A pole−vaulter holds a 16 ft. pole. A barn has doors at both ends, 10 ft. apart. The pole−vaulter on the outside of the barn begins running toward one of the open barn doors, holding the pole level in the direction he’s running. When passing through the barn, the pole fits (barely) entirely within the barn all at once. (a) How fast is the pole−vaulter running? (b) According to whom−the pole−vaulter or an observer stationary in the barn−does the pole fit in all at once? (c) According to the other person, which occurs first, the front end of the pole leaving the barn or the back end entering, and (d) what is the time interval between these two events’?
A pole−vaulter holds a 16 ft. pole. A barn has doors at both ends, 10 ft. apart. The pole−vaulter on the outside of the barn begins running toward one of the open barn doors, holding the pole level in the direction he’s running. When passing through the barn, the pole fits (barely) entirely within the barn all at once. (a) How fast is the pole−vaulter running? (b) According to whom−the pole−vaulter or an observer stationary in the barn−does the pole fit in all at once? (c) According to the other person, which occurs first, the front end of the pole leaving the barn or the back end entering, and (d) what is the time interval between these two events’?
A pole−vaulter holds a 16 ft. pole. A barn has doors at both ends, 10 ft. apart. The pole−vaulter on the outside of the barn begins running toward one of the open barn doors, holding the pole level in the direction he’s running. When passing through the barn, the pole fits (barely) entirely within the barn all at once. (a) How fast is the pole−vaulter running? (b) According to whom−the pole−vaulter or an observer stationary in the barn−does the pole fit in all at once? (c) According to the other person, which occurs first, the front end of the pole leaving the barn or the back end entering, and (d) what is the time interval between these two events’?
You want to fabricate a soft microfluidic chip like the one below. How would you go about
fabricating this chip knowing that you are targeting a channel with a square cross-sectional
profile of 200 μm by 200 μm. What materials and steps would you use and why? Disregard the
process to form the inlet and outlet.
Square Cross Section
1. What are the key steps involved in the fabrication of a semiconductor device.
2. You are hired by a chip manufacturing company, and you are asked to prepare a silicon wafer
with the pattern below. Describe the process you would use.
High Aspect
Ratio
Trenches
Undoped Si Wafer
P-doped Si
3. You would like to deposit material within a high aspect ratio trench. What approach would you
use and why?
4. A person is setting up a small clean room space to carry out an outreach activity to educate high
school students about patterning using photolithography. They obtained a positive photoresist, a
used spin coater, a high energy light lamp for exposure and ordered a plastic transparency mask
with a pattern on it to reduce cost. Upon trying this set up multiple times they find that the full
resist gets developed, and they are unable to transfer the pattern onto the resist. Help them
troubleshoot and find out why pattern of transfer has not been successful.
5. You are given a composite…
Two complex values are z1=8 + 8i, z2=15 + 7 i. z1∗ and z2∗ are the complex conjugate values.
Any complex value can be expessed in the form of a+bi=reiθ. Find r and θ for (z1-z∗2)/z1+z2∗. Find r and θ for (z1−z2∗)z1z2∗ Please show all steps
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