6. The heat generated in the circuitry on the surface of a silicon chip is conducted to the ceramic substrate to which it is attached. The chip dissipates 5 W of power. Determine the temperature difference between front and back of the silicon chip if it has thermal conductivity of 130 W/mK. Silicon chip ---6mm Ceramic substrate 5 W 0.5 mm

Elements Of Electromagnetics
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ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
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6. The heat generated in the circuitry on the surface of a silicon chip is conducted to the ceramic substrate
to which it is attached. The chip dissipates 5 W of power. Determine the temperature difference between front and back of the
silicon chip if it has thermal conductivity of 130 W/mK.
Silicon
chip
5 W]
---6mm---
Ceramic
substrate
0.5 mm
Transcribed Image Text:6. The heat generated in the circuitry on the surface of a silicon chip is conducted to the ceramic substrate to which it is attached. The chip dissipates 5 W of power. Determine the temperature difference between front and back of the silicon chip if it has thermal conductivity of 130 W/mK. Silicon chip 5 W] ---6mm--- Ceramic substrate 0.5 mm
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