Manufacturing Engineering & Technology
7th Edition
ISBN: 9780133128741
Author: Serope Kalpakjian, Steven Schmid
Publisher: Prentice Hall
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Chapter 28, Problem 23QLP
To determine
The speed of a transistor is directly proportional to the width of its polysilicon gate; thus, a narrower gate results in a faster transistor and a wider gate in a slower transistor. Knowing that the manufacturing process has a certain difference for the gate width (say, ± 0.1 μm), how would a designer modify the gate size of a critical circuit in order to minimize its difference in speed? Are there any negative effects of this change?
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I keep trying this problem but cant seem to get the sheer right can you help me figure this out please?
The pillar crane is subjected to the crate having a mass of 1000 kgkg. The boom is held in position shown in (Figure 1).Determine the force in the tie rod ABAB.Determine the horizontal and vertical reactions at the pin support CC.
Problem 7.1
Part A
In (Figure 1), F₁ = 550 lb, F2 = 250 lb, and F3 = 340 lb.
Figure
F
F
B
Part B
Determine the shear force at point C.
Express your answer to three significant figures and include the appropriate units.
Vc=522
?
lb
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Part C
Determine the moment at point C.
Express your answer to three significant figures and include the appropriate units.
1 of 1
Mc = 1867
F
E
D
lb.ft
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Part D
6 ft-
4 ft-
4 ft-
6 ft
12 ft
Chapter 28 Solutions
Manufacturing Engineering & Technology
Ch. 28 - Define the terms wafer, chip, die, device,...Ch. 28 - Why is silicon the semiconductor most used in...Ch. 28 - What do the abbreviations BJT, MOSFET, VLSI,...Ch. 28 - Prob. 4RQCh. 28 - Prob. 5RQCh. 28 - What are the purposes of prebaking and...Ch. 28 - Define selectivity and isotropy, and their...Ch. 28 - Prob. 8RQCh. 28 - Prob. 9RQCh. 28 - What are the levels of interconnection?
Ch. 28 - Which is cleaner, a Class-10 or a Class-1 clean...Ch. 28 - Prob. 12RQCh. 28 - What is a via? Why is it important?Ch. 28 - Describe how electrical connections are...Ch. 28 - Prob. 15RQCh. 28 - Prob. 16RQCh. 28 - Comment on your observations regarding the...Ch. 28 - Describe how n-type and p-type dopants differ.Ch. 28 - Prob. 19QLPCh. 28 - How is epitaxy different from other techniques...Ch. 28 - Note that, in a horizontal epitaxial reactor...Ch. 28 - The table that follows describes three...Ch. 28 - Prob. 23QLPCh. 28 - What is accelerated life testing? Why is it...Ch. 28 - Explain the difference between a die, a chip, anda...Ch. 28 - A common problem in ion implantation is...Ch. 28 - Examine the hole profiles shown in Fig. P28.27...Ch. 28 - Referring to Fig. 28.24, sketch the shape of the...Ch. 28 - Prob. 29QTPCh. 28 - Prob. 30QTPCh. 28 - Prob. 31QTPCh. 28 - A certain design rule calls for metal lines to be...Ch. 28 - Prob. 33QTPCh. 28 - If a square mask of side length 100 m is placed on...Ch. 28 - Obtain an expression for the width of the trench...Ch. 28 - Prob. 36SDPCh. 28 - Inspect various electronic and computer equipment,...Ch. 28 - Describe your understanding of the important...Ch. 28 - Make a survey of the necessity for clean rooms in...Ch. 28 - Prob. 40SDPCh. 28 - Prob. 41SDPCh. 28 - Estimate the time required to etch a spur gear...Ch. 28 - Prob. 43SDPCh. 28 - Review the specific devices, shown in Fig. V.2....
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