24.7 Skills for applying the wave model of light * BIO Ability of a bat to detect small objects Bats emit ultrasound in order to detect prey. Ultrasound has a much smaller wavelength than sound, which improves the resolution of small objects. What is the diameter of the smallest object that forms a diffraction pattern when irradiated by the 8 .0 × 10 4 -Hz ultrasound from a bat? The first diffraction minimum from the smallest object that still produces diffraction forms at 90 ° with respect to the direction of the incident waves.
24.7 Skills for applying the wave model of light * BIO Ability of a bat to detect small objects Bats emit ultrasound in order to detect prey. Ultrasound has a much smaller wavelength than sound, which improves the resolution of small objects. What is the diameter of the smallest object that forms a diffraction pattern when irradiated by the 8 .0 × 10 4 -Hz ultrasound from a bat? The first diffraction minimum from the smallest object that still produces diffraction forms at 90 ° with respect to the direction of the incident waves.
* BIO Ability of a bat to detect small objects Bats emit ultrasound in order to detect prey. Ultrasound has a much smaller wavelength than sound, which improves the resolution of small objects. What is the diameter of the smallest object that forms a diffraction pattern when irradiated by the
8
.0 × 10
4
-Hz
ultrasound from a bat? The first diffraction minimum from the smallest object that still produces diffraction forms at
90
°
with respect to the direction of the incident waves.
You want to fabricate a soft microfluidic chip like the one below. How would you go about
fabricating this chip knowing that you are targeting a channel with a square cross-sectional
profile of 200 μm by 200 μm. What materials and steps would you use and why? Disregard the
process to form the inlet and outlet.
Square Cross Section
1. What are the key steps involved in the fabrication of a semiconductor device.
2. You are hired by a chip manufacturing company, and you are asked to prepare a silicon wafer
with the pattern below. Describe the process you would use.
High Aspect
Ratio
Trenches
Undoped Si Wafer
P-doped Si
3. You would like to deposit material within a high aspect ratio trench. What approach would you
use and why?
4. A person is setting up a small clean room space to carry out an outreach activity to educate high
school students about patterning using photolithography. They obtained a positive photoresist, a
used spin coater, a high energy light lamp for exposure and ordered a plastic transparency mask
with a pattern on it to reduce cost. Upon trying this set up multiple times they find that the full
resist gets developed, and they are unable to transfer the pattern onto the resist. Help them
troubleshoot and find out why pattern of transfer has not been successful.
5. You are given a composite…
Two complex values are z1=8 + 8i, z2=15 + 7 i. z1∗ and z2∗ are the complex conjugate values.
Any complex value can be expessed in the form of a+bi=reiθ. Find r and θ for (z1-z∗2)/z1+z2∗. Find r and θ for (z1−z2∗)z1z2∗ Please show all steps
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