Manufacturing Engineering & Technology
Manufacturing Engineering & Technology
7th Edition
ISBN: 9780133128741
Author: Serope Kalpakjian, Steven Schmid
Publisher: Prentice Hall
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Chapter 28, Problem 30QTP
To determine

A chlorine-based polysilicon etching process displays a polysilicon-to-resist selectivity of 5:1 and a polysilicon-to oxide selectivity of 60:1 . Estimate the amount of resist and exposed oxide will be consumed in etching  3500 of poly silicon. Determine the poly silicon-to-oxide selectivity have to be in order to reduce the loss to only 40A0 of exposed oxide.

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Chemical milling is used in an aircraft plant to create pockets in wing sections made of an aluminum alloy. The starting thickness of one workpart of interest is 20 mm. A series of rectangular-shaped pockets 12 mm deep are to be etched with dimensions 200 mm by 400 mm. The corners of each rectangle are radiused to 15 mm. The part is an aluminum alloy and the etchant is NaOH. Use Tables in your textbook to determine the penetration rate and etch factor for this combination. Determine (a) metal removal rate in mm3/min, (b) time required to etch to the specified depth, and (c) required dimensions of the opening in the cut and peel maskant to achieve the desired pocket size on the part.
For a given 40 cm diameter wafer, and a die that is 1.5 cm x 2 cm, determine the cost of a die. Wafer cost is $5800, wafer yield is 100%, and defects per unit area is 0.09/sq. cm.
Plz solve it within half n hour and plz hand written..... I'll give you multiple upvote hand written plz..... Plz solve 1 hour...

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Manufacturing Engineering & Technology

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