EBK MANUFACTURING ENGINEERING & TECHNOL
7th Edition
ISBN: 8220100793431
Author: KALPAKJIAN
Publisher: PEARSON
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Textbook Question
Chapter 28, Problem 2RQ
Why is silicon the semiconductor most used in IC technology?
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Example-1:
l
D
A uniform rotor of length 0.6 m and diameter 0.4 m is made of steel (density 7810 kg/m³)
is supported by identical short bearings of stiffness 1 MN/m in the horizontal and vertical
directions. If the distance between the bearings is 0.7 m, determine the natural frequencies
and plot whirl speed map.
Solution:
B
find the laplace transform for the
flowing function
2(1-e)
Ans. F(s)=-
S
12)
k
0
Ans. F(s)=
k
s(1+e)
0 a
2a 3a 4a
13)
2+
Ans. F(s)=
1
s(1+e")
3
14) f(t)=1, 0
Find the solution of the following Differential Equations
Using Laplace Transforms
1) 4y+2y=0.
y(0)=2.
y'(0)=0.
2) y+w²y=0,
(0)=A,
y'(0)=B.
3) +2y-8y 0.
y(0)=1.
y'(0)-8.
4)-2-3y=0,
y(0)=1.
y'(0)=7.
5) y-ky'=0,
y(0)=2,
y'(0)=k.
6) y+ky'-2k²y=0,
y(0)=2,
y'(0) = 2k.
7) '+4y=0,
y(0)=2.8
8) y+y=17 sin(21),
y(0)=-1.
9) y-y-6y=0,
y(0)=6,
y'(0)=13.
10) y=0.
y(0)=4,
y' (0)=0.
11) -4y+4y-0,
y(0)=2.1.
y'(0)=3.9
12) y+2y'+2y=0,
y(0)=1,
y'(0)=-3.
13) +7y+12y=21e".
y(0)=3.5.
y'(0)=-10.
14) "+9y=10e".
y(0)=0,
y'(0)=0.
15) +3y+2.25y=91' +64.
y(0)=1.
y'(0) = 31.5
16)
-6y+5y-29 cos(2t).
y(0)=3.2,
y'(0)=6.2
17) y+2y+2y=0,
y(0)=0.
y'(0)=1.
18) y+2y+17y=0,
y(0)=0.
y'(0)=12.
19) y"-4y+5y=0,
y(0)=1,
y'(0)=2.
20) 9y-6y+y=0,
(0)-3,
y'(0)=1.
21) -2y+10y=0,
y(0)=3,
y'(0)=3.
22) 4y-4y+37y=0,
y(0)=3.
y'(0)=1.5
23) 4y-8y+5y=0,
y(0)=0,
y'(0)=1.
24)
++1.25y-0,
y(0)=1,
y'(0)=-0.5
25) y 2 cos(r).
y(0)=2.
y'(0) = 0.
26)
-4y+3y-0,
y(0)=3,
y(0) 7.
27) y+2y+y=e
y(0)=0.
y'(0)=0.
28) y+2y-3y=10sinh(27),
y(0)=0.
y'(0)=4.
29)…
Chapter 28 Solutions
EBK MANUFACTURING ENGINEERING & TECHNOL
Ch. 28 - Define the terms wafer, chip, die, device,...Ch. 28 - Why is silicon the semiconductor most used in...Ch. 28 - What do the abbreviations BJT, MOSFET, VLSI,...Ch. 28 - Prob. 4RQCh. 28 - Prob. 5RQCh. 28 - What are the purposes of prebaking and...Ch. 28 - Define selectivity and isotropy, and their...Ch. 28 - Prob. 8RQCh. 28 - Prob. 9RQCh. 28 - What are the levels of interconnection?
Ch. 28 - Which is cleaner, a Class-10 or a Class-1 clean...Ch. 28 - Prob. 12RQCh. 28 - What is a via? Why is it important?Ch. 28 - Describe how electrical connections are...Ch. 28 - Prob. 15RQCh. 28 - Prob. 16RQCh. 28 - Comment on your observations regarding the...Ch. 28 - Describe how n-type and p-type dopants differ.Ch. 28 - Prob. 19QLPCh. 28 - How is epitaxy different from other techniques...Ch. 28 - Note that, in a horizontal epitaxial reactor...Ch. 28 - The table that follows describes three...Ch. 28 - Prob. 23QLPCh. 28 - What is accelerated life testing? Why is it...Ch. 28 - Explain the difference between a die, a chip, anda...Ch. 28 - A common problem in ion implantation is...Ch. 28 - Examine the hole profiles shown in Fig. P28.27...Ch. 28 - Referring to Fig. 28.24, sketch the shape of the...Ch. 28 - Prob. 29QTPCh. 28 - Prob. 30QTPCh. 28 - Prob. 31QTPCh. 28 - A certain design rule calls for metal lines to be...Ch. 28 - Prob. 33QTPCh. 28 - If a square mask of side length 100 m is placed on...Ch. 28 - Obtain an expression for the width of the trench...Ch. 28 - Prob. 36SDPCh. 28 - Inspect various electronic and computer equipment,...Ch. 28 - Describe your understanding of the important...Ch. 28 - Make a survey of the necessity for clean rooms in...Ch. 28 - Prob. 40SDPCh. 28 - Prob. 41SDPCh. 28 - Estimate the time required to etch a spur gear...Ch. 28 - Prob. 43SDPCh. 28 - Review the specific devices, shown in Fig. V.2....
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