6. The heat generated in the circuitry on the surface of a silicon chip is conducted to the ceramic substrate to which it is attached. The chip dissipates 5 W of power. Determine the temperature difference between front and back of the silicon chip if it has thermal conductivity of 130 W/mK. Silicon chip ---6mm Ceramic substrate 5 W 0.5 mm

6. The heat generated in the circuitry on the surface of a silicon chip is conducted to the ceramic substrate to which it is attached. The chip dissipates 5 W of power. Determine the temperature difference between front and back of the silicon chip if it has thermal conductivity of 130 W/mK. Silicon chip ---6mm Ceramic substrate 5 W 0.5 mm

Elements Of Electromagnetics

7th Edition

ISBN:9780190698614

Author:Sadiku, Matthew N. O.

Publisher:Sadiku, Matthew N. O.

ChapterMA: Math Assessment

Section: Chapter Questions

Problem 1.1MA

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Concept explainers

Conduction and Convection

When energy travels from one object to another it is said to have undergone heat transfer. Heat transfer is nothing but the transfer of thermal energy or internal energy from one thing to another, like e.g., when a vessel with water, kept on top of a burner, heats up because of the flame underneath it.

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Please solve and answer the question correctly please. Thank you!!

6. The heat generated in the circuitry on the surface of a silicon chip is conducted to the ceramic substrate
to which it is attached. The chip dissipates 5 W of power. Determine the temperature difference between front and back of the
silicon chip if it has thermal conductivity of 130 W/mK.
Silicon
chip
5 W]
---6mm---
Ceramic
substrate
0.5 mm

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