7. Arsenic was pre-deposited by arsine gas, and the resulting total amount of dopant per unit area was 1×10¹4 atoms/cm². How long would it take to drive the arsenic into a junction depth of 1 µm? Assume a background doping of CB = 1×10¹5 atoms/cm³ and a drive-in temperature of 1200-C. For As diffusion, Do = 24 cm²/s, and Ea = 4.08 eV.

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9. If a 125 mm diameter wafer is exposed for 1 minute to an air stream under a laminar-flow condition at 30
m/min, how many dust particles will land on the wafer in a class-10 clean room? For a class-10 clean room,
there are 350 particles (0.5 µm or larger) per cubic meter.
10. The killing defect density is responsible for yield loss and depends on the design rule or size of the device on a
chip. This is because when the design rule becomes smaller, a smaller particle can contribute to yield loss. For
a 16M DRAM chip, the design rule is 0.5 µm, the chip size is 1.4 cm², and the killing defect size is 0.18 µm.
Due to contamination that occurs in a cleanroom, the wafer defect density measured at size 0.3 µm increases
fivefold from 0.2 D/cm² to 1.0 D/cm². Using the relationship Y = e-DA where D is the defect density and A is
the chip area, calculate the yield loss of a 16M DRAM wafer due to the increase in the defect density assuming
that the defect density is roughly inversely proportional to the defect size to the second power.
Transcribed Image Text:9. If a 125 mm diameter wafer is exposed for 1 minute to an air stream under a laminar-flow condition at 30 m/min, how many dust particles will land on the wafer in a class-10 clean room? For a class-10 clean room, there are 350 particles (0.5 µm or larger) per cubic meter. 10. The killing defect density is responsible for yield loss and depends on the design rule or size of the device on a chip. This is because when the design rule becomes smaller, a smaller particle can contribute to yield loss. For a 16M DRAM chip, the design rule is 0.5 µm, the chip size is 1.4 cm², and the killing defect size is 0.18 µm. Due to contamination that occurs in a cleanroom, the wafer defect density measured at size 0.3 µm increases fivefold from 0.2 D/cm² to 1.0 D/cm². Using the relationship Y = e-DA where D is the defect density and A is the chip area, calculate the yield loss of a 16M DRAM wafer due to the increase in the defect density assuming that the defect density is roughly inversely proportional to the defect size to the second power.
7. Arsenic was pre-deposited by arsine gas, and the resulting total amount of dopant per unit area was 1×10¹4
atoms/cm². How long would it take to drive the arsenic into a junction depth of 1 µm? Assume a background
doping of CB = 1×10¹5 atoms/cm³ and a drive-in temperature of 1200°C. For As diffusion, Do = 24 cm²/s, and
Ea = 4.08 eV.
8. Assume 100 keV boron implants on a 200 mm silicon wafer at a dose of 5×10¹4 ions/cm². The projected range
and projected straggle (op) are 0.31 and 0.07 μm, respectively. Calculate the peak concentration and the required
ion-beam current for 1 min of implantation.
Transcribed Image Text:7. Arsenic was pre-deposited by arsine gas, and the resulting total amount of dopant per unit area was 1×10¹4 atoms/cm². How long would it take to drive the arsenic into a junction depth of 1 µm? Assume a background doping of CB = 1×10¹5 atoms/cm³ and a drive-in temperature of 1200°C. For As diffusion, Do = 24 cm²/s, and Ea = 4.08 eV. 8. Assume 100 keV boron implants on a 200 mm silicon wafer at a dose of 5×10¹4 ions/cm². The projected range and projected straggle (op) are 0.31 and 0.07 μm, respectively. Calculate the peak concentration and the required ion-beam current for 1 min of implantation.
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