Degarmo's Materials And Processes In Manufacturing
Degarmo's Materials And Processes In Manufacturing
13th Edition
ISBN: 9781119492825
Author: Black, J. Temple, Kohser, Ronald A., Author.
Publisher: Wiley,
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Chapter 30, Problem 23RQ

Explain (using a little physics and metallurgy) why the "chips" in a thermal process such as EDM are often hollow spheres.

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A hot plane surface is maintained at 100°C, and it is exposed to air at 25°C.The combined heat transfer coefficient between the surface and the air is 25W/m²·K. (same as above). In this task, you are asked to design fins to cool asurface by attaching 3 cm-long, 0.25 cm-diameter aluminum pin fins (thermalconductivity, k = 237 W/m·K) with a center-to-center distance of 0.6 cm. (Tip:do not correct the length). Determine the rate of heat transfer from thefinned structure to the air for a 1 m x 1 m section of the plate.
Heat is generated uniformly in a 4 cm-diameter, 16-cm long solid bar (k=2.4 W/m-K). The temperaturesat the center and at the surface of the bar are measured to be 210 oC and 45 oC, respectively. Calculatethe rate of heat generation within the bar. Solve the relevant energy balance equation and the boundaryconditions to calculate the rate of heat generation within the bar. (6 pts)
A hot plane surface is maintained at 100°C, and it is exposed to air at 25°C. The combined heat transfercoefficient between the surface and the air is 25 W/m²·K. You are tasked with designing an insulatingmaterial to cover the surface in order to reduce the heat transfer rate by 90%, meaning only 10% of theheat transfer would occur compared to the situation without insulation. The available insulating materialhas a thermal conductivity of 0.093 W/m·K. Assuming that the heat transfer coefficient and the surface/airtemperatures remain constant, calculate the required thickness of the insulating material in centimeters.

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Degarmo's Materials And Processes In Manufacturing

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