EBK MANUFACTURING ENGINEERING & TECHNOL
7th Edition
ISBN: 9780100793439
Author: KALPAKJIAN
Publisher: YUZU
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Chapter 28, Problem 44SDP
Review the specific devices, shown in Fig. V.2. Choose any one of these devices, and investigate what they are, what their characteristics are, how they are manufactured, and what their costs are.
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Figure 3 shows the numerical solution of the advection equation for a scalar u along x at three
consecutive timesteps.
1.0
0.8-
0.6
0.4-
0.2
0.0
00
-0.2
-0.4
-0.6-
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
Figure 3: Advection equation, solution for three different timesteps.
Question 2
Figure 3 shows the numerical solution of the advection equation for a scalar u along x at three
consecutive timesteps.
1.0
0.8-
0.6-
0.4-
0.2-
0.0-
-0.2-
-0.4-
-0.6
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
Figure 3: Advection equation, solution for three different timesteps.
a) Provide an explanation what conditions and numerical setup could explain the curves. Identify
which of the three curves is the first, second and third timestep.
b) Consider explicit schemes with central and upwind discretisations. Explain how each of these
candidate discretisations could produce the behaviour shown in Figure 3.
c) Determine the CFL number that was used in the simulation for each of the candidate schemes for
all possible updates.
Assume that the timestep and mesh-width used are constant. Read the data to two digits of
accuracy from Figure 4 shown at the end of the question, which is an enlarged version of Figure 3.
Demonstrate your method and input data for one calculation, but then use a…
answer please
Chapter 28 Solutions
EBK MANUFACTURING ENGINEERING & TECHNOL
Ch. 28 - Define the terms wafer, chip, die, device,...Ch. 28 - Why is silicon the semiconductor most used in...Ch. 28 - What do the abbreviations BJT, MOSFET, VLSI,...Ch. 28 - Prob. 4RQCh. 28 - Prob. 5RQCh. 28 - What are the purposes of prebaking and...Ch. 28 - Define selectivity and isotropy, and their...Ch. 28 - Prob. 8RQCh. 28 - Prob. 9RQCh. 28 - What are the levels of interconnection?
Ch. 28 - Which is cleaner, a Class-10 or a Class-1 clean...Ch. 28 - Prob. 12RQCh. 28 - What is a via? Why is it important?Ch. 28 - Describe how electrical connections are...Ch. 28 - Prob. 15RQCh. 28 - Prob. 16RQCh. 28 - Comment on your observations regarding the...Ch. 28 - Describe how n-type and p-type dopants differ.Ch. 28 - Prob. 19QLPCh. 28 - How is epitaxy different from other techniques...Ch. 28 - Note that, in a horizontal epitaxial reactor...Ch. 28 - The table that follows describes three...Ch. 28 - Prob. 23QLPCh. 28 - What is accelerated life testing? Why is it...Ch. 28 - Explain the difference between a die, a chip, anda...Ch. 28 - A common problem in ion implantation is...Ch. 28 - Examine the hole profiles shown in Fig. P28.27...Ch. 28 - Referring to Fig. 28.24, sketch the shape of the...Ch. 28 - Prob. 29QTPCh. 28 - Prob. 30QTPCh. 28 - Prob. 31QTPCh. 28 - A certain design rule calls for metal lines to be...Ch. 28 - Prob. 33QTPCh. 28 - If a square mask of side length 100 m is placed on...Ch. 28 - Obtain an expression for the width of the trench...Ch. 28 - Prob. 36SDPCh. 28 - Inspect various electronic and computer equipment,...Ch. 28 - Describe your understanding of the important...Ch. 28 - Make a survey of the necessity for clean rooms in...Ch. 28 - Prob. 40SDPCh. 28 - Prob. 41SDPCh. 28 - Estimate the time required to etch a spur gear...Ch. 28 - Prob. 43SDPCh. 28 - Review the specific devices, shown in Fig. V.2....
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