EBK MANUFACTURING ENGINEERING & TECHNOL
7th Edition
ISBN: 9780100793439
Author: KALPAKJIAN
Publisher: YUZU
expand_more
expand_more
format_list_bulleted
Concept explainers
Videos
Textbook Question
Chapter 29, Problem 28QTP
It is desired to produce a 500 μm by 500 μm diaphragm, 25 μm thick, in a silicon wafer 250 μm thick.
Given that you will use a wet etching technique, with KOH in water with an etch rate of 1 μm/min, calculate the etching time and the dimensions of the mask opening that you would use on a (100) silicon wafer.
Expert Solution & Answer
Want to see the full answer?
Check out a sample textbook solution
Students have asked these similar questions
Write in detail following terminologies according to wafer fabrication processes:
a. Diffusion and Ion Implantation
b. Metallization
c. Etching
Answer each of the following questions in one to three sentences. (a) What is lithography field? (b) What is misalignment in lithography? (e) What is selectivity in an etching process? (d) What is end-point detection in an etching process?
Chemical milling is used in an aircraft plant to create pockets in wing sections made of an aluminum alloy. The starting thickness of one workpart of interest is 20 mm. A series of rectangular-shaped pockets 12 mm deep are to be etched with dimensions 200 mm by 400 mm. The corners of each rectangle are radiused to 15 mm. The part is an aluminum alloy and the etchant is NaOH. Use Tables in your textbook to determine the penetration rate and etch factor for this combination. Determine (a) metal removal rate in mm3/min, (b) time required to etch to the specified depth, and (c) required dimensions of the opening in the cut and peel maskant to achieve the desired pocket size on the part.
Chapter 29 Solutions
EBK MANUFACTURING ENGINEERING & TECHNOL
Ch. 29 - Define MEMS, SIMPLE, SCREAM, and HEXSIL.Ch. 29 - Give three examples of common...Ch. 29 - Why is silicon often used with MEMS devices?Ch. 29 - Describe bulk and surface micromachining.Ch. 29 - What is the purpose of a spacer layer in...Ch. 29 - What is the main limitation to successful...Ch. 29 - What are common applications for MEMS andMEMS...Ch. 29 - Prob. 8RQCh. 29 - Prob. 9RQCh. 29 - Explain the differences between stereolithography...
Ch. 29 - What is MolTun? What are its main advantages?Ch. 29 - What is HEXSIL?Ch. 29 - What do SIMPLE and SCREAM stand for?Ch. 29 - Describe the difference between isotropic etching...Ch. 29 - Lithography produces projected shapes, so true...Ch. 29 - Which process or processes in this chapter allow...Ch. 29 - What is the difference between chemically reactive...Ch. 29 - The MEMS devices discussed in this chapter are...Ch. 29 - Explain how you would produce a spur gear if...Ch. 29 - Prob. 20QLPCh. 29 - Prob. 21QLPCh. 29 - Prob. 22QLPCh. 29 - Is there an advantage to using the MolTun process...Ch. 29 - The atomic-force microscope probe shown inFig....Ch. 29 - Estimate the natural frequency of the cantilever...Ch. 29 - Using data from Chapter 28, derive the time needed...Ch. 29 - It is desired to produce a 500 m by 500...Ch. 29 - If the Reynolds number for water flow through a...Ch. 29 - Prob. 30SDPCh. 29 - Prob. 31SDPCh. 29 - Prob. 32SDPCh. 29 - Design a micromachine or device that allows the...Ch. 29 - Conduct a literature search and determine the...Ch. 29 - Perform a literature search and write a...
Knowledge Booster
Learn more about
Need a deep-dive on the concept behind this application? Look no further. Learn more about this topic, mechanical-engineering and related others by exploring similar questions and additional content below.Similar questions
- ANSWER THE FOLLOWING : Name one factor PCB fabricators consider when etching a design. Explain thoroughly (include images if applicable)arrow_forwardDiscuss the importance of microchip manufacturing processes such as photolithography and etching in producing advanced microchips.arrow_forwardExplain the principles of thermal transfer printing and its applications in barcode label printing.arrow_forward
- Rj gandhiarrow_forward4. Poly-Si of the following structure is to be etched using a completely anisotropic dry-etch process, to remove poly-Si at a rate of 0.1 mm /min. However, this etching process has poor selectivities: selectivity to SiO₂ is 5; selectivity to photoresist is 2. (a) Sketch the cross-section after 5 minutes of etching. (b) Calculate the angle of the SiO₂ sidewalls after 5 minutes of etching. 0.lum oxide 1 um 0.7um Poly-Si I photoresist 0.5 umarrow_forwardIn the context of 3D printing, what is Fused Deposition Modeling (FDM), and how does it differ from Stereolithography (SLA)?arrow_forward
- What is bulk micromachining? For which MEMS applications is it used for and on what material(s)? Give examples of materials and techniques used to bulk-micromachine. Provide a process flow diagram of a fabrication process for a sample MEMS device that uses bulk micromachining techniquearrow_forwardplease show steps and fomulas so I can understand approacharrow_forwardSubject: manufacturing process Chemical milling is used in an aircraft plant to create pockets in wing sections made of an aluminum alloy. The starting thickness of a work part of interest is 25 mm. A series of rectangular-shaped pockets 15 mm deep are to be etched with dimensions 200 mm by 400 mm. The etchant is NaOH. Consult Table 25.2 for the penetration rate and etch factor. Determine a. Metal removal rate in mm3/min b. Time required to etch to the specified depth c. Required dimensions of the opening in the cut and peel maskant to achieve the desired pocket size on the partarrow_forward
arrow_back_ios
SEE MORE QUESTIONS
arrow_forward_ios
Recommended textbooks for you
Precision Machining Technology (MindTap Course Li...Mechanical EngineeringISBN:9781285444543Author:Peter J. Hoffman, Eric S. Hopewell, Brian JanesPublisher:Cengage Learning
Precision Machining Technology (MindTap Course Li...
Mechanical Engineering
ISBN:9781285444543
Author:Peter J. Hoffman, Eric S. Hopewell, Brian Janes
Publisher:Cengage Learning
What is Rapid Prototyping?; Author: Formlabs;https://www.youtube.com/watch?v=-TDn25K-Jh4;License: Standard youtube license