EBK MANUFACTURING ENGINEERING & TECHNOL
7th Edition
ISBN: 8220100793431
Author: KALPAKJIAN
Publisher: PEARSON
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Chapter 28, Problem 33QTP
To determine
Using Fig. 28.20, obtain a mathematical expressions for the etch rate as a function of temperature.
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Explain the concept of microchip fabrication technology nodes and their impact on chip performance and power efficiency.
Chemical milling is used in an aircraft plant to create pockets in wing sections made of an aluminum alloy. The starting thickness of one workpart of interest is 20 mm. A series of rectangular-shaped pockets 12 mm deep are to be etched with dimensions 200 mm by 400 mm. The corners of each rectangle are radiused to 15 mm. The part is an aluminum alloy and the etchant is NaOH. Use Tables in your textbook to determine the penetration rate and etch factor for this combination. Determine (a) metal removal rate in mm3/min, (b) time required to etch to the specified depth, and (c) required dimensions of the opening in the cut and peel maskant to achieve the desired pocket size on the part.
Describe the process of microchip manufacturing, including the use of photolithography and semiconductor materials.
Chapter 28 Solutions
EBK MANUFACTURING ENGINEERING & TECHNOL
Ch. 28 - Define the terms wafer, chip, die, device,...Ch. 28 - Why is silicon the semiconductor most used in...Ch. 28 - What do the abbreviations BJT, MOSFET, VLSI,...Ch. 28 - Prob. 4RQCh. 28 - Prob. 5RQCh. 28 - What are the purposes of prebaking and...Ch. 28 - Define selectivity and isotropy, and their...Ch. 28 - Prob. 8RQCh. 28 - Prob. 9RQCh. 28 - What are the levels of interconnection?
Ch. 28 - Which is cleaner, a Class-10 or a Class-1 clean...Ch. 28 - Prob. 12RQCh. 28 - What is a via? Why is it important?Ch. 28 - Describe how electrical connections are...Ch. 28 - Prob. 15RQCh. 28 - Prob. 16RQCh. 28 - Comment on your observations regarding the...Ch. 28 - Describe how n-type and p-type dopants differ.Ch. 28 - Prob. 19QLPCh. 28 - How is epitaxy different from other techniques...Ch. 28 - Note that, in a horizontal epitaxial reactor...Ch. 28 - The table that follows describes three...Ch. 28 - Prob. 23QLPCh. 28 - What is accelerated life testing? Why is it...Ch. 28 - Explain the difference between a die, a chip, anda...Ch. 28 - A common problem in ion implantation is...Ch. 28 - Examine the hole profiles shown in Fig. P28.27...Ch. 28 - Referring to Fig. 28.24, sketch the shape of the...Ch. 28 - Prob. 29QTPCh. 28 - Prob. 30QTPCh. 28 - Prob. 31QTPCh. 28 - A certain design rule calls for metal lines to be...Ch. 28 - Prob. 33QTPCh. 28 - If a square mask of side length 100 m is placed on...Ch. 28 - Obtain an expression for the width of the trench...Ch. 28 - Prob. 36SDPCh. 28 - Inspect various electronic and computer equipment,...Ch. 28 - Describe your understanding of the important...Ch. 28 - Make a survey of the necessity for clean rooms in...Ch. 28 - Prob. 40SDPCh. 28 - Prob. 41SDPCh. 28 - Estimate the time required to etch a spur gear...Ch. 28 - Prob. 43SDPCh. 28 - Review the specific devices, shown in Fig. V.2....
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- Discuss the evolution of microchip technology over the years, including advancements in miniaturization and performance.arrow_forwardANSWER THE FOLLOWING : Name one factor PCB fabricators consider when etching a design. Explain thoroughly (include images if applicable)arrow_forwardDescribe the principles behind 3D printing technology and its emerging applications in various industries.arrow_forward
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- 2. Explain with neat sketch of “Etching” the surface finishing process.( Minimum 1 and half pages including diagram.)arrow_forwardExplore the concept of 4D printing and its potential applications in various industries.arrow_forwardFor a given 40 cm diameter wafer, and a die that is 1.5 cm x 2 cm, determine the cost of a die. Wafer cost is $5800, wafer yield is 100%, and defects per unit area is 0.09/sq. cm.arrow_forward
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