Chapter 8, Problem 8.71PAE

Interpretation Introduction

Interpretation:

Explanation should be given for using SiO₂ as a mask instead of the fact that it will react with the etchant.

Concept introduction:

Microfabrication is a process through which nearly all the semiconductor type materials and circuits are fabricated. The microfabricated devices are formed over the substrate surface with one or more thin films. In most of the devices, silicon wafers are generally used as substrate.

The insertion of desirable pattern is done through masking in which a certain portion of the film is detected which is to be removed for insertion.

Etching is the process of removing a small portion of that thin film or substrate from the device.

This etching can be of two types; dry etching (plasma etching) or wet etching (chemical etching).