Manufacturing Engineering & Technology
Manufacturing Engineering & Technology
7th Edition
ISBN: 9780133128741
Author: Serope Kalpakjian, Steven Schmid
Publisher: Prentice Hall
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Chapter 3, Problem 29QTP

It can be shown that thermal distortion in precision devices is low for high values of thermal conductivity divided by the thermal expansion coefficient. Rank the materials in Table 3.1 according to their ability to resist thermal distortion.

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Describe the physical properties of the materials (permeability, capillarity and thermal conductivity) and explain how these properties are determined.
1) Draw (using a normal graph paper) a conventional stress-strain diagram for ANY metallic material (e.g. steel, aluminium, copper, brass, iron, tungsten). The diagram should be as accurate as possible using a suitable scale (e.g. 1cm: 10 N). 2) Calculate the Modulus of Elasticity, Modulus of Toughness and Modulus of Resilience for the material from the stress-strain diagram. Show your calculations in detail on a separate A4 piece of paper.
Provide a concise explanation on how materials can exhibit high thermal conductivity but have low electrical conductivity.

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