Given: An electrical device is insulated on all sides except for one face. The face is bonded to a 4mm-thich aluminum plate, which is cooled by air. heat sink → Cross-sectional area = 1m² → Electrical device dissipates heat at 10th W/m². → The resistance of the joint between the device and the aluminum plate is 05x10+ m²-k/w - → The thermal conductivity of aluminum is 238 Whirk. → Too of air t3 278 k and the convective heat transfer coefficient between aluminum and 100 W/m².K. air What is the temperature at the device surface?

Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
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Page < 7
Given: An electrical device is insulated on all sides.
except for one face. The face is bonded to a 4 mm-thick
aluminum plate, which is cooled by air.
heat sink
→ Cross-Sectional area = Im
→ Electrical device dissipates heat at 104 W/m².
→ The resistance of the joint between the device
and the aluminum plate is 05x10²4 mok/w.
→ The thermal conductivity of aluminum ts 238 Works.
→ Too of air 3 278 k and the convective heat
transfer coefficient between aluminum and
100 W/m.k.
air
What is the temperature at the device surface?
0" = 10² W/m²*
A=1m²
Ts=?
Q Search
L= 4mm
= aoot m
k=238 W/mK
q=0
Too = 278 k
h = 100 W/m²
Thermal Contact
resistance R = 0.5x10 m² K/W.
99+
Transcribed Image Text:Page < 7 Given: An electrical device is insulated on all sides. except for one face. The face is bonded to a 4 mm-thick aluminum plate, which is cooled by air. heat sink → Cross-Sectional area = Im → Electrical device dissipates heat at 104 W/m². → The resistance of the joint between the device and the aluminum plate is 05x10²4 mok/w. → The thermal conductivity of aluminum ts 238 Works. → Too of air 3 278 k and the convective heat transfer coefficient between aluminum and 100 W/m.k. air What is the temperature at the device surface? 0" = 10² W/m²* A=1m² Ts=? Q Search L= 4mm = aoot m k=238 W/mK q=0 Too = 278 k h = 100 W/m² Thermal Contact resistance R = 0.5x10 m² K/W. 99+
Expert Solution
Step 1

Given data:

Cross-sectional area of the device: A = 1 m2

Heat flux from the device: q = 104 W/m2

Thermal resistance of the joint between the device and the aluminum plate: Rj = 0.5×10-4 m2.K/W

Thermal conductivity of the aluminum plate: k = 238 W/m.K

Thickness of the aluminum plate: L = 4 mm = 0.004 m

Convective heat transfer coefficient between the aluminum plate and air: h = 100 W/m2.K

Surrounding air temperature: Tair = 278 K

 

To find;

Device surface temperature?

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