EBK MANUFACTURING ENGINEERING & TECHNOL
7th Edition
ISBN: 8220100793431
Author: KALPAKJIAN
Publisher: PEARSON
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Textbook Question
Chapter 28, Problem 22QLP
The table that follows describes three wafer-manufacturing changes: increasing the wafer diameter, reducing the chip size, and increasing process complexity. Complete the table by filling in “increase,” “decrease,” or “no change,” and indicate the effect that each change would have on the wafer yield and on the overall number of functional chips.
| Change | Wafer yield | Number of functional chips |
| Increase wafer diameter Reduce chip size Increase process complexity |
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In 4D printing, what is the fourth dimension?
A. Space
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D. Material
What inspired the team at the MIT self-assembly lab to conceive the Autonomous
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A. The natural growth of viruses
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A. Smart water pipes
B. Self-assembled structures
C. Ready-made electronic devices
D. Superior sound systems
What activating energies are used in the 4D products presented in the lesson?
A. Heat
B. Water
C. Microwave
D. Sound-waves
Q1 – Area vs Die/wafer – a) What is the area ratio between a 300mm and 200mm diameter wafer? (The 300mm diameter waferhas x.xx times the area of a 200mm).b) How many 15x15mm die can be completely printed on a 100mm, 200mm, and 300mm wafer? Showyour work. Do not include partial fields; you may assume no scribe lines or edge exclusion zone. Thereis no flat, only a notch for the 200mm and 300mm wafers. How many times more die can you getwhen going from 200 to 300mm wafers? How does this number compare to the area increasebetween 200 and 300mm? c) Now assume a 100um scribe line and a 3mm edge exclusion zone. How may die per wafer for 200mmand 300mm wafers? How did you calculate this – show your work. How does this compare to the arearatio? Is it the same? If not, why not?
Calculate the number of finished goods (output) or N for the manufacturing process illustrated in the next page.
Chapter 28 Solutions
EBK MANUFACTURING ENGINEERING & TECHNOL
Ch. 28 - Define the terms wafer, chip, die, device,...Ch. 28 - Why is silicon the semiconductor most used in...Ch. 28 - What do the abbreviations BJT, MOSFET, VLSI,...Ch. 28 - Prob. 4RQCh. 28 - Prob. 5RQCh. 28 - What are the purposes of prebaking and...Ch. 28 - Define selectivity and isotropy, and their...Ch. 28 - Prob. 8RQCh. 28 - Prob. 9RQCh. 28 - What are the levels of interconnection?
Ch. 28 - Which is cleaner, a Class-10 or a Class-1 clean...Ch. 28 - Prob. 12RQCh. 28 - What is a via? Why is it important?Ch. 28 - Describe how electrical connections are...Ch. 28 - Prob. 15RQCh. 28 - Prob. 16RQCh. 28 - Comment on your observations regarding the...Ch. 28 - Describe how n-type and p-type dopants differ.Ch. 28 - Prob. 19QLPCh. 28 - How is epitaxy different from other techniques...Ch. 28 - Note that, in a horizontal epitaxial reactor...Ch. 28 - The table that follows describes three...Ch. 28 - Prob. 23QLPCh. 28 - What is accelerated life testing? Why is it...Ch. 28 - Explain the difference between a die, a chip, anda...Ch. 28 - A common problem in ion implantation is...Ch. 28 - Examine the hole profiles shown in Fig. P28.27...Ch. 28 - Referring to Fig. 28.24, sketch the shape of the...Ch. 28 - Prob. 29QTPCh. 28 - Prob. 30QTPCh. 28 - Prob. 31QTPCh. 28 - A certain design rule calls for metal lines to be...Ch. 28 - Prob. 33QTPCh. 28 - If a square mask of side length 100 m is placed on...Ch. 28 - Obtain an expression for the width of the trench...Ch. 28 - Prob. 36SDPCh. 28 - Inspect various electronic and computer equipment,...Ch. 28 - Describe your understanding of the important...Ch. 28 - Make a survey of the necessity for clean rooms in...Ch. 28 - Prob. 40SDPCh. 28 - Prob. 41SDPCh. 28 - Estimate the time required to etch a spur gear...Ch. 28 - Prob. 43SDPCh. 28 - Review the specific devices, shown in Fig. V.2....
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