28 - Prob. 5RQCh. 28 - What are the purposes of prebaking and...Ch. 28 - Define selectivity and isotropy, and their...Ch. 28 - Prob. 8RQCh. 28 - Prob. 9RQCh. 28 - What are the levels of interconnection?
Ch. 28 - Which is cleaner, a Class-10 or a Class-1 clean...Ch. 28 - Prob. 12RQCh. 28 - What is a via? Why is it important?Ch. 28 - Describe how electrical connections are...Ch. 28 - Prob. 15RQCh. 28 - Prob. 16RQCh. 28 - Comment on your observations regarding the...Ch. 28 - Describe how n-type and p-type dopants differ.Ch. 28 - Prob. 19QLPCh. 28 - How is epitaxy different from other techniques...Ch. 28 - Note that, in a horizontal epitaxial reactor...Ch. 28 - The table that follows describes three...Ch. 28 - Prob. 23QLPCh. 28 - What is accelerated life testing? Why is it...Ch. 28 - Explain the difference between a die, a chip, anda...Ch. 28 - A common problem in ion implantation is...Ch. 28 - Examine the hole profiles shown in Fig. P28.27...Ch. 28 - Referring to Fig. 28.24, sketch the shape of the...Ch. 28 - Prob. 29QTPCh. 28 - Prob. 30QTPCh. 28 - Prob. 31QTPCh. 28 - A certain design rule calls for metal lines to be...Ch. 28 - Prob. 33QTPCh. 28 - If a square mask of side length 100 m is placed on...Ch. 28 - Obtain an expression for the width of the trench...Ch. 28 - Prob. 36SDPCh. 28 - Inspect various electronic and computer equipment,...Ch. 28 - Describe your understanding of the important...Ch. 28 - Make a survey of the necessity for clean rooms in...Ch. 28 - Prob. 40SDPCh. 28 - Prob. 41SDPCh. 28 - Estimate the time required to etch a spur gear...Ch. 28 - Prob. 43SDPCh. 28 - Review the specific devices, shown in Fig. V.2....
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- please show steps and fomulas so I can understand approacharrow_forwardSLA (Stereolithography) and FDM (Fused Deposition Modeling) 3D printer Explain and compare the technologies by drawing a figure. Note: Please, sir, if you write the texts on the keyboard or in Word, I would appreciate it, it would be easier for me to read and translate, thank you.arrow_forwardplease explain FDM, M,J MJF, SLS (3D plastic printing technology) working principlearrow_forward
- In the context of 3D printing, elaborate on the differences between Fused Deposition Modeling (FDM) and Stereolithography (SLA) printing processes. How do they work, and what are their applications?arrow_forwardHow do 3D printers utilize different materials, such as plastics, metals, and ceramics, in the additive manufacturing process?arrow_forwardWhy does shrinkage occur in 3D FDM printing? Explain 2 approaches to reduce shrinkage for a given component geometryarrow_forward
- (a) There are two types of rapid prototyping (RP) machine under liquid category, Stereolithography (STL) and Solid Ground Curing (SGC). Company A is planning to fabricate below part (Figure 1) using liquid based RP machine. Suggest which machines is more suitable and justify your answer. Consider the component thickness, width and orientation in your answer. 40 70 40 Figure 1arrow_forwardWhat is additive manufacturing?arrow_forwardIn the context of 3D printing, elucidate the various additive manufacturing techniques and their applications.arrow_forward
- What is 3-D Printing Process and its parameters? Diagrams?arrow_forwardExplain the principles of thermal transfer printing and its applications in barcode label printing.arrow_forwardBased on the table below, which of the statements below is/are correct regarding the 3D printing process shown in the schematic? a.You can produce a room-temperature non-fragile 225C oven-safe food container with at least one material from the above table using this process and a 280C nozzle b.You can use this process to print plastic or brittle objects but not elastomers and rubbers c.Manufacturing a thermoplastic HDPE hose with an extrusion nozzle heated to 175C is possible with this process d.You can print thermoplastic and thermoset polymers with this process, you only need to make sure that the nozzle specs and the crosslinking conditions match the polymer requirements e.This process is best suited for the low volume production of tubes, bars and beams due to the nature of the extrusion processarrow_forward
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