A very thin silicon chip is bonded to a 6-mm thick aluminum substrate by a 0.02-mm thick epoxy glue. Both surfaces of this chip-aluminum system are cooled by air at 250C, where the convective heat transfer coefficient of air flow is 100 W/(m² K). If the heat dissipation per unit area from the chip is 104 W/m2 under steady state condition, draw the thermal circuit for the system and determine the operating temperature of the chip.
A very thin silicon chip is bonded to a 6-mm thick aluminum substrate by a 0.02-mm thick epoxy glue. Both surfaces of this chip-aluminum system are cooled by air at 250C, where the convective heat transfer coefficient of air flow is 100 W/(m² K). If the heat dissipation per unit area from the chip is 104 W/m2 under steady state condition, draw the thermal circuit for the system and determine the operating temperature of the chip.
Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
ChapterMA: Math Assessment
Section: Chapter Questions
Problem 1.1MA
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Transcribed Image Text:A very thin silicon chip is bonded to a 6-mm thick aluminum substrate by a 0.02-mm thick
epoxy glue. Both surfaces of this chip-aluminum system are cooled by air at 250C, where the
convective heat transfer coefficient of air flow is 100 W/(m² K). If the heat dissipation per
unit area from the chip is 104 W/m2 under steady state condition, draw the thermal circuit
for the system and determine the operating temperature of the chip.
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