Multi-Layer Set 1 Lab 1

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Southern New Hampshire University *

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Course

457

Subject

Mechanical Engineering

Date

Apr 3, 2024

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pdf

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1

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ECE 457 Multilayer Project, Set 1, Lab 1 Pre- and Post-Lab Questions Pre-lab questions (15 marks) 1) Using simple 2D cross-section diagrams, draw a detailed process flow showing the steps involved in this session of the project. Show all layers (not necessarily to scale) and clearly label what is going on in each step. (10 marks) 2) Your wafers for this lab come pre-cleaned. How is this done? Describe how the cleaning solution is prepared, how long it takes and what contaminants are removed. What are the chemical hazards of this solution? How could you treat exposure to the chemicals? (5 marks) Post-lab questions (25 marks) 1) What is meant by “overexposure” and “underexposure”, how does this directly apply to our desired features? (5 marks) 2) The ABM mask aligner you used has three vacuums. Briefly name and describe each of the three vacuums and their purpose in the exposure process. If one of these vacuums was not used, what impact might that have on the exposure and any further processing? (7 marks) 3) Using your results from the Alphastep profilometer, determine the aluminum thickness and the aluminum etch rate. Why did the aluminum etch at different rates at different positions on the wafer? (6 marks) 4) The lab manual mentions one method used to form an oxide on a silicon wafer, while the Lab # 1 procedure mentions another method. Identify and briefly describe both methods. What is an advantage and disadvantage of each method? (7 marks)
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