Fundamentals of Heat and Mass Transfer
7th Edition
ISBN: 9780470501979
Author: Frank P. Incropera, David P. DeWitt, Theodore L. Bergman, Adrienne S. Lavine
Publisher: Wiley, John & Sons, Incorporated
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Textbook Question
Chapter 3, Problem 3.125P
From Problem 1.71, consider the wire leads connecting the transistor to the circuit board. The leads are of thermal conductivity k, thickness t, width w, and length L. One end of a lead is maintained at a temperature
- Derive an equation from which the temperature distribution in a wire lead may be determined. List all pertinent assumptions.
- Determine the temperature distribution in a wire lead, expressing your results in terms of the prescribed variables.
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2.16 A standard 4-in. steel pipe (ID = 4.026 in., OD =
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Q3. What is the analogical reason between heat transfer by conduction and flow of electricity through ohmic resistance? Use a composite wall of a building to illustrate the concept. A composite slab with three layers of thermal conductivities k1, k2, k3 and thickness t1, t2, t3 respectively, are placed in a close contact. Derive an expression from the first principle for the heat flow through the composite slab per unit surface area in terms of the overall temperature difference across the slab.
Chapter 3 Solutions
Fundamentals of Heat and Mass Transfer
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