EBK MANUFACTURING ENGINEERING & TECHNOL
7th Edition
ISBN: 9780100793439
Author: KALPAKJIAN
Publisher: YUZU
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Chapter 28, Problem 23QLP
To determine
The speed of a transistor is directly proportional to the width of its polysilicon gate; thus, a narrower gate results in a faster transistor and a wider gate in a slower transistor. Knowing that the manufacturing process has a certain difference for the gate width (say, ± 0.1 μm), how would a designer modify the gate size of a critical circuit in order to minimize its difference in speed? Are there any negative effects of this change?
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Qu 5 Determine the carburizing time necessary to achieve a carbon concentration of 0.30 wt% at a position 4 mm into an iron carbon alloy that initially contains 0.10 wt% C. The surface concentration is to be maintained at 0.90 wt% C, and the treatment is to be conducted at 1100°C. Use the data for the diffusion of
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In figure A, the homogeneous rod of constant cross section is attached to unyielding supports. In figure B, a homogeneous bar with a cross-sectional area of 600 mm2 is attached to rigid supports. The bar carries the axial loads P1 = 20 kN and P2 = 60 kN, as shown.1. In figure A, derive the expression that calculates the reaction R1 in terms of P, and the given dimensions.2. In figure B, calculate the reaction (kN) at A.3. In figure B, calculate the maximum axial stress (MPa) in the rod.
Chapter 28 Solutions
EBK MANUFACTURING ENGINEERING & TECHNOL
Ch. 28 - Define the terms wafer, chip, die, device,...Ch. 28 - Why is silicon the semiconductor most used in...Ch. 28 - What do the abbreviations BJT, MOSFET, VLSI,...Ch. 28 - Prob. 4RQCh. 28 - Prob. 5RQCh. 28 - What are the purposes of prebaking and...Ch. 28 - Define selectivity and isotropy, and their...Ch. 28 - Prob. 8RQCh. 28 - Prob. 9RQCh. 28 - What are the levels of interconnection?
Ch. 28 - Which is cleaner, a Class-10 or a Class-1 clean...Ch. 28 - Prob. 12RQCh. 28 - What is a via? Why is it important?Ch. 28 - Describe how electrical connections are...Ch. 28 - Prob. 15RQCh. 28 - Prob. 16RQCh. 28 - Comment on your observations regarding the...Ch. 28 - Describe how n-type and p-type dopants differ.Ch. 28 - Prob. 19QLPCh. 28 - How is epitaxy different from other techniques...Ch. 28 - Note that, in a horizontal epitaxial reactor...Ch. 28 - The table that follows describes three...Ch. 28 - Prob. 23QLPCh. 28 - What is accelerated life testing? Why is it...Ch. 28 - Explain the difference between a die, a chip, anda...Ch. 28 - A common problem in ion implantation is...Ch. 28 - Examine the hole profiles shown in Fig. P28.27...Ch. 28 - Referring to Fig. 28.24, sketch the shape of the...Ch. 28 - Prob. 29QTPCh. 28 - Prob. 30QTPCh. 28 - Prob. 31QTPCh. 28 - A certain design rule calls for metal lines to be...Ch. 28 - Prob. 33QTPCh. 28 - If a square mask of side length 100 m is placed on...Ch. 28 - Obtain an expression for the width of the trench...Ch. 28 - Prob. 36SDPCh. 28 - Inspect various electronic and computer equipment,...Ch. 28 - Describe your understanding of the important...Ch. 28 - Make a survey of the necessity for clean rooms in...Ch. 28 - Prob. 40SDPCh. 28 - Prob. 41SDPCh. 28 - Estimate the time required to etch a spur gear...Ch. 28 - Prob. 43SDPCh. 28 - Review the specific devices, shown in Fig. V.2....
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