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1. The thermal conductivity of a sheet of rigid, extruded insulation is reported to be k=0.029 W/m.K. The measured temperature difference across a 20 mm thick sheet of the material is T1- T2=10 °C. (a) What is the heat flux through a 2mx2m sheet of the insulation? (b) What is the rate of heat transfer through the sheet of insulation? 2. The heat flux that is applied to the left face of a plane wall is q"=20 W/m². The wall is of thickness L = 10 mm and of thermal conductivity k=12 W/m.K. If the surface temperatures of the wall are measured to be 50 °C on the left side and 30 °C on the right side, do steady-state conditions exist? 3. 3. A square isothermal chip is of width w = 5 mm on a side and is mounted in a substrate such that its side and back surfaces are well insulated; the front surface is exposed to the flow of a coolant at T∞ = 15 °C. From reliability considerations, the chip temperature must not exceed T=85 °C Coolant To, h 007 W Chip If the coolant is air and the corresponding convection coefficient is h=200W/m²-K, what is the maximum allowable chip power? If the coolant is a dielectric liquid for which h=3000 W/m2-K, what is the maximum allowable power?

1. The thermal conductivity of a sheet of rigid, extruded insulation is reported to be k=0.029 W/m.K. The measured temperature difference across a 20 mm thick sheet of the material is T1- T2=10 °C. (a) What is the heat flux through a 2mx2m sheet of the insulation? (b) What is the rate of heat transfer through the sheet of insulation? 2. The heat flux that is applied to the left face of a plane wall is q"=20 W/m². The wall is of thickness L = 10 mm and of thermal conductivity k=12 W/m.K. If the surface temperatures of the wall are measured to be 50 °C on the left side and 30 °C on the right side, do steady-state conditions exist? 3. 3. A square isothermal chip is of width w = 5 mm on a side and is mounted in a substrate such that its side and back surfaces are well insulated; the front surface is exposed to the flow of a coolant at T∞ = 15 °C. From reliability considerations, the chip temperature must not exceed T=85 °C Coolant To, h 007 W Chip If the coolant is air and the corresponding convection coefficient is h=200W/m²-K, what is the maximum allowable chip power? If the coolant is a dielectric liquid for which h=3000 W/m2-K, what is the maximum allowable power?

Elements Of Electromagnetics
Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
ChapterMA: Math Assessment
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1. The thermal conductivity of a sheet of rigid, extruded insulation is reported to be k=0.029 W/m.K. The measured temperature difference across a 20 mm thick sheet of the material is T1- T2=10 °C. (a) What is the heat flux through a 2mx2m sheet of the insulation? (b) What is the rate of heat transfer through the sheet of insulation? 2. The heat flux that is applied to the left face of a plane wall is q"=20 W/m². The wall is of thickness L = 10 mm and of thermal conductivity k=12 W/m.K. If the surface temperatures of the wall are measured to be 50 °C on the left side and 30 °C on the right side, do steady-state conditions exist? 3. 3. A square isothermal chip is of width w = 5 mm on a side and is mounted in a substrate such that its side and back surfaces are well insulated; the front surface is exposed to the flow of a coolant at T∞ = 15 °C. From reliability considerations, the chip temperature must not exceed T=85 °C Coolant To, h 007 W Chip If the coolant is air and the corresponding convection coefficient is h=200W/m²-K, what is the maximum allowable chip power? If the coolant is a dielectric liquid for which h=3000 W/m2-K, what is the maximum allowable power?
Transcribed Image Text:1. The thermal conductivity of a sheet of rigid, extruded insulation is reported to be k=0.029 W/m.K. The measured temperature difference across a 20 mm thick sheet of the material is T1- T2=10 °C. (a) What is the heat flux through a 2mx2m sheet of the insulation? (b) What is the rate of heat transfer through the sheet of insulation? 2. The heat flux that is applied to the left face of a plane wall is q"=20 W/m². The wall is of thickness L = 10 mm and of thermal conductivity k=12 W/m.K. If the surface temperatures of the wall are measured to be 50 °C on the left side and 30 °C on the right side, do steady-state conditions exist? 3. 3. A square isothermal chip is of width w = 5 mm on a side and is mounted in a substrate such that its side and back surfaces are well insulated; the front surface is exposed to the flow of a coolant at T∞ = 15 °C. From reliability considerations, the chip temperature must not exceed T=85 °C Coolant To, h 007 W Chip If the coolant is air and the corresponding convection coefficient is h=200W/m²-K, what is the maximum allowable chip power? If the coolant is a dielectric liquid for which h=3000 W/m2-K, what is the maximum allowable power?
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