EBK MANUFACTURING ENGINEERING & TECHNOL
7th Edition
ISBN: 9780100793439
Author: KALPAKJIAN
Publisher: YUZU
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Chapter 28, Problem 30QTP
To determine
A chlorine-based polysilicon etching process displays a polysilicon-to-resist selectivity of
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Chemical milling is used in an aircraft plant to create pockets in wing sections made of an aluminum alloy. The starting thickness of one workpart of interest is 20 mm. A series of rectangular-shaped pockets 12 mm deep are to be etched with dimensions 200 mm by 400 mm. The corners of each rectangle are radiused to 15 mm. The part is an aluminum alloy and the etchant is NaOH. Use Tables in your textbook to determine the penetration rate and etch factor for this combination. Determine (a) metal removal rate in mm3/min, (b) time required to etch to the specified depth, and (c) required dimensions of the opening in the cut and peel maskant to achieve the desired pocket size on the part.
For a given 40 cm diameter wafer, and a die that is 1.5 cm x 2 cm, determine the cost of a die. Wafer cost is $5800, wafer yield is 100%, and defects per unit area is 0.09/sq. cm.
Plz solve it within half n hour and plz hand written..... I'll give you multiple upvote hand written plz..... Plz solve 1 hour...
Chapter 28 Solutions
EBK MANUFACTURING ENGINEERING & TECHNOL
Ch. 28 - Define the terms wafer, chip, die, device,...Ch. 28 - Why is silicon the semiconductor most used in...Ch. 28 - What do the abbreviations BJT, MOSFET, VLSI,...Ch. 28 - Prob. 4RQCh. 28 - Prob. 5RQCh. 28 - What are the purposes of prebaking and...Ch. 28 - Define selectivity and isotropy, and their...Ch. 28 - Prob. 8RQCh. 28 - Prob. 9RQCh. 28 - What are the levels of interconnection?
Ch. 28 - Which is cleaner, a Class-10 or a Class-1 clean...Ch. 28 - Prob. 12RQCh. 28 - What is a via? Why is it important?Ch. 28 - Describe how electrical connections are...Ch. 28 - Prob. 15RQCh. 28 - Prob. 16RQCh. 28 - Comment on your observations regarding the...Ch. 28 - Describe how n-type and p-type dopants differ.Ch. 28 - Prob. 19QLPCh. 28 - How is epitaxy different from other techniques...Ch. 28 - Note that, in a horizontal epitaxial reactor...Ch. 28 - The table that follows describes three...Ch. 28 - Prob. 23QLPCh. 28 - What is accelerated life testing? Why is it...Ch. 28 - Explain the difference between a die, a chip, anda...Ch. 28 - A common problem in ion implantation is...Ch. 28 - Examine the hole profiles shown in Fig. P28.27...Ch. 28 - Referring to Fig. 28.24, sketch the shape of the...Ch. 28 - Prob. 29QTPCh. 28 - Prob. 30QTPCh. 28 - Prob. 31QTPCh. 28 - A certain design rule calls for metal lines to be...Ch. 28 - Prob. 33QTPCh. 28 - If a square mask of side length 100 m is placed on...Ch. 28 - Obtain an expression for the width of the trench...Ch. 28 - Prob. 36SDPCh. 28 - Inspect various electronic and computer equipment,...Ch. 28 - Describe your understanding of the important...Ch. 28 - Make a survey of the necessity for clean rooms in...Ch. 28 - Prob. 40SDPCh. 28 - Prob. 41SDPCh. 28 - Estimate the time required to etch a spur gear...Ch. 28 - Prob. 43SDPCh. 28 - Review the specific devices, shown in Fig. V.2....
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- Write in detail following terminologies according to wafer fabrication processes: a. Diffusion and Ion Implantation b. Metallization c. Etchingarrow_forwardA siilicon boule has been processed through grinding to provide a cylinder whose diameter = 281 mm and whose length = 899 mm. Next, it will be sliced into wafers 0.8 mm thick using a cut-off saw with a kerf = 0.5 mm. The wafer thus produced will be used to fabricate as many IC chips as possible for the personal computer market. Each IC has a market value to the company of $108. Each chip is square with 17 mm on a side. The processable area of each wafer is defined by a diameter = 265 mm. Estimate the value of all of the IC chips that could be produced (in $), asssuming an overall yield of 84% good product.arrow_forwardSubject: manufacturing process Chemical milling is used in an aircraft plant to create pockets in wing sections made of an aluminum alloy. The starting thickness of a work part of interest is 25 mm. A series of rectangular-shaped pockets 15 mm deep are to be etched with dimensions 200 mm by 400 mm. The etchant is NaOH. Consult Table 25.2 for the penetration rate and etch factor. Determine a. Metal removal rate in mm3/min b. Time required to etch to the specified depth c. Required dimensions of the opening in the cut and peel maskant to achieve the desired pocket size on the partarrow_forward
- Stereolithography is a additive manufacturing process. based foil O powder filament liquidarrow_forwardFigure below shows a MEMS released device. Develop a process sequence for fabrication of this device. You may choose materials (metal types, insulators) but you have to use a compatible fabrication sequence for the whole process.arrow_forwardDive into Microchip's involvement in automotive electronics and safety-critical systems. How are their products used in automotive applications, and what safety standards do they comply with?arrow_forward
- ANSWER THE FOLLOWING : Name one factor PCB fabricators consider when etching a design. Explain thoroughly (include images if applicable)arrow_forwardWhat is a Digital display device? Write any two examples of Digital display device.arrow_forward(b) Define THREE (3) common applications of these type of transducers.arrow_forward
- Explain the principles of thermal transfer printing and its applications in barcode label printing.arrow_forwardAssume that a silicon diode is being used as a temperature detector. If its temperature increases, will its voltage drop increase or decrease?arrow_forwardWhat is the Significance of the study of Fuse 3d printing Using Pet bottles in the Environmentarrow_forward
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