Given: An electrical device is insulated on all sides except for one face. The face is bonded to a 4mm-thich aluminum plate, which is cooled by air. heat sink → Cross-sectional area = 1m² → Electrical device dissipates heat at 10th W/m². → The resistance of the joint between the device and the aluminum plate is 05x10+ m²-k/w - → The thermal conductivity of aluminum is 238 Whirk. → Too of air t3 278 k and the convective heat transfer coefficient between aluminum and 100 W/m².K. air What is the temperature at the device surface?
Given: An electrical device is insulated on all sides except for one face. The face is bonded to a 4mm-thich aluminum plate, which is cooled by air. heat sink → Cross-sectional area = 1m² → Electrical device dissipates heat at 10th W/m². → The resistance of the joint between the device and the aluminum plate is 05x10+ m²-k/w - → The thermal conductivity of aluminum is 238 Whirk. → Too of air t3 278 k and the convective heat transfer coefficient between aluminum and 100 W/m².K. air What is the temperature at the device surface?
Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
ChapterMA: Math Assessment
Section: Chapter Questions
Problem 1.1MA
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Step 1
Given data:
Cross-sectional area of the device: A = 1 m2
Heat flux from the device: q = 104 W/m2
Thermal resistance of the joint between the device and the aluminum plate: Rj = 0.510-4 m2.K/W
Thermal conductivity of the aluminum plate: k = 238 W/m.K
Thickness of the aluminum plate: L = 4 mm = 0.004 m
Convective heat transfer coefficient between the aluminum plate and air: h = 100 W/m2.K
Surrounding air temperature: Tair = 278 K
To find;
Device surface temperature?
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