7. A paper in Quality Engineering [2013, Vol. 25(1)] presented data on cycles to failure of solder joints at different temperatures for different types of printed circuit boards (PCB) Failure data for two temperatures (20 and 60°C) for a coppernickel-gold PCB follow. 20°C 218, 265, 279, 282, 336, 469, 496, 507, 685, 685 60 C 185, 242, 254, 280, 305, 353, 381, 504, 556, 697 a. Test the null hypothesis at a = 0.05 that the cycles to failure are the same at both temperatures. Is the alternative one or two sided? b. Find a 95% confidence interval for the difference in the mean cycles to failure for the two temperatures.

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7. A paper in Quality Engineering [2013, Vol. 25(1)] presented data on cycles to failure of
solder joints at different temperatures for different types of printed circuit boards (PCB).
Failure data for two temperatures (20 and 60°C) for a coppernickel-gold PCB follow.
20°C 218, 265, 279, 282, 336, 469, 496, 507, 685, 685
60°C 185, 242, 254, 280, 305, 353, 381, 504, 556, 697
a. Test the null hypothesis at x = 0.05 that the cycles to failure are the same at both
temperatures. Is the alternative one or two sided?
b. Find a 95% confidence interval for the difference in the mean cycles to failure for the
two temperatures.
Transcribed Image Text:7. A paper in Quality Engineering [2013, Vol. 25(1)] presented data on cycles to failure of solder joints at different temperatures for different types of printed circuit boards (PCB). Failure data for two temperatures (20 and 60°C) for a coppernickel-gold PCB follow. 20°C 218, 265, 279, 282, 336, 469, 496, 507, 685, 685 60°C 185, 242, 254, 280, 305, 353, 381, 504, 556, 697 a. Test the null hypothesis at x = 0.05 that the cycles to failure are the same at both temperatures. Is the alternative one or two sided? b. Find a 95% confidence interval for the difference in the mean cycles to failure for the two temperatures.
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