An electronic component, 65 mm×65 mm, in steady state operation reaches the base temperature of 100°C. To help dissipate heat 10 rectangular fins (2mm-thick, 10- mm long, k=70 W/mK) are to be soldered to the chip as shown in the figure below. The ambient temperature and convection heat transfer coefficients are given as 20°C and 50 W/m²K, respectively. Assuming radiation losses and the heat transfer from the back side of the circuit board are negligible, and the temperature of the surrounding surfaces to be the same as the air temperature of the room. (a) Calculate the heat transfer from the electronic component without the fins, (b) Calculate the heat transfer with the fins, (c) Do you recommend the use of this fin configuration? 2mm | 10mm 65mm 65mm T

An electronic component, 65 mm×65 mm, in steady state operation reaches the base temperature of 100°C. To help dissipate heat 10 rectangular fins (2mm-thick, 10- mm long, k=70 W/mK) are to be soldered to the chip as shown in the figure below. The ambient temperature and convection heat transfer coefficients are given as 20°C and 50 W/m²K, respectively. Assuming radiation losses and the heat transfer from the back side of the circuit board are negligible, and the temperature of the surrounding surfaces to be the same as the air temperature of the room. (a) Calculate the heat transfer from the electronic component without the fins, (b) Calculate the heat transfer with the fins, (c) Do you recommend the use of this fin configuration? 2mm | 10mm 65mm 65mm T

Elements Of Electromagnetics

7th Edition

ISBN:9780190698614

Author:Sadiku, Matthew N. O.

Publisher:Sadiku, Matthew N. O.

ChapterMA: Math Assessment

Section: Chapter Questions

Problem 1.1MA

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Question

An electronic component, 65 mmx65 mm, in steady state operation reaches the base
temperature of 100°C. To help dissipate heat 10 rectangular fins (2mm-thick, 10-
mm long, k=70 W/mK) are to be soldered to the chip as shown in the figure below.
The ambient temperature and convection heat transfer coefficients are given as 20°C
and 50 W/m2K, respectively. Assuming radiation losses and the heat transfer from
the back side of the circuit board are negligible, and the temperature of the
surrounding surfaces to be the same as the air temperature of the room. (a) Calculate
the heat transfer from the electronic component without the fins, (b) Calculate the
heat transfer with the fins, (c) Do you recommend the use of this fin configuration?
2mm
T,h
10mm
65mm
65mm
T

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