Homework Help is Here – Start Your Trial Now!
Engineering
Mechanical Engineering
A thin silicon chip and an 8-mm-thick aluminum substrate are separated by a 0.02-mm-thick epoxy joint. The chip and substrate are each 10 mm on a side, and their exposed surfaces are cooled by air, which is at a temperature of 25°C and provides a convection coefficient of 100 W/m²K. If the chip dissipates 104 W/m² under normal conditions, will it operate below a maximum allowable temperature of 85°C? Known: Dimensions, Heat dissipation, and maximum allowable temperature of a silicon chip. Thickness of aluminum substrate and epoxy joint. Convection conditions at exposed chip and substrate surfaces. Find: Whether maximum allowable temperature is exceeded. Assumption: Steady-state conditions, One-dimensional conduction (negligible heat transfer from sides of composite). Negligible chip thermal resistance (an isothermal chip), Constant properties. Negligible radiation exchange with surroundings. Properties: Table A.1, pure aluminum (T~350 K): k = 239 W/m K. Air Too = 25°C h = 100 W/m²K - Insulation Silicon chip +9 Epoxy joint (0.02 mm) " Aluminum substrate Air Too = 25°C h = 100 W/m²K -9" L = 8 mm

A thin silicon chip and an 8-mm-thick aluminum substrate are separated by a 0.02-mm-thick epoxy joint. The chip and substrate are each 10 mm on a side, and their exposed surfaces are cooled by air, which is at a temperature of 25°C and provides a convection coefficient of 100 W/m²K. If the chip dissipates 104 W/m² under normal conditions, will it operate below a maximum allowable temperature of 85°C? Known: Dimensions, Heat dissipation, and maximum allowable temperature of a silicon chip. Thickness of aluminum substrate and epoxy joint. Convection conditions at exposed chip and substrate surfaces. Find: Whether maximum allowable temperature is exceeded. Assumption: Steady-state conditions, One-dimensional conduction (negligible heat transfer from sides of composite). Negligible chip thermal resistance (an isothermal chip), Constant properties. Negligible radiation exchange with surroundings. Properties: Table A.1, pure aluminum (T~350 K): k = 239 W/m K. Air Too = 25°C h = 100 W/m²K - Insulation Silicon chip +9 Epoxy joint (0.02 mm) " Aluminum substrate Air Too = 25°C h = 100 W/m²K -9" L = 8 mm

Elements Of Electromagnetics
Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
ChapterMA: Math Assessment
Section: Chapter Questions
Problem 1.1MA
See similar textbooks
icon
Related questions
Question
A thin silicon chip and an 8-mm-thick aluminum substrate are separated by a 0.02-mm-thick epoxy joint. The chip and substrate are each 10 mm on a side, and their exposed surfaces are cooled by air, which is at a temperature of 25°C and provides a convection coefficient of 100 W/m²K. If the chip dissipates 104 W/m² under normal conditions, will it operate below a maximum allowable temperature of 85°C? Known: Dimensions, Heat dissipation, and maximum allowable temperature of a silicon chip. Thickness of aluminum substrate and epoxy joint. Convection conditions at exposed chip and substrate surfaces. Find: Whether maximum allowable temperature is exceeded. Assumption: Steady-state conditions, One-dimensional conduction (negligible heat transfer from sides of composite). Negligible chip thermal resistance (an isothermal chip), Constant properties. Negligible radiation exchange with surroundings. Properties: Table A.1, pure aluminum (T~350 K): k = 239 W/m K. Air Too = 25°C h = 100 W/m²K - Insulation Silicon chip +9 Epoxy joint (0.02 mm) " Aluminum substrate Air Too = 25°C h = 100 W/m²K -9" L = 8 mm
Transcribed Image Text:A thin silicon chip and an 8-mm-thick aluminum substrate are separated by a 0.02-mm-thick epoxy joint. The chip and substrate are each 10 mm on a side, and their exposed surfaces are cooled by air, which is at a temperature of 25°C and provides a convection coefficient of 100 W/m²K. If the chip dissipates 104 W/m² under normal conditions, will it operate below a maximum allowable temperature of 85°C? Known: Dimensions, Heat dissipation, and maximum allowable temperature of a silicon chip. Thickness of aluminum substrate and epoxy joint. Convection conditions at exposed chip and substrate surfaces. Find: Whether maximum allowable temperature is exceeded. Assumption: Steady-state conditions, One-dimensional conduction (negligible heat transfer from sides of composite). Negligible chip thermal resistance (an isothermal chip), Constant properties. Negligible radiation exchange with surroundings. Properties: Table A.1, pure aluminum (T~350 K): k = 239 W/m K. Air Too = 25°C h = 100 W/m²K - Insulation Silicon chip +9 Epoxy joint (0.02 mm) " Aluminum substrate Air Too = 25°C h = 100 W/m²K -9" L = 8 mm
Expert Solution
steps

Step by step

Solved in 2 steps with 5 images

SEE SOLUTIONCheck out a sample Q&A here
Blurred answer
Similar questions
Recommended textbooks for you
Elements Of Electromagnetics
Elements Of Electromagnetics
Mechanical Engineering
ISBN:
9780190698614
Author:
Sadiku, Matthew N. O.
Publisher:
Oxford University Press
Mechanics of Materials (10th Edition)
Mechanics of Materials (10th Edition)
Mechanical Engineering
ISBN:
9780134319650
Author:
Russell C. Hibbeler
Publisher:
PEARSON
Thermodynamics: An Engineering Approach
Thermodynamics: An Engineering Approach
Mechanical Engineering
ISBN:
9781259822674
Author:
Yunus A. Cengel Dr., Michael A. Boles
Publisher:
McGraw-Hill Education
Control Systems Engineering
Control Systems Engineering
Mechanical Engineering
ISBN:
9781118170519
Author:
Norman S. Nise
Publisher:
WILEY
Mechanics of Materials (MindTap Course List)
Mechanics of Materials (MindTap Course List)
Mechanical Engineering
ISBN:
9781337093347
Author:
Barry J. Goodno, James M. Gere
Publisher:
Cengage Learning
Engineering Mechanics: Statics
Engineering Mechanics: Statics
Mechanical Engineering
ISBN:
9781118807330
Author:
James L. Meriam, L. G. Kraige, J. N. Bolton
Publisher:
WILEY
SEE MORE TEXTBOOKS