⚫ A thin silicon chip and an 8-mm-thick aluminum substrate areseparated by a 0.02-mm-thick epoxy joint. The chip and substrate areeach 10 mm on a side, and their exposed surfaces are cooled by air,which is at a temperature of 25C and provides a convectioncoefficient of 100 W/m2 K. If the chip dissipates 104 W/m2 undernormal conditions, will it operate below a maximum allowabletemperature of 85C?7-25°CAir-100 W/m²KInsulationSilicon chipЕроку joint(0.02 mm)Aluminumsubstrate7-25 CAir-100 W/mKL-8 mm

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Answered: ⚫ A thin silicon chip and an 8-mm-thick…

Principles of Heat Transfer (Activate Learning with these NEW titles from Engineering!)

8th Edition

ISBN:9781305387102

Author:Kreith, Frank; Manglik, Raj M.

Publisher:Kreith, Frank; Manglik, Raj M.

Chapter7: Forced Convection Inside Tubes And Ducts

Section: Chapter Questions

Problem 7.53P

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A thin silicon chip and an 8-mm-thick aluminum substrate are separated by a 0.02-mm-thick epoxy joint. The chip and substrate are each 10 mm on a side, and their exposed surfaces are cooled by air, which is at a temperature of 25°C and provides a convection coefficient of 100 W/m²K. If the chip dissipates 104 W/m² under normal conditions, will it operate below a maximum allowable temperature of 85°C? Known: Dimensions, Heat dissipation, and maximum allowable temperature of a silicon chip. Thickness of aluminum substrate and epoxy joint. Convection conditions at exposed chip and substrate surfaces. Find: Whether maximum allowable temperature is exceeded. Assumption: Steady-state conditions, One-dimensional conduction (negligible heat transfer from sides of composite). Negligible chip thermal resistance (an isothermal chip), Constant properties. Negligible radiation exchange with surroundings. Properties: Table A.1, pure aluminum (T~350 K): k = 239 W/m K. Air Too = 25°C h = 100 W/m²K -…
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