EBK MANUFACTURING ENGINEERING & TECHNOL
7th Edition
ISBN: 9780100793439
Author: KALPAKJIAN
Publisher: YUZU
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Chapter 28, Problem 31QTP
To determine
During processing sequence of three silicon
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1.1 Consider the fireclay brick wall of Example 1.1 that is
operating under different thermal conditions. The tem-
perature distribution, at an instant in time, is T(x) = a+
bx where a 1400 K and b = -1000 K/m. Determine
the heat fluxes, q", and heat rates, q, at x = 0 and x = L.
Do steady-state conditions exist?
2.4 To determine the effect of the temperature dependence
of the thermal conductivity on the temperature dis-
tribution in a solid, consider a material for which this
dependence may be represented as
k = k₁ + aT
where k, is a positive constant and a is a coefficient that
may be positive or negative. Sketch the steady-state
temperature distribution associated with heat transfer
in a plane wall for three cases corresponding to a > 0,
a = 0, and a < 0.
1.21 A one-dimensional plane wall is exposed to convective
and radiative conditions at x = 0. The ambient and sur-
rounding temperatures are T = 20°C and Tur = 40°C,
respectively. The convection heat transfer coefficient is
h=20 W/m² K, and the absorptivity of the exposed sur-
face is α=0.78. Determine the convective and radiative
heat fluxes to the wall at x = 0 if the wall surface tem-
perature is T, = 24°C. Assume the exposed wall surface
is gray, and the surroundings are large.
Chapter 28 Solutions
EBK MANUFACTURING ENGINEERING & TECHNOL
Ch. 28 - Define the terms wafer, chip, die, device,...Ch. 28 - Why is silicon the semiconductor most used in...Ch. 28 - What do the abbreviations BJT, MOSFET, VLSI,...Ch. 28 - Prob. 4RQCh. 28 - Prob. 5RQCh. 28 - What are the purposes of prebaking and...Ch. 28 - Define selectivity and isotropy, and their...Ch. 28 - Prob. 8RQCh. 28 - Prob. 9RQCh. 28 - What are the levels of interconnection?
Ch. 28 - Which is cleaner, a Class-10 or a Class-1 clean...Ch. 28 - Prob. 12RQCh. 28 - What is a via? Why is it important?Ch. 28 - Describe how electrical connections are...Ch. 28 - Prob. 15RQCh. 28 - Prob. 16RQCh. 28 - Comment on your observations regarding the...Ch. 28 - Describe how n-type and p-type dopants differ.Ch. 28 - Prob. 19QLPCh. 28 - How is epitaxy different from other techniques...Ch. 28 - Note that, in a horizontal epitaxial reactor...Ch. 28 - The table that follows describes three...Ch. 28 - Prob. 23QLPCh. 28 - What is accelerated life testing? Why is it...Ch. 28 - Explain the difference between a die, a chip, anda...Ch. 28 - A common problem in ion implantation is...Ch. 28 - Examine the hole profiles shown in Fig. P28.27...Ch. 28 - Referring to Fig. 28.24, sketch the shape of the...Ch. 28 - Prob. 29QTPCh. 28 - Prob. 30QTPCh. 28 - Prob. 31QTPCh. 28 - A certain design rule calls for metal lines to be...Ch. 28 - Prob. 33QTPCh. 28 - If a square mask of side length 100 m is placed on...Ch. 28 - Obtain an expression for the width of the trench...Ch. 28 - Prob. 36SDPCh. 28 - Inspect various electronic and computer equipment,...Ch. 28 - Describe your understanding of the important...Ch. 28 - Make a survey of the necessity for clean rooms in...Ch. 28 - Prob. 40SDPCh. 28 - Prob. 41SDPCh. 28 - Estimate the time required to etch a spur gear...Ch. 28 - Prob. 43SDPCh. 28 - Review the specific devices, shown in Fig. V.2....
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